Production Method of Self-Magnetised Net-Shape Permanent Magnets by Additive Manufacturing

    公开(公告)号:US20220172889A1

    公开(公告)日:2022-06-02

    申请号:US17434664

    申请日:2020-02-21

    Applicant: ABB Schweiz AG

    Abstract: A method of producing a permanent magnet includes forming a magnetisable workpiece by additive manufacturing and forming the permanent magnet by partitioning the magnetisable workpiece. The additive manufacturing includes steps of forming a first powder layer by depositing a first powder, the first powder being ferromagnetic; forming a first workpiece layer of the magnetisable workpiece by irradiating a predetermined first area of the first powder layer by means of a focused energy beam to fuse the first powder in the first area; and repeating the above steps multiple times to form further workpiece layers of the magnetisable workpiece. The permanent magnet is formed by partitioning the magnetisable workpiece, where an exposed surface of the permanent magnet formed by the partitioning is non-parallel to the first workpiece layer, and where the permanent magnet produces an external magnetic field having a magnetic field strength of at least 1 kA/m.

    TWO-PHASE HEAT TRANSFER DEVICE FOR HEAT DISSIPATION

    公开(公告)号:US20210125894A1

    公开(公告)日:2021-04-29

    申请号:US17084009

    申请日:2020-10-29

    Applicant: ABB Schweiz AG

    Abstract: The invention relates to a two-phase heat transfer device for dissipating heat from a heat source, for instance a power semiconductor module, by a heat transfer medium, wherein the two-phase heat transfer device includes a main body, wherein the main body is formed by a body material and includes a multi-dimensional void network, wherein the multi-dimensional void network includes voids and is adapted for containing the heat transfer medium, wherein the multi-dimensional void network is adapted such that a flow of the heat transfer medium along a path through the main body is based on a variation in capillary action exerted by the multi-dimensional void network on the heat transfer medium along the path. Further the invention relates to a power semiconductor module comprising the above two-phase heat transfer device for heat dissipation and to a method for producing the above two-phase heat transfer device.

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