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公开(公告)号：KR101679701B1
公开(公告)日：2016-11-28
申请号：KR1020140187788
申请日：2014-12-24
Applicant: 전자부품연구원
Inventor： 이재영
IPC: H04B1/04
Abstract: 분배기와감쇠기기반의파워모듈레이션방법및 이를적용한기지국이제공된다. 본발명의실시예에따른송신장치는, 송신신호를분배하는분배기와분배기에서분배된송신신호들의파워들을가변저항소자로가변시키는감쇠기들을포함한다. 이에의해, 리액턴스를배제시킨파워모듈레이션이가능하여, 리액턴스에의한반사신호발생및 그로인한입력신호변형의문제를방지할수 있게된다.
Abstract translation: 本发明提供一种基于分配器和衰减器的功率调制方法以及应用该功率调制方法的基站。 根据本发明的实施例，发送装置包括：分发发送信号的分配器; 以及衰减器，其将从分配器分配的传输信号的功率改变为可变电阻器件。 因此，发送装置能够实现除电抗之外的功率调制，防止由于电抗引起的反射信号和由此导致的输入信号变化的问题。
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公开(公告)号：KR1020160078542A
公开(公告)日：2016-07-05
申请号：KR1020140187788
申请日：2014-12-24
Applicant: 전자부품연구원
Inventor： 이재영
IPC: H04B1/04
CPC classification number: H04B1/0458 , H04B1/0475 , H04B1/0483
Abstract: 분배기와감쇠기기반의파워모듈레이션방법및 이를적용한기지국이제공된다. 본발명의실시예에따른송신장치는, 송신신호를분배하는분배기와분배기에서분배된송신신호들의파워들을가변저항소자로가변시키는감쇠기들을포함한다. 이에의해, 리액턴스를배제시킨파워모듈레이션이가능하여, 리액턴스에의한반사신호발생및 그로인한입력신호변형의문제를방지할수 있게된다.
Abstract translation: 本发明提供一种基于分配器和衰减器的功率调制方法以及应用该功率调制方法的基站。 根据本发明的实施例，发送装置包括：分发发送信号的分配器; 以及衰减器，其将从分配器分配的传输信号的功率改变为可变电阻器件。 因此，发送装置能够实现除电抗之外的功率调制，防止由于电抗引起的反射信号和由此导致的输入信号变化的问题。
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公开(公告)号：KR1020140081111A
公开(公告)日：2014-07-01
申请号：KR1020120150497
申请日：2012-12-21
Applicant: 전자부품연구원
Inventor： 이재영
IPC: H04B1/48
CPC classification number: H04B1/50 , H03H7/0115 , H04B1/0057
Abstract: Provided is a duplexer using a diplexer and a matching circuit. The duplexer according to an embodiment of the present invention includes a diplexer that delivers a transmission signal which is received from a transmitting end to an antenna and delivers a reception signal which is received from the antenna to a receiving end; and a receiving end matching circuit that is provided between the receiving end and the diplexer and attenuates outband of the reception signal. According to the present invention, the duplexer can be improved in attenuation characteristics and can be compact in size, and duplexer loss can be decreased.
Abstract translation: 提供了使用双工器和匹配电路的双工器。 根据本发明实施例的双工器包括：双工器，其将从发送端接收的发送信号传送到天线，并将从天线接收的接收信号传送到接收端; 以及设置在接收端和双工器之间的接收端匹配电路，并且衰减接收信号的带外。 根据本发明，可以提高双工器的衰减特性，并且可以在尺寸上紧凑，并且可以减少双工器损耗。
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公开(公告)号：KR101350459B1
公开(公告)日：2014-01-10
申请号：KR1020110145769
申请日：2011-12-29
Applicant: 전자부품연구원
IPC: H04B1/44
Abstract: 듀플렉서 및 이를 이용한 통신기기가 제공된다. 본 발명의 실시예에 따른 듀플렉서는, 송신 신호를 필터링하는 제1 필터, 수신 신호를 필터링하는 제2 필터 및 제1 필터에서 출력되는 송신 신호를 안테나로 전달하는 단층으로 구현된 송신용 전송 선로와 안테나에서 출력되는 수신 신호를 제1 필터로 전달하는 다층으로 구현된 수신용 전송 선로를 포함하는 매칭 회로를 포함한다. 이에 의해, 송/수신 성능을 유지시키면서 듀플렉서의 크기를 줄일 수 있게 되고, 기판의 소형화 및 내장화로 단가경쟁력 확보가 가능해진다.
