-
公开(公告)号：KR1020130033675A
公开(公告)日：2013-04-04
申请号：KR1020110097493
申请日：2011-09-27
Applicant: 자화전자(주)
CPC classification number: H01L2224/48091 , H01L2924/00014
Abstract: PURPOSE: A heat radiation printed circuit board, a semiconductor lighting device, and a display device are provided to improve heat radiation properties and to reduce the total thickness of the heat radiation printed circuit board by arranging a semiconductor light source in an opening part of a heat radiation base substrate. CONSTITUTION: A heat radiation base substrate(210) is made of thermally conductive materials. A reflection layer(220) reflects incident light from a semiconductor light source(240). A printed circuit board(230) includes an insulation layer(232), a circuit layer(234) laminated on the insulation layer, and an opening part(236) which passes through the insulation layer and the circuit layer. The semiconductor light source is mounted on the upper side of the reflection layer and is electrically connected to the circuit layer by a wire bonding.
Abstract translation: 目的：提供一种散热印刷电路板，半导体照明装置和显示装置，以通过将半导体光源布置在一个开口部分中来提高散热性能并减小热辐射印刷电路板的总厚度 散热基底。 构成：散热基底（210）由导热材料制成。 反射层（220）反射来自半导体光源（240）的入射光。 印刷电路板（230）包括绝缘层（232），层叠在绝缘层上的电路层（234）和穿过绝缘层和电路层的开口部分（236）。 半导体光源安装在反射层的上侧，并通过引线接合电连接到电路层。
-
公开(公告)号：KR100882606B1
公开(公告)日：2009-02-12
申请号：KR1020070011159
申请日：2007-02-02
Applicant: 자화전자(주)
IPC: G06F1/20
Abstract: 본 발명은 열 확산기에 관한 것으로, 특히 에어(air) 배출구를 가지는 열 확산기에 관한 것으로,
흑연시트에 형성되는 홀(hole)의 에지(edge)와 시트 외곽 에지에 에어 배출구를 형성함으로서, 에지(edge) 부분의 실링(sealing)을 위한 별도의 열 프로세스 공정이 필요 없음은 물론, 에어 갭 내부의 에어 팽창으로 인한 박리 현상을 제거함으로서, 생산 공정의 신속을 기할 수 있는 동시에 제품의 신뢰성을 높일 수 있는 효과가 있다.
흑연시트, 열 확산, 에어 갭.-
Patent Agency Ranking
公开(公告)号：KR1020080018035A
公开(公告)日：2008-02-27
申请号：KR1020060080086
申请日：2006-08-23
Applicant: 자화전자(주)
CPC classification number: F21V29/503 , H05K1/021 , H05K7/20409 , H05K2201/066
Abstract: A board for electronic parts and a lighting unit including the board and an electronic device including the lighting unit are provided to maximize heat dissipation efficiency by adding a new heat dissipation unit. A graphite sheet(18) diffuses heat. A printed circuit board(14) is stacked on the graphite sheet, and has a through-hole(20) at the position where electronic parts corresponding to heat sources are mounted. Thermal conductive materials(12) are located in the through-hole and transfer heat to the graphite sheet by contacting with the heat sources. An insulator(16) is formed between the thermal conductive members and the graphite sheet.
Abstract translation: 提供一种用于电子部件的电子板和包括该板的照明单元和包括该照明单元的电子设备，以通过添加新的散热单元来最大限度地提高散热效率。 石墨片（18）散热。 印刷电路板（14）堆叠在石墨片上，并且在安装对应于热源的电子部件的位置处具有通孔（20）。 导热材料（12）位于通孔中，通过与热源接触将热量传递给石墨片。 在导热构件和石墨片之间形成绝缘体（16）。
-
公开(公告)号：KR1020080072416A
公开(公告)日：2008-08-06
申请号：KR1020070011159
申请日：2007-02-02
Applicant: 자화전자(주)
IPC: G06F1/20
Abstract: A heat diffuser and an electronic device having the heat diffuser are provided to form an air outlet in a film placed on an air gap to exhaust air from the air gap so as to prevent sealed films from being separated from each other. A heat diffuser includes a graphite sheet(10) and films(12) respectively attached to both sides of the graphite sheet through an adhesive(16). The adhesive is formed on one side of each of the films. The films have a size larger than the graphite sheet and are sealed up through a laminating process. At least one air outlet(18) is formed in the films and located corresponding to an air gap(AG) formed at the sealed portion of the films.
