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公开(公告)号：US20230235200A1
公开(公告)日：2023-07-27
申请号：US18125818
申请日：2023-03-24
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Jeongwan Choi , Jeffrey W. McCutcheon , Marina M. Kaplun , Steven Y. Yu , Jinbae Kim
Abstract: An electrically conductive bonding tape includes a conductive self-supporting first layer conductive in each of three mutually orthogonal directions and including conductive opposing first and second major surfaces, an conductive second layer coated on the first major surface of the self-supporting first layer and having at least 60% by weight of nickel, the second layer having an exposed major surface facing away from the first major surface of the self-supporting first layer and exposing at least some of the nickel in the second layer, and a conductive adhesive third layer bonded to the second major surface of the self-supporting first layer opposite the second layer. The adhesive third layer is conductive in at least one of the three mutually orthogonal directions and includes a plurality of conductive elements dispersed in an insulative material, at least some of the conductive elements physically contacting the self-supporting first layer.
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公开(公告)号：US11066753B2
公开(公告)日：2021-07-20
申请号：US15736531
申请日：2016-06-13
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Larry S. Hebert , David A. Sowatzke , Steven Y. Yu , Gene B. Nesmith
IPC: B32B15/04 , C25D5/56 , C23C28/02 , C23C28/00 , C23C14/20 , B32B15/20 , C25D3/38 , C23C18/16 , C23C18/54 , C25D3/30
Abstract: A plated article is provided comprising a) a polymeric substrate bearing b) a tie/seed layer in direct contact with the polymeric substrate and c) a plated metal layer, wherein the tie/seed layer has a thickness of less than 0.95 μm, and wherein the tie/seed layer comprises two or more layers of tin alternating with two or more layers of copper, and in some embodiments up to ten or more layers of tin alternating with ten or more layers of copper. In some embodiments, the tie/seed layer includes a layer of tin in direct contact with the polymeric substrate. Typically, the layers of tin and copper comprising the tie/seed layer are sputter coated layers. In some embodiments, the plated metal layer comprises an alloy of copper and tin. In some embodiments, the plated metal layer comprises layers comprised of tin alternating with layers comprised of copper.
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公开(公告)号：US20200017623A1
公开(公告)日：2020-01-16
申请号：US16491051
申请日：2018-03-08
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Sheng Ye , Ying Lin , Michael E. Griffin , Dennis R. Keicher , Jay S. Schlechte , Paul J. Homnick , Richard S. Smith , Thomas P. Klun , Richard J. Pokorny , Steven Y. Yu , Patricia M. Savu , Michael A. Kropp , Ian Dailey , Charlie P. Blackwell
IPC: C08F290/06 , C09D175/16 , C09D4/00 , C08L75/16 , C09J4/00 , C09J151/08 , F21V29/70 , F21V29/60 , B05D3/06 , B05D7/16 , B29C35/08
Abstract: The disclosure relates to compositions, methods of applying such compositions, and methods for curing such compositions to a depth of cure of up to about 30 mm within about 0.5 second to about two minutes per light exposure area.
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公开(公告)号：US20180347059A1
公开(公告)日：2018-12-06
申请号：US15571118
申请日：2016-06-13
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Steven Y. Yu , Gene B. Nesmith , Larry S. Hebert
CPC classification number: C25D3/58 , C23C28/023 , C25D5/18 , C25D5/56
Abstract: An electroplated article is provided comprising a polymeric substrate bearing an electroplated metal layer comprising copper and tin in an atomic ratio of less than 96:4, in some embodiments less than 87:13 and in some embodiments less than 82:18; wherein the atomic ratio of copper to tin is greater than 55:45, and wherein the electroplated metal layer comprises at least 3.5 weight % tin. The electroplated metal layer comprises an alloy having a melting point of less than 1050° C. and in some cases less than 800° C. The electroplated metal layer has a Young's Modulus of less than 15.0 GPa, in some embodiments less than 13.0 GPa, and in some less than 10.0 GPa. In addition, an electroplating solution is provided comprising Cu(II) ions, Sn (II) ions, Zn(II) ions, 1-methionine, and no cyanide anion.
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公开(公告)号：US12129411B2
公开(公告)日：2024-10-29
申请号：US17992224
申请日：2022-11-22
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Jeongwan Choi , Jeffrey W. McCutcheon , Marina M. Kaplun , Steven Y. Yu , Jinbae Kim
Abstract: An electrically conductive bonding tape includes a conductive self-supporting first layer conductive in each of three mutually orthogonal directions and including conductive opposing first and second major surfaces, an conductive second layer coated on the first major surface of the self-supporting first layer and having at least 60% by weight of nickel, the second layer having an exposed major surface facing away from the first major surface of the self-supporting first layer and exposing at least some of the nickel in the second layer, and a conductive adhesive third layer bonded to the second major surface of the self-supporting first layer opposite the second layer. The adhesive third layer is conductive in at least one of the three mutually orthogonal directions and includes a plurality of conductive elements dispersed in an insulative material, at least some of the conductive elements physically contacting the self-supporting first layer.
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Patent Agency Ranking
公开(公告)号：US11648761B2
公开(公告)日：2023-05-16
申请号：US16771836
申请日：2019-04-15
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Larry S. Hebert , Timothy D. Norum , Steven Y. Yu , Stephen P. Maki
IPC: B32B43/00 , B32B37/00 , B29C41/42 , B32B7/06 , B32B7/12 , B32B15/06 , B32B15/092 , B32B15/20 , B32B25/14 , B32B27/26 , B32B27/38 , B32B38/06 , B32B38/10 , B64D45/02
CPC classification number: B32B37/025 , B29C41/42 , B32B7/06 , B32B7/12 , B32B15/06 , B32B15/092 , B32B15/20 , B32B25/14 , B32B27/26 , B32B27/38 , B32B38/06 , B32B38/10 , B64D45/02 , B32B43/006 , B32B2274/00 , B32B2307/202 , B32B2307/712 , Y10T156/1168
Abstract: A method of making an electrically-conductive film is provided. The method includes providing a release layer, optionally having a topologically structured surface, and depositing at least one electrically-conductive layer on the release layer whereby the at least one electrically-conductive layer has an outer surface that substantially replicates the topologically structured surface. The electrically-conductive layer can be peeled away from the release layer to obtain the electrically-conductive film. Such electrically-conductive films can be useful in lightning strike applications.
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公开(公告)号：US20160010205A1
公开(公告)日：2016-01-14
申请号：US14859504
申请日：2015-09-21
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Gene B. Nesmith , Steven Y. Yu
CPC classification number: C23C16/06 , B32B15/043 , B32B15/082 , B32B2250/03 , B32B2255/10 , B32B2255/205 , B32B2307/202 , B32B2311/12 , B32B2311/18 , C23C14/022 , C23C14/025 , C23C14/165 , C23C14/205 , C23C14/584 , C23C16/0245 , C23C16/44 , C23C16/56 , C23C28/023 , C25D5/34 , Y10T428/12562
Abstract: This disclosure relates metalized fluoroelastomer materials such as films. The fluoroelastomer materials bear a conductive metal layer bound to the fluoroelastomer material through a thin layer of titanium. In addition methods of making such materials are provided that include steps of: optionally exposing a fluoroelastomer material to an oxygen plasma, applying a layer of titanium metal to a fluoroelastomer material by a vapor coating method, applying a metal overlayer to the fluoroelastomer material by a vapor coating method, and optionally electroplating the fluoroelastomer material with a metal top layer.
Abstract translation: 本公开涉及金属化含氟弹性体材料如膜。 含氟弹性体材料通过钛薄层承载与含氟弹性体材料结合的导电金属层。 另外提供制造这种材料的方法包括以下步骤：任选地将含氟弹性体材料暴露于氧等离子体中，通过蒸气涂覆法将一层钛金属施加到含氟弹性体材料上，通过一种金属覆层施加到含氟弹性体材料上 蒸气涂覆法，以及任选地用金属顶层电镀含氟弹性体材料。
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公开(公告)号：US20240309247A1
公开(公告)日：2024-09-19
申请号：US18628941
申请日：2024-04-08
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Jeongwan Choi , Jeffrey W. McCutcheon , Marina M. Kaplun , Steven Y. Yu , Jinbae Kim
Abstract: An electrically conductive bonding tape includes a conductive self-supporting first layer conductive in each of three mutually orthogonal directions and including conductive opposing first and second major surfaces, an conductive second layer coated on the first major surface of the self-supporting first layer and having at least 60% by weight of nickel, the second layer having an exposed major surface facing away from the first major surface of the self-supporting first layer and exposing at least some of the nickel in the second layer, and a conductive adhesive third layer bonded to the second major surface of the self-supporting first layer opposite the second layer. The adhesive third layer is conductive in at least one of the three mutually orthogonal directions and includes a plurality of conductive elements dispersed in an insulative material, at least some of the conductive elements physically contacting the self-supporting first layer.
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公开(公告)号：US20210310145A1
公开(公告)日：2021-10-07
申请号：US17349168
申请日：2021-06-16
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Larry S. Hebert , David A. Sowatzke , Steven Y. Yu , Gene B. Nesmith
Abstract: A plated article is provided comprising a) a polymeric substrate bearing b) a tie/seed layer in direct contact with the polymeric substrate and c) a plated metal layer, wherein the tie/seed layer has a thickness of less than 0.95 μm, and wherein the tie/seed layer comprises two or more layers of tin alternating with two or more layers of copper, and in some embodiments up to ten or more layers of tin alternating with ten or more layers of copper. In some embodiments, the tie/seed layer includes a layer of tin in direct contact with the polymeric substrate. Typically, the layers of tin and copper comprising the tie/seed layer are sputter coated layers. In some embodiments, the plated metal layer comprises an alloy of copper and tin. In some embodiments, the plated metal layer comprises layers comprised of tin alternating with layers comprised of copper.
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公开(公告)号：US20180187323A1
公开(公告)日：2018-07-05
申请号：US15736531
申请日：2016-06-13
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Larry S. Hebert , David A. Sowatzke , Steven Y. Yu , Gene B. Nesmith
CPC classification number: C25D5/56 , C23C14/205 , C23C18/1653 , C23C18/54 , C23C28/023 , C23C28/42 , C25D3/30 , C25D3/38
Abstract: A plated article is provided comprising a) a polymeric substrate bearing b) a tie/seed layer in direct contact with the polymeric substrate and c) a plated metal layer, wherein the tie/seed layer has a thickness of less than 0.95 μm, and wherein the tie/seed layer comprises two or more layers of tin alternating with two or more layers of copper, and in some embodiments up to ten or more layers of tin alternating with ten or more layers of copper. In some embodiments, the tie/seed layer includes a layer of tin in direct contact with the polymeric substrate. Typically, the layers of tin and copper comprising the tie/seed layer are sputter coated layers. In some embodiments, the plated metal layer comprises an alloy of copper and tin. In some embodiments, the plated metal layer comprises layers comprised of tin alternating with layers comprised of copper.
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