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公开(公告)号：US12156378B2
公开(公告)日：2024-11-26
申请号：US17551736
申请日：2021-12-15
Applicant: ABB Schweiz AG
Inventor： Bruno Agostini , Daniele Torresin , Andrey Petrov
Abstract: A vapor chamber includes a bottom cover, a top cover, a crate element, and at least one porous pillar. The bottom cover is configured to receive waste heat from an electronic component. The top cover is arranged on the bottom cover, and the bottom cover and the top cover are formed such that a vapor cavity configured to accommodate a liquid is formed between the bottom and top cover. The crate element is configured to provide mechanical strength to the vapor chamber, and has at least one compartment. The compartment(s) are formed by at least three side panels that are connected to each other, where the at least three side panels extend from the bottom cover to the top cover. The porous pillar(s) are configured to transfer the liquid from the top cover to the bottom cover and are arranged in the compartment.
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公开(公告)号：US20220196337A1
公开(公告)日：2022-06-23
申请号：US17557485
申请日：2021-12-21
Applicant: ABB Schweiz AG
Inventor： Daniele Torresin , Bruno Agostini , Andrey Petrov
IPC: F28D15/04
Abstract: A heat dissipation device is provided herein. The heat dissipation device includes an evaporator chamber at least partially filled with a working fluid to be evaporated when being heated by a heat source; at least one condenser chamber for receiving evaporated working fluid and for condensing the evaporated working fluid, wherein the condenser chamber is interconnected with the evaporator chamber in a fluid conductive manner; and at least one air fin element interconnected between the condenser chamber and one of a further condenser chamber and a side wall of the heat dissipation device; wherein the air fin element has a triply periodic surface providing air fins.
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公开(公告)号：US20210125898A1
公开(公告)日：2021-04-29
申请号：US17080144
申请日：2020-10-26
Applicant: ABB Schweiz AG
Inventor： Daniele Torresin , Bruno Agostini , Andrey Petrov
IPC: H01L23/427 , F28D15/04
Abstract: The application relates to a vapor chamber for cooling a heat source, the vapor chamber includes an evaporator proceeding in a first plane and the vapor chamber includes at least a first condenser and a second condenser, wherein the first and second condenser are internally coupled to the evaporator, wherein the first condenser proceeds in a second plane, and the second condenser proceeds in a third plane, wherein the second plane and the third plane are arranged in an angle to the first plane, wherein at least one air fin is provided, wherein the at least one air fin proceeds in a fourth plane, and wherein the first condenser and the second condenser are internally coupled to the air fin, and wherein the evaporator, the first condenser, the second condenser and the air fin form a common internal volume.
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公开(公告)号：US20200315064A1
公开(公告)日：2020-10-01
申请号：US16834600
申请日：2020-03-30
Applicant: ABB Schweiz AG
Inventor： Bruno Agostini , Daniele Torresin , Matteo Bortolato
Abstract: The invention relates to a method which is suited for manufacturing a 3D-vapor chamber in a defined and efficient manner. Especially, the present method provides a solution for providing a vapor chamber having an evaporator and a condenser made from a first part and a second part, wherein continuity of internal structures is given which in turn provides an efficient working behaviour of the vapor chamber.
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公开(公告)号：US09958213B2
公开(公告)日：2018-05-01
申请号：US15204648
申请日：2016-07-07
Applicant: ABB Schweiz AG
Inventor： Bruno Agostini , Daniele Torresin , Francesco Agostini , Mathieu Habert
IPC: F28D15/02 , F28D7/00 , F28D15/04 , F28F3/02 , H05K7/20 , H01L23/427 , F28D21/00 , H01L23/367
CPC classification number: F28D15/0266 , F28D7/0075 , F28D15/0233 , F28D15/04 , F28D2015/0216 , F28D2021/0028 , F28D2021/0029 , F28F3/025 , H01L23/3677 , H01L23/427 , H05K7/20936
Abstract: The invention relates to a heat exchanger comprising a base plate for receiving a heat load from one or more electric components, an evaporator being in thermal contact with a surface of the base plate for transferring said heat load into a first fluid in the evaporator channels, and a condenser dissipating heat from the first fluid. In order to provide an efficient heat exchanger the heat exchanger comprises a collector space receiving first fluid from the condenser, and the collector space which is located higher than the lower ends of the evaporator channels is in fluid communication with lower ends of the evaporator channels for passing first fluid received from the condenser to the lower ends of the evaporator channels.
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Patent Agency Ranking
公开(公告)号：US09888612B2
公开(公告)日：2018-02-06
申请号：US15401630
申请日：2017-01-09
Applicant: ABB Schweiz AG
Inventor： Daniele Torresin , Bruno Agostini , Francesco Agostini , Thomas Gradinger , Mathieu Habert
CPC classification number: H05K7/20309 , F28D15/0233 , F28D15/0266 , F28D15/0275 , F28F1/022 , F28F13/00 , F28F2270/00 , F28F2275/02 , H05K7/20318 , H05K7/20327 , H05K7/20336 , H05K7/20936
Abstract: It is proposed a two-phase heat exchanger device for a power-electronic module arrangement having a semiconductor module. The two-phase heat exchanger device includes a base plate configured for being in contact with a first semiconductor module at a first side of the base plate; and at least one tube element for a first cooling medium including a first portion having at least one evaporator channel and a second portion having at least one condenser channel. The base plate has a groove containing the tube element, wherein the groove is dimensioned for enabling thermal contact between the base plate and the first portion of the tube element and dimensioned to form a gap between the base plate and the second portion of the tube element for thermal separation of the base plate and the second portion of the tube element.
