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    Cooling device and method for cooling at least two power electronic devices
    11.
    发明授权
    Cooling device and method for cooling at least two power electronic devices 有权

    公开(公告)号：US10080315B2

    公开(公告)日：2018-09-18

    申请号：US15275428

    申请日：2016-09-25

    Applicant: ABB Schweiz AG

    Inventor： Francesco Agostini ,  Daniele Torresin ,  Mathieu Habert ,  Bruno Agostini

    IPC: H05K7/20 ,  F28F13/10 ,  F28F9/02 ,  F28D15/02

    CPC classification number: H05K7/20936 ,  F28D15/025 ,  F28D15/0266 ,  F28D15/0275 ,  F28F9/0278 ,  F28F13/10 ,  H05K7/209

    Abstract: A cooling device for cooling at least two power electronic devices by a working fluid. The cooling device has a heat receiver portion of the Pulsating Heat Pipe circuit system and a pair of thermo-conducting walls provided on mutually opposite sides of the heat receiver arrangement and sandwiching the heat receiver portion between them. These walls are adapted for being thermally connected to a respective one of the power electronic devices. The cooling device further has a heat dissipator arrangement with a heat dissipator portion of the Pulsating Heat Pipe circuit system and a plurality of fins thermally coupled to the heat dissipator portion for transferring heat from the heat dissipator portion to an external cooling fluid for cooling the working fluid in the heat dissipator portion. The Pulsating Heat Pipe circuit system connects the heat receiver portion with the heat dissipator portion for transferring heat from the heat receiver portion to the heat dissipator portion by the Pulsating Heat Pipe action of the working fluid.

    Vapor chamber for cooling an electronic component, electronic arrangement, and method for manufacturing the vapor chamber
    12.
    发明授权
    Vapor chamber for cooling an electronic component, electronic arrangement, and method for manufacturing the vapor chamber 有权

    公开(公告)号：US12156378B2

    公开(公告)日：2024-11-26

    申请号：US17551736

    申请日：2021-12-15

    Applicant: ABB Schweiz AG

    Inventor： Bruno Agostini ,  Daniele Torresin ,  Andrey Petrov

    IPC: H05K7/20 ,  F28D15/02

    Abstract: A vapor chamber includes a bottom cover, a top cover, a crate element, and at least one porous pillar. The bottom cover is configured to receive waste heat from an electronic component. The top cover is arranged on the bottom cover, and the bottom cover and the top cover are formed such that a vapor cavity configured to accommodate a liquid is formed between the bottom and top cover. The crate element is configured to provide mechanical strength to the vapor chamber, and has at least one compartment. The compartment(s) are formed by at least three side panels that are connected to each other, where the at least three side panels extend from the bottom cover to the top cover. The porous pillar(s) are configured to transfer the liquid from the top cover to the bottom cover and are arranged in the compartment.

    HEAT DISSIPATION DEVICE
    13.
    发明申请
    HEAT DISSIPATION DEVICE 有权

    公开(公告)号：US20220196337A1

    公开(公告)日：2022-06-23

    申请号：US17557485

    申请日：2021-12-21

    Applicant: ABB Schweiz AG

    Inventor： Daniele Torresin ,  Bruno Agostini ,  Andrey Petrov

    IPC: F28D15/04

    Abstract: A heat dissipation device is provided herein. The heat dissipation device includes an evaporator chamber at least partially filled with a working fluid to be evaporated when being heated by a heat source; at least one condenser chamber for receiving evaporated working fluid and for condensing the evaporated working fluid, wherein the condenser chamber is interconnected with the evaporator chamber in a fluid conductive manner; and at least one air fin element interconnected between the condenser chamber and one of a further condenser chamber and a side wall of the heat dissipation device; wherein the air fin element has a triply periodic surface providing air fins.

    VAPOR CHAMBER
    14.
    发明申请
    VAPOR CHAMBER 有权

    公开(公告)号：US20210125898A1

    公开(公告)日：2021-04-29

    申请号：US17080144

    申请日：2020-10-26

    Applicant: ABB Schweiz AG

    Inventor： Daniele Torresin ,  Bruno Agostini ,  Andrey Petrov

    IPC: H01L23/427 ,  F28D15/04

    Abstract: The application relates to a vapor chamber for cooling a heat source, the vapor chamber includes an evaporator proceeding in a first plane and the vapor chamber includes at least a first condenser and a second condenser, wherein the first and second condenser are internally coupled to the evaporator, wherein the first condenser proceeds in a second plane, and the second condenser proceeds in a third plane, wherein the second plane and the third plane are arranged in an angle to the first plane, wherein at least one air fin is provided, wherein the at least one air fin proceeds in a fourth plane, and wherein the first condenser and the second condenser are internally coupled to the air fin, and wherein the evaporator, the first condenser, the second condenser and the air fin form a common internal volume.

    METHOD OF FORMING A 3D-VAPOR CHAMBER
    15.
    发明申请
    METHOD OF FORMING A 3D-VAPOR CHAMBER 审中-公开

    公开(公告)号：US20200315064A1

    公开(公告)日：2020-10-01

    申请号：US16834600

    申请日：2020-03-30

    Applicant: ABB Schweiz AG

    Inventor： Bruno Agostini ,  Daniele Torresin ,  Matteo Bortolato

    IPC: H05K7/20 ,  B23K26/21

    Abstract: The invention relates to a method which is suited for manufacturing a 3D-vapor chamber in a defined and efficient manner. Especially, the present method provides a solution for providing a vapor chamber having an evaporator and a condenser made from a first part and a second part, wherein continuity of internal structures is given which in turn provides an efficient working behaviour of the vapor chamber.

    HEAT EXCHANGER
    18.
    发明申请
    HEAT EXCHANGER 有权
    热交换器

    公开(公告)号：US20170010049A1

    公开(公告)日：2017-01-12

    申请号：US15204648

    申请日：2016-07-07

    Applicant: ABB Schweiz AG

    Inventor： Bruno Agostini ,  Daniele Torresin ,  Francesco Agostini ,  Mathieu Habert

    IPC: F28D15/02 ,  H05K7/20 ,  F28D7/00 ,  F28D15/04 ,  F28F3/02

    CPC classification number: F28D15/0266 ,  F28D7/0075 ,  F28D15/0233 ,  F28D15/04 ,  F28D2015/0216 ,  F28D2021/0028 ,  F28D2021/0029 ,  F28F3/025 ,  H01L23/3677 ,  H01L23/427 ,  H05K7/20936

    Abstract: The invention relates to a heat exchanger comprising a base plate for receiving a heat load from one or more electric components, an evaporator being in thermal contact with a surface of the base plate for transferring said heat load into a first fluid in the evaporator channels, and a condenser dissipating heat from the first fluid. In order to provide an efficient heat exchanger the heat exchanger comprises a collector space receiving first fluid from the condenser, and the collector space which is located higher than the lower ends of the evaporator channels is in fluid communication with lower ends of the evaporator channels for passing first fluid received from the condenser to the lower ends of the evaporator channels.

    Abstract translation: 本发明涉及一种热交换器，其包括用于从一个或多个电气部件接受热负荷的基板，与基板的表面热接触的蒸发器，用于将所述热负载传送到蒸发器通道中的第一流体， 以及从第一流体散热的冷凝器。 为了提供有效的热交换器，热交换器包括从冷凝器接收第一流体的收集空间，并且位于高于蒸发器通道的下端的收集器空间与蒸发器通道的下端流体连通， 将从冷凝器接收的第一流体通过蒸发器通道的下端。

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