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    HIGH DENSITY PATCHING SYSTEM
    16.
    发明专利
    HIGH DENSITY PATCHING SYSTEM 未知

    公开(公告)号：CA2370263C

    公开(公告)日：2009-12-22

    申请号：CA2370263

    申请日：2000-04-11

    Applicant: ADC TELECOMMUNICATIONS INC

    Inventor： ADAMS PETER W ,  CONROY JAMES W ,  FOLLINGSTAD MICHAEL JAY

    IPC: H01R13/71 ,  H04Q1/14 ,  H01R12/04 ,  H01R12/16 ,  H01R13/518 ,  H01R13/64 ,  H01R31/06 ,  H01R31/08

    Abstract: The present disclosure relates to high density patching system. The system includes a card housing having a front end positioned opposite from a rear end. The card housing includes top and bottom walls extending between the front and rear ends. The top and bottom walls define opposing sets of top and bottom slots. The patching system also includes a plurality of patch cords including patch plugs each having a width W1 and a height H1. The patching system further includes a plurality of jack access cards adapted to be mounted in the card housing, and a rear interface module positioned at the rear end of the card housing. The jack access cards include circuit boards having top and bottom edges adapted to fit within the sets of top and bottom slots defined by the card housing. The jack access cards also include a plurality of card edge contacts positioned at a rear of each circuit board . The jack access cards further include front interface pieces having heights H2 that are greater than two times the height H1, and widths W2 that are each less than two times the width W1. The front interface pieces each define upper and lower patch plug ports that are vertically spaced along the height H2 of each front interface piece. The upper and lower patch plug ports are sized and shaped to receive onlya single one of the patch plugs at a time. The rear interface module includes a single row of card edge connectors adapted for providing electrical connections with the card edge contacts of the jack access cards. The rear interface module also includes an array of rear connectors including upper and lower rows of rear connectors. The array of rear connectors is electrically connected to the card edge connecto rs by a flexible circuit board. The rear interface module also includes a frame that spaces the card edge connectors from the rear connectors. The frame includes a rear wall defining upper and lower rows of openings that respectively receive the upper and lower rows of rear connectors.

    FIBER OPTIC CONNECTOR HOLDER AND METHOD
    18.
    发明专利
    FIBER OPTIC CONNECTOR HOLDER AND METHOD 未知

    公开(公告)号：CA2529408A1

    公开(公告)日：2005-01-20

    申请号：CA2529408

    申请日：2004-06-23

    Applicant: ADC TELECOMMUNICATIONS INC

    Inventor： WALTERS CINDY S ,  CONROY JAMES W ,  TINUCCI THOMAS C ,  SMITH TREVOR D

    IPC: G02B6/38

    Abstract: The present invention relates to a fiber optic connector holder sized to fit within an opening for mounting a fiber optic adapter. The fiber optic connector holder is configured to permit a fiber optic connector with a dust cap positioned about a ferrule and a polished end face of an optical fiber held by the ferrule to be inserted within and releasably held by the connect or holder. The present invention further relates to a system for holding fiber optic connectors including a fiber optic connector holder mounted within an opening in a bulkhead for mounting a fiber optic adapter. The fiber optic connector holder is configured to receive a fiber optic connector with a dus t cap mounted about a ferrule and polished end face of an optical fiber held b y the ferrule. The present invention also relates to a method of holding an optical fiber connector to a bulkhead, when the fiber optic connector includ es a dust cap mounted about a ferrule and polished end face of an optical fiber held by the ferrule.

    HIGH DENSITY PATCHING SYSTEM
    20.
    发明专利
    HIGH DENSITY PATCHING SYSTEM 未知

    公开(公告)号：CA2370263A1

    公开(公告)日：2000-10-26

    申请号：CA2370263

    申请日：2000-04-11

    Applicant: ADC TELECOMMUNICATIONS INC

    Inventor： CONROY JAMES W ,  FOLLINGSTAD MICHAEL JAY ,  ADAMS PETER W

    IPC: H01R13/71 ,  H01R12/04 ,  H01R12/16 ,  H01R13/518 ,  H01R13/64 ,  H01R31/06 ,  H01R31/08 ,  H04Q1/14

    Abstract: The present disclosure relates to high density patching system. The system includes a card housing having a front end positioned opposite from a rear end. The card housing includes top and bottom walls extending between the front and rear ends. The top and bottom walls define opposing sets of top an d bottom slots. The patching system also includes a plurality of patch cords including patch plugs each having a width WI and a height HI. The patching system further includes a plurality of jack access cards adapted to be mount ed in the card housing, and a rear interface module positioned at the rear end of the card housing. The jack access cards include circuit boards having top an d bottom edges adapted to fit within the sets of top and bottom slots defined by the card housing. The jack access cards also include a plurality of card edg e contacts positioned at a rear of each circuit board. The jack access cards further include front interface pieces having heights H2 that are greater th an two times the height H1, and widths W2 that are each less than two times the width W1. The front interface pieces each