LSPR 광학특성 기반 구리 증착형 나노입자 배열 바이오칩 및 그 용도
    11.
    发明公开
    LSPR 광학특성 기반 구리 증착형 나노입자 배열 바이오칩 및 그 용도 有权
    基于LSPR光学性质的铜包覆纳米生物技术及其应用

    公开(公告)号:KR1020110042848A

    公开(公告)日:2011-04-27

    申请号:KR1020090099702

    申请日:2009-10-20

    Abstract: PURPOSE: A copper-capped nanoparticle based on LSPR optical property is provided to be applied to an unlabeled optical biosensor which is able to detect interaction of biomaterials with high sensitivity. CONSTITUTION: A method for manufacturing a copper-capped nanoparticle comprises: a step of forming a metal thin film(second layer) on a substrate(first layer); a step of arranging the nanoparticles on the metal thin film(second layer) to forming a nanoparitcle array layer(third layer); and a step of forming a copper thin film layer(fourth layer) on the nanoparticle array layer. The thickness of the substrate is 0.1-20 mm. The metal thin film layer contains gold(Au), silver(Ag), copper(Cu), aluminum(Al), platinum(Pt), nickel(Ni), zinc(Zn), or mixture thereof. The metal thin film layer and copper thin film layer is formed by sputtering, deposition, ion plating, or electroplating.

    Abstract translation: 目的:提供一种基于LSPR光学性质的铜封端纳米颗粒,用于未标记的光学生物传感器,能够检测生物材料与高灵敏度的相互作用。 构成:制造铜封端纳米颗粒的方法包括:在衬底(第一层)上形成金属薄膜(第二层)的步骤; 将纳米颗粒布置在金属薄膜(第二层)上以形成纳米颗粒阵列层(第三层)的步骤; 以及在纳米颗粒阵列层上形成铜薄膜层(第四层)的步骤。 基板的厚度为0.1-20mm。 金属薄膜层含有金(Au),银(Ag),铜(Cu),铝(Al),铂(Pt),镍(Ni),锌(Zn)或其混合物。 金属薄膜层和铜薄膜层通过溅射,沉积,离子电镀或电镀形成。

    구리 결합펩타이드를 이용한 탐침단백질이 고정된 다중 스팟 구리 증착형 나노구조체 배열 바이오칩 및 이의 제조방법
    12.
    发明公开

    公开(公告)号:KR1020120033875A

    公开(公告)日:2012-04-09

    申请号:KR1020100095612

    申请日:2010-09-30

    Abstract: PURPOSE: A multi-spot copper-capped nanostructure array biochip using copper binding peptides is provided to detect interaction of DNA and various bio substances at high sensitivity. CONSTITUTION: A method for manufacturing a multi-spot copper-capped nanostructure array biochip using CBP(copper binding peptide) comprises: a step of forming a metal thin film(second layer) on a substrate(first layer); a step of forming a multi-spot on the metal thin film and arranging the nanostructure in predetermined interval to form nanosturcutre arranged layer(third layer); a step of forming copper thin film(fourth layer) on the nanosturcutre arranged layer; and a step of fixing CBP-probe protein-conjugated fusion proteins on the copper thin film. The substrate includes glass, polystyrene, PET(polyethylene terephthalate), polycarbonate, silicon, or quartz.

    Abstract translation: 目的:提供使用铜结合肽的多点铜帽纳米结构阵列生物芯片,以检测DNA和各种生物物质在高灵敏度下的相互作用。 构成:使用CBP(铜结合肽)制造多点铜封端纳米结构阵列生物芯片的方法包括:在衬底(第一层)上形成金属薄膜(第二层)的步骤; 在金属薄膜上形成多点并以预定间隔布置纳米结构以形成纳米级刻蚀层(第三层)的步骤; 在纳米薄壁布置层上形成铜薄膜(第四层)的步骤; 以及将CBP-探针蛋白质结合的融合蛋白固定在铜薄膜上的步骤。 基板包括玻璃,聚苯乙烯,PET(聚对苯二甲酸乙二醇酯),聚碳酸酯,硅或石英。

Patent Agency Ranking