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公开(公告)号：US20170010049A1
公开(公告)日：2017-01-12
申请号：US15204648
申请日：2016-07-07
Applicant: ABB Schweiz AG
Inventor： Bruno Agostini , Daniele Torresin , Francesco Agostini , Mathieu Habert
CPC classification number: F28D15/0266 , F28D7/0075 , F28D15/0233 , F28D15/04 , F28D2015/0216 , F28D2021/0028 , F28D2021/0029 , F28F3/025 , H01L23/3677 , H01L23/427 , H05K7/20936
Abstract: The invention relates to a heat exchanger comprising a base plate for receiving a heat load from one or more electric components, an evaporator being in thermal contact with a surface of the base plate for transferring said heat load into a first fluid in the evaporator channels, and a condenser dissipating heat from the first fluid. In order to provide an efficient heat exchanger the heat exchanger comprises a collector space receiving first fluid from the condenser, and the collector space which is located higher than the lower ends of the evaporator channels is in fluid communication with lower ends of the evaporator channels for passing first fluid received from the condenser to the lower ends of the evaporator channels.
Abstract translation: 本发明涉及一种热交换器，其包括用于从一个或多个电气部件接受热负荷的基板，与基板的表面热接触的蒸发器，用于将所述热负载传送到蒸发器通道中的第一流体， 以及从第一流体散热的冷凝器。 为了提供有效的热交换器，热交换器包括从冷凝器接收第一流体的收集空间，并且位于高于蒸发器通道的下端的收集器空间与蒸发器通道的下端流体连通， 将从冷凝器接收的第一流体通过蒸发器通道的下端。
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公开(公告)号：US20220192050A1
公开(公告)日：2022-06-16
申请号：US17551736
申请日：2021-12-15
Applicant: ABB Schweiz AG
Inventor： Bruno Agostini , Daniele Torresin , Andrey Petrov
Abstract: The disclosure relates to a vapor chamber for cooling an electronic component. The vapor chamber includes a bottom cover for receiving waste heat from the electronic component, a top cover, wherein the bottom cover and the top cover are formed such that a vapor cavity for accommodating a liquid is formed between the bottom cover and the top cover, a crate element for providing mechanical strength to the vapor chamber, wherein the crate element has at least one compartment, which is formed by at least three side panels being connected to each other and extending from the bottom cover to the top cover, and a top recess facing the top cover and a bottom recess facing the bottom cover, and at least one porous pillar for transferring the liquid from the top cover to the bottom cover.
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公开(公告)号：US20210095931A1
公开(公告)日：2021-04-01
申请号：US17032025
申请日：2020-09-25
Applicant: ABB Schweiz AG
Inventor： Matteo Bortolato , Bruno Agostini , Andrey Petrov , Daniele Torresin
Abstract: The invention relates to a vapor chamber (10), comprising a sealed casing (12) which comprises two main walls, wherein a first main wall is an evaporator wall (14) and a second main wall is a condenser wall (16), wherein the two main walls are connected by side connections (18, 20) to form a sealed volume (21) inside the two main walls and the side connections (18, 20), wherein a plurality of pillars (22) is provided in the sealed volume (21) such, that the pillars (22) connect the evaporator wall (14) and the condenser wall (16), wherein the pillars (22) have a first contact area (24) to the evaporator wall (14) and a second contact area (26) to the condenser wall (16), and wherein the pillars (22) further comprise an intermediate cross section area (28) being arranged between the first contact area (24) and the second contact area (26), wherein the extension of the intermediate cross section area (28) is smaller compared to the extension of both of the first contact area (24) and the second contact area (26).
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公开(公告)号：US20180368292A1
公开(公告)日：2018-12-20
申请号：US16113341
申请日：2018-08-27
Applicant: ABB Schweiz AG
Inventor： Francesco Agostini , Daniele Torresin , Mathieu Habert , Bruno Agostini
IPC: H05K7/20 , F28F27/02 , H01L23/427
CPC classification number: H05K7/20936 , F28F27/02 , H01L23/427 , H05K7/20309 , H05K7/20318 , H05K7/20327 , H05K7/20354 , H05K7/20381
Abstract: A heat exchanger assembly (1) is disclosed. The heat exchanger assembly comprises at least one passive cooling circuit (100), the passive cooling circuit comprising an evaporator (110) connectable to a device (50) to be cooled for conducting heat from the device (50) to be cooled to the cooling fluid within the evaporator (110), thereby evaporating the cooling fluid, and a condenser (120) interconnected with the evaporator (110) for receiving the evaporated cooling fluid from the evaporator (110), releasing heat from the cooling fluid to an environment of the condenser (120), thereby condensing the cooling fluid, and for returning the condensed cooling fluid to the evaporator; and an active partial circuit (200) comprising a compressor (250) and an auxiliary condenser (220), the active partial circuit (200) being activatable and deactivatable and being connected to the passive cooling circuit for receiving, in an activated state of the active partial circuit (200), the cooling fluid from the evaporator (110), for compressing the received cooling fluid by the compressor (250), for releasing heat, by the auxiliary condenser (220), from the compressed cooling fluid to an environment of the auxiliary condenser (220), and for returning the condensed cooling fluid to the evaporator (110). Furthermore, the passive cooling circuit (100) is a base-to-air type thermosiphon or an air-to-air type thermosiphon.
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