Abstract translation: 设置有热扩散器和具有散热器的电子设备，以在放置在气隙上的膜中形成空气出口，以从气隙排出空气，以防止密封膜彼此分离。 散热器包括通过粘合剂（16）分别附着在石墨片的两侧的石墨片（10）和膜（12）。 粘合剂形成在每个膜的一侧上。 膜的尺寸大于石墨片，并通过层压工艺密封。 在膜中形成至少一个空气出口（18），并且对应于形成在膜的密封部分处的气隙（AG）。
-
公开(公告)号：KR101014418B1
公开(公告)日：2011-02-15
申请号：KR1020060080086
申请日：2006-08-23
Applicant: 자화전자(주)
Abstract: 본 발명은 전자부품용 기판 및 이를 포함하는 조명 유닛에 관한 것으로, 특히 엘이디(LED:Light Emitting Diode)와 같은 전자부품에서 발생되는 열을 효율적으로 확산시켜 방열하고자 하는 기술에 관련된 것으로, 상기 전자부품용 기판은:
열을 확산시키는 그라파이트 시트와; 상기 그라파이트 시트상에 적층되되, 각 전자부품에 전기신호를 공급하기 위한 패턴과 각 전자부품이 장착되는 위치에 관통 홀들이 형성되어 있는 인쇄회로기판과; 상기 관통 홀내에 위치하여 일측 끝단이 상기 인쇄회로기판상에 위치하는 전자부품에 접촉되어 상기 그라파이트 시트로 열을 전도하는 열 전도성 부재들과; 상기 열 전도성 부재들과 그라파이트 시트 사이에 부도체층;을 포함함을 특징으로 한다.
그라파이트 시트, 엘이디 기판, 조명 유닛.-
公开(公告)号：KR1020130048408A
公开(公告)日：2013-05-10
申请号：KR1020110113246
申请日：2011-11-02
Applicant: 자화전자(주)
IPC: H05K1/02 , H01L33/64 , G02F1/13357 , H05K7/20
CPC classification number: H01L2224/48091 , H01L2924/00014
Abstract: PURPOSE: Heat dissipation printed circuit board, semiconductor illumination device and display device are provided to improve heat dissipation property by reducing internal temperature deviation. CONSTITUTION: A heat dissipation base substrate(110) is made of thermal conductive polymer. The substrate mounts a heating element in an upper end. A circuit layer is laminated on an insulation layer. A printed circuit board(120) has an aperture. The aperture penetrates into the insulation layer and circuit layer.
Abstract translation: 目的：提供散热印刷电路板，半导体照明装置和显示装置，通过减少内部温度偏差来提高散热性能。 构成：散热基板（110）由导热聚合物制成。 基板在上端安装加热元件。 电路层层叠在绝缘层上。 印刷电路板（120）具有孔径。 孔径穿透绝缘层和电路层。
-
公开(公告)号：KR1020130015744A
公开(公告)日：2013-02-14
申请号：KR1020110077920
申请日：2011-08-04
Applicant: 자화전자(주)
IPC: H05K7/20 , F21V29/00 , H01L33/64 , G02F1/13357
CPC classification number: H01L2224/48091 , H01L2924/00014
Abstract: PURPOSE: A heat radiation printed circuit board, semiconductor lighting device and display device are provided to decrease internal temperature by effectively managing generated from a semiconductor light source. CONSTITUTION: A heat radiation base substrate(110) is made of a thermal conductive material. The heat radiation base substrate includes a base unit(112) and a protrusion unit(114). A heat radiator is mounted on the upper end of the protrusion unit. A printed circuit board(120) includes an insulation layer(122), a circuit layer(124) and an opening(126). The circuit layer is laminated on the insulation layer. The opening penetrates through the insulation layer and the circuit layer.
Abstract translation: 目的：提供一种散热印刷电路板，半导体照明装置和显示装置，通过从半导体光源产生的有效管理来降低内部温度。 构成：散热基底（110）由导热材料制成。 散热基底基板包括基座单元（112）和突出单元（114）。 散热器安装在突出单元的上端。 印刷电路板（120）包括绝缘层（122），电路层（124）和开口（126）。 电路层层叠在绝缘层上。 开口穿过绝缘层和电路层。
-
-
-
-
-
-
Search Results
7
records
(took 0.019 seconds)
