Sensors For Contaminants
    11.
    发明公开

    公开(公告)号:US20230324322A1

    公开(公告)日:2023-10-12

    申请号:US18042317

    申请日:2021-09-15

    CPC classification number: G01N27/22 H05K7/20818 H05K7/203

    Abstract: A thermal management system includes a housing having an interior space; a heat-generating component disposed within the interior space; a working fluid disposed within the interior space such that the heat-generating component contacts a liquid phase of the working fluid; and a sensing mechanism configured to detect the presence of one or more organic contaminants in the working fluid at concentrations of 100 ppm or less.

    ELECTRICALLY CONDUCTIVE BONDING TAPE WITH LOW PASSIVE INTERMODULATION

    公开(公告)号:US20230110790A1

    公开(公告)日:2023-04-13

    申请号:US17992224

    申请日:2022-11-22

    Abstract: An electrically conductive bonding tape includes a conductive self-supporting first layer conductive in each of three mutually orthogonal directions and including conductive opposing first and second major surfaces, an conductive second layer coated on the first major surface of the self-supporting first layer and having at least 60% by weight of nickel, the second layer having an exposed major surface facing away from the first major surface of the self-supporting first layer and exposing at least some of the nickel in the second layer, and a conductive adhesive third layer bonded to the second major surface of the self-supporting first layer opposite the second layer. The adhesive third layer is conductive in at least one of the three mutually orthogonal directions and includes a plurality of conductive elements dispersed in an insulative material, at least some of the conductive elements physically contacting the self-supporting first layer.

    Plating bronze on polymer sheets
    13.
    发明授权

    公开(公告)号:US11293111B2

    公开(公告)日:2022-04-05

    申请号:US15571118

    申请日:2016-06-13

    Abstract: An electroplated article is provided comprising a polymeric substrate bearing an electroplated metal layer comprising copper and tin in an atomic ratio of less than 96:4, in some embodiments less than 87:13 and in some embodiments less than 82:18; wherein the atomic ratio of copper to tin is greater than 55:45, and wherein the electroplated metal layer comprises at least 3.5 weight % tin. The electroplated metal layer comprises an alloy having a melting point of less than 1050° C. and in some cases less than 800° C. The electroplated metal layer has a Young's Modulus of less than 15.0 GPa, in some embodiments less than 13.0 GPa, and in some less than 10.0 GPa. In addition, an electroplating solution is provided comprising Cu(II) ions, Sn (II) ions, Zn(II) ions, 1-methionine, and no cyanide anion.

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