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公开(公告)号：KR101092126B1
公开(公告)日：2011-12-12
申请号：KR1020090118956
申请日：2009-12-03
Applicant: 전자부품연구원
Abstract: 구부려서사용할수 있는플렉서블패치안테나는플렉서블한유전체기판; 상기유전체기판의상부표면상에형성되는방사패치; 상기유전체기판의상부표면상에형성되며, 상기방사패치로부터소정거리이격되는그라운드; 상기유전체기판의하부표면상에형성되는트랜스포머; 및상기유전체기판의일 측면으로부터상기트랜스포머까지연장되며, 상기트랜스포머와전기적으로연결되는급전선을포함한다.
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Patent Agency Ranking
公开(公告)号：KR1020110062282A
公开(公告)日：2011-06-10
申请号：KR1020090118956
申请日：2009-12-03
Applicant: 전자부품연구원
Abstract: PURPOSE: A flexible patch antenna is provided to be easily installed in a narrow space like a mobile phone using a flexible dielectric board. CONSTITUTION: A radiation patch(101) is formed on a dielectric board. A ground is separated from the radiation patch and is formed on the dielectric board. A transformer(103) is formed on the lower surface of the dielectric board. A power supply line(104) is expanded from one side of the dielectric board to the transformer. The power supply line is electrically connected to the transformer.
Abstract translation: 目的：提供灵活的贴片天线，以便使用柔性电介质板轻松安装在像手机这样狭窄的空间中。 构成：在电介质板上形成辐射贴片（101）。 地面与辐射贴片分离并形成在电介质板上。 变压器（103）形成在电介质板的下表面上。 电源线（104）从电介质板的一侧扩展到变压器。 电源线与变压器电连接。
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公开(公告)号：KR1020110047303A
公开(公告)日：2011-05-09
申请号：KR1020090103879
申请日：2009-10-30
Applicant: 전자부품연구원
CPC classification number: H03H9/14591 , H03H9/0057 , H03H9/0071 , H03H9/0085
Abstract: PURPOSE: A duplexer is provided to simplify the entire structure thereof by forming a duplexer through the cascade connection between a band pass filter and a diplexer. CONSTITUTION: A duplexer includes a band pass filter(110) connected to an antenna terminal(ANT) and a diplexer(120) connected between a transmission and reception terminal(Tx, Rx) and the band pass filter. The diplexer includes a low pass filter(122) and a high pass filter(124). Through the cascade connection between the band pass filter and the diplexer, the deterioration of insertion loss at the edge portion of each band pass is minimized.
Abstract translation: 目的：提供双工器，以通过在带通滤波器和双工器之间的级联连接形成双工器来简化其整个结构。 构成：双工器包括连接到天线端子（ANT）的带通滤波器（110）和连接在发送和接收终端（Tx，Rx）和带通滤波器之间的双工器（120）。 双工器包括低通滤波器（122）和高通滤波器（124）。 通过带通滤波器和双工器之间的级联连接，每个带通边缘部分的插入损耗的劣化被最小化。
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公开(公告)号：KR1020100135530A
公开(公告)日：2010-12-27
申请号：KR1020090053966
申请日：2009-06-17
Applicant: 전자부품연구원
IPC: H01R13/646
Abstract: PURPOSE: An RF(Radio Frequency) connector is provided to form inside line to a pd structure, thereby minimizing the damage of the inside line even in a work of a plurality of repetitive connecting and dividing. CONSTITUTION: A first and a second housing(111,121) has a female and male shape, and is combined to each other. A first insulating body(112) is installed to the first housing, and has a first pad in the center part. A first grounded conductor(114) is installed to the first housing, and surrounds the outer circumference of the first insulating body. The second insulating body(122) is installed to the second housing, and has a second pad facing the first pad in the center part. A second grounded conductor(124) is installed to the second housing, and surrounds the outer circumference of the second insulating body. The first and the second pad are comprised of gold.
