中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

52 records (took 0.029 seconds)

    BOBINADOS DE BOBINA AISLADOS CON RESINA SIN MOLDE.
    12.
    发明专利
    BOBINADOS DE BOBINA AISLADOS CON RESINA SIN MOLDE. 未知

    公开(公告)号：ES2331085T3

    公开(公告)日：2009-12-21

    申请号：ES05782658

    申请日：2005-09-20

    Applicant: ABB RESEARCH LTD

    Inventor： KALTENBORN UWE ,  MEIER GUIDO ,  SCHAAL STEPHANE ,  ROCKS JENS

    IPC: H01F41/12 ,  B29C53/56 ,  H01F27/32

    Abstract: Un método para fabricar una bobina aislada con resina (1), en el que la bobina (1) está reforzada con fibras dispuestas sobre la bobina (1) en una matriz polimérica sólida (4), en el que una capa de bobinado (3) y una capa de fibra/polímero (4) se aplican alternativa y repetidamente, comprendiendo la aplicación de la capa de fibra/polímero (4) las siguientes etapas ejecutadas continuamente: - suministrar continuamente al menos una cinta continua (2; 2a, 2b) que comprende fibras y una matriz polimérica sólida, - fundir o activar una sección de al menos una cinta (2; 2a, 2b) durante el suministro, - presionar la sección fundida o activada de la cinta (2; 2a, 2b) sobre la bobina (1) durante el suministro, y - enfriar la cinta (2; 2a, 2b) después de dejar la zona de calentamiento o activación y presión.

    13.
    发明专利
    未知

    公开(公告)号：DE602005015901D1

    公开(公告)日：2009-09-17

    申请号：DE602005015901

    申请日：2005-09-20

    Applicant: ABB RESEARCH LTD

    Inventor： KALTENBORN UWE ,  MEIER GUIDO ,  SCHAAL STEPHANE ,  ROCKS JENS

    IPC: H01F41/12 ,  B29C53/56 ,  H01F27/32

    Abstract: Mold-free resin-insulated coil windings are obtained by applying continuous fibers embedded in a quasi-solid-state epoxy-resin matrix, e.g. in the form of a tape, to the coil windings. The tape is locally heated up to the melting point of its polymer matrix, and is subsequently pressed against the winding body. The heated and fused resin of the tape, which is pressed onto the coil, flows under pressure into the voids and gaps between the coil windings and fills them up, thereby hermetically insulating the coil windings. After leaving the heating and pressing apparatus the fused epoxy resin becomes solid again. The resulting curing process is thus considerably simplified and shortened, compared to the state of the art.

    15.
    发明专利
    未知

    公开(公告)号：DE50006008D1

    公开(公告)日：2004-05-13

    申请号：DE50006008

    申请日：2000-09-11

    Applicant: ABB RESEARCH LTD

    Inventor： KALTENBORN UWE

    IPC: B29C33/64 ,  B29C37/00 ,  B29K63/00 ,  B29K75/00 ,  B32B27/38 ,  C08K5/541 ,  C08K5/544 ,  C08L83/04 ,  C09D183/04 ,  C09K3/00

    Abstract: Mold-release agent for producing thermoset moldings with a hydrophobicized surface, where the agent comproses (I) at least one compound with mold-release action, and also (ii) at least one reactive, where appropriate hydrolyzable, silane compound, which is capable of reacting chemically in situ with the thermoset surface which forms during the molding process. The use of a mold-release agent of this type in a molding process and/or in a post-curing process for the production of thermoset moldings with a hydrophobicized surface, and also the moldings produced in this way.

    16.
    发明专利
    未知

    公开(公告)号：DE50101444D1

    公开(公告)日：2004-03-11

    申请号：DE50101444

    申请日：2001-04-17

    Applicant: ABB RESEARCH LTD

    Inventor： KALTENBORN UWE ,  SKRYTEN KRISTIAN

    IPC: H01H85/06 ,  H01H85/11

    Abstract: A fuse has a fuse element (6) with a fusible conductor (7) of a conductor material (8) such as Ag, Cu or Al and is provided with doping points (9) following one another at regular intervals. There, the conductor material (8) has a directly adjoining layer of a first compound (10) of the same with a doping material such as In or Ge. It forms mixed crystals which contain the conductor material (8) and the doping material in a fixed stoichiometric ratio, such as for example Ag2In, and is separated from said conductor material by a stable phase boundary. The doping points (9) weaken the fusible conductor by lowering the melting point to below 250° C., so that arc formation rapidly occurs there when there are short-circuit currents, although its electrical resistance per unit of length is under some circumstances only a few percent greater than in the remaining region. The fusible conductor (7) bears a continuous layer of a burn-up material (12). It has an ignition temperature which is preferably lower than the melting point of the first compound (10).

Patent Agency Ranking