公开(公告)号：US10517195B2

公开(公告)日：2019-12-24

申请号：US16113341

申请日：2018-08-27

Applicant: ABB Schweiz AG

Inventor： Francesco Agostini ,  Daniele Torresin ,  Mathieu Habert ,  Bruno Agostini

IPC: H05K7/20 ,  H01L23/427 ,  F28F27/02

Abstract: A heat exchanger assembly is disclosed. The heat exchanger assembly comprises at least one passive cooling circuit, the passive cooling circuit including an evaporator connectable to a device to be cooled for conducting heat from the device to be cooled to the cooling fluid within the evaporator, thereby evaporating the cooling fluid, and a condenser interconnected with the evaporator for receiving the evaporated cooling fluid from the evaporator, releasing heat from the cooling fluid to an environment of the condenser, thereby condensing the cooling fluid, and for returning the condensed cooling fluid to the evaporator; and an active partial circuit comprising a compressor and an auxiliary condenser, the active partial circuit being activatable and deactivatable and being connected to the passive cooling circuit for receiving, in an activated state of the active partial circuit, the cooling fluid from the evaporator, for compressing the received cooling fluid by the compressor, for releasing heat, by the auxiliary condenser, from the compressed cooling fluid to an environment of the auxiliary condenser, and for returning the condensed cooling fluid to the evaporator. Furthermore, the passive cooling circuit is a base-to-air type thermosiphon or an air-to-air type thermosiphon.

公开(公告)号：US10096538B2

公开(公告)日：2018-10-09

申请号：US15485676

申请日：2017-04-12

Applicant: ABB Schweiz AG

Inventor： Bruno Agostini ,  Daniele Torresin ,  Francesco Agostini ,  Mathieu Habert ,  Munaf Rahimo

IPC: H01L23/427 ,  H01L29/16 ,  H01L29/739 ,  H01L29/78 ,  H05K7/20 ,  F25B25/00 ,  H01L23/473 ,  H01L29/20 ,  H01L29/32 ,  H01L29/22

Abstract: A power device comprises at least one power semiconductor module comprising a wide bandgap semiconductor element; and a cooling system for actively cooling the wide bandgap semiconductor element with a cooling medium, wherein the cooling system comprises a refrigeration device for lowering a temperature of the cooling medium below an ambient temperature of the power device; wherein the cooling system is adapted for lowering the temperature of the cooling medium in such a way that a temperature of the wide bandgap semiconductor element is below 100° C.

公开(公告)号：US10080315B2

公开(公告)日：2018-09-18

申请号：US15275428

申请日：2016-09-25

Applicant: ABB Schweiz AG

Inventor： Francesco Agostini ,  Daniele Torresin ,  Mathieu Habert ,  Bruno Agostini

IPC: H05K7/20 ,  F28F13/10 ,  F28F9/02 ,  F28D15/02

CPC classification number: H05K7/20936 ,  F28D15/025 ,  F28D15/0266 ,  F28D15/0275 ,  F28F9/0278 ,  F28F13/10 ,  H05K7/209

Abstract: A cooling device for cooling at least two power electronic devices by a working fluid. The cooling device has a heat receiver portion of the Pulsating Heat Pipe circuit system and a pair of thermo-conducting walls provided on mutually opposite sides of the heat receiver arrangement and sandwiching the heat receiver portion between them. These walls are adapted for being thermally connected to a respective one of the power electronic devices. The cooling device further has a heat dissipator arrangement with a heat dissipator portion of the Pulsating Heat Pipe circuit system and a plurality of fins thermally coupled to the heat dissipator portion for transferring heat from the heat dissipator portion to an external cooling fluid for cooling the working fluid in the heat dissipator portion. The Pulsating Heat Pipe circuit system connects the heat receiver portion with the heat dissipator portion for transferring heat from the heat receiver portion to the heat dissipator portion by the Pulsating Heat Pipe action of the working fluid.

公开(公告)号：US10748682B2

公开(公告)日：2020-08-18

申请号：US15610420

申请日：2017-05-31

Applicant: ABB Schweiz AG

Inventor： Colin Tschida ,  Pietro Cairoli ,  Francesco Agostini ,  Daniele Torresin ,  Davide Leoni ,  Luca Raciti ,  Zhiguo Pan

IPC: H01C7/12 ,  H01C1/02 ,  H01L23/46 ,  H01B17/54 ,  H03K17/082 ,  H02H9/04 ,  H01H9/52 ,  H01H9/54

Abstract: A surge arrester system includes a surge arrester, and an active cooling system having a cooling interface in contact with the surge arrester and operative to transfer heat from the surge arrester. The active cooling system includes a forced convection apparatus operative to provide forced convection cooling. A circuit breaker system includes a power semiconductor switch and an active cooling system constructed to cool the power semiconductor switch. The active cooling system includes a forced convection apparatus configured to provide forced convection cooling. The power semiconductor switch is in contact with the active cooling system. A surge arrester is disposed adjacent to and in contact with the active cooling system. The active cooling system includes a cooling interface constructed for contact with the surge arrester and operative to provide cooling to the surge arrester. The power semiconductor switch and the surge arrester dissipate power alternatively.

公开(公告)号：US20170082379A1

公开(公告)日：2017-03-23

申请号：US15272137

申请日：2016-09-21

Applicant: ABB Schweiz AG

Inventor： Bruno Agostini ,  Daniele Torresin ,  Francesco Agostini ,  Mathieu Habert ,  Timo Koivuluoma

IPC: F28D15/04 ,  F28F3/02 ,  F28F13/10 ,  F28D15/02

CPC classification number: F28D15/046 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28D15/0283 ,  F28D15/04 ,  F28D2021/0029 ,  F28F3/02 ,  F28F3/025 ,  F28F13/10 ,  F28F2215/06 ,  H01L23/427 ,  H01L23/467

Abstract: A cooling assembly comprising a plurality of fin elements stacked in a stack direction, a plurality of coolant channels each located between adjacent fin elements and extending in a coolant channel direction perpendicular to the stack direction, a first heat transfer surface adapted to be in contact with a heat generating element, and a second heat transfer surface spaced apart from the first heat transfer surface, the plurality of fin elements and the plurality of coolant channels being located between the first heat transfer surface and the second heat transfer surface. Each of the fin elements comprises a pulsating heat pipe embedded therein, a main pulsating direction of each of the pulsating heat pipes being substantially parallel to a normal of the first heat transfer surface.