Abstract translation: 目的：提供RF（射频）连接器以形成pd结构的内线，从而即使在多次重复连接和分割的工作中也最小化内线的损坏。 构成：第一和第二壳体（111,121）具有阴和阳形状，并且彼此组合。 第一绝缘体（112）安装到第一壳体上，并且在中心部分具有第一垫。 第一接地导体（114）安装到第一壳体，并且围绕第一绝缘体的外周。 第二绝缘体（122）安装到第二壳体上，并且在中心部分具有面向第一焊盘的第二焊盘。 第二接地导体（124）安装到第二壳体，并且围绕第二绝缘体的外周。 第一和第二垫由金组成。
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公开(公告)号：KR1020100076486A
公开(公告)日：2010-07-06
申请号：KR1020080134553
申请日：2008-12-26
Applicant: 전자부품연구원
IPC: G06F3/041 , G02F1/1333 , G06F1/16
CPC classification number: G06F3/045 , G06F1/1626 , G06F1/1643 , G06F1/1652 , G06F3/0202 , G06F3/041 , G02F1/1333 , G02F1/133305 , G06F1/163 , G06F2203/0337
Abstract: PURPOSE: An input apparatus for a flexible display device inputting desired data by the electrode printed on a substrate is provided to variously apply the flexible input device to a multimedia device with the flexible display by forming the electrode on the substrate. CONSTITUTION: An input device for a flexible display device for a flexible display device includes a flexible and transparent substrate(110) and a soft electrode(120). The electrode is printed on the substrate. The input device for the flexible display device is bent by the electrode. The input device for the flexible display device has a curve formation. The data is inputted to the input device for a flexible display device through an input tool.
Abstract translation: 目的：提供一种用于通过印刷在基板上的电极输入期望数据的柔性显示装置的输入装置，通过在基板上形成电极，将柔性输入装置多样地应用于具有柔性显示器的多媒体装置。 构成：用于柔性显示装置的柔性显示装置的输入装置包括柔性和透明基板（110）和软电极（120）。 电极印在基片上。 用于柔性显示装置的输入装置由电极弯曲。 用于柔性显示装置的输入装置具有曲线形成。 通过输入工具将数据输入到用于柔性显示装置的输入装置。
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公开(公告)号：KR1020090087654A
公开(公告)日：2009-08-18
申请号：KR1020080013035
申请日：2008-02-13
Applicant: 전자부품연구원
IPC: H01L23/12
CPC classification number: H01L2224/48091 , H01L2224/48227 , H01L2924/181 , H01L2924/19105 , H01L25/073 , H01L23/15 , H01L23/481 , H01L24/26 , H01L2924/00012 , H01L2924/00014
Abstract: A multi chip package and fabricating method thereof are provided to reduce the volume of the total module by forming a semiconductor chip vertically in circuit patterns. One side of the second semiconductor chip(120) and the first semiconductor chip(110) is bonded to the circuit pattern(105) on the first substrate(100). The other side face of the second semiconductor chip and the first semiconductor chip is bonded each other to the circuit pattern(155) of the second substrate(150). The both sides of first semiconductor chip and the second semiconductor chip have bonding pads(115, 125). The pad(170) is formed on the top of the second substrate and is electrically connected to outside through the pad. The Pad is connected to the circuit pattern formed in the lower surface of the second substrate through the via hole(160).
Abstract translation: 提供一种多芯片封装及其制造方法，以通过以电路图案垂直形成半导体芯片来减小总模块的体积。 第二半导体芯片（120）和第一半导体芯片（110）的一侧与第一基板（100）上的电路图案（105）接合。 第二半导体芯片和第一半导体芯片的另一侧面彼此接合到第二基板（150）的电路图案（155）。 第一半导体芯片和第二半导体芯片的两侧具有接合焊盘（115,125）。 焊盘（170）形成在第二基板的顶部上，并通过焊盘与外部电连接。 垫通过通孔（160）连接到形成在第二基板的下表面中的电路图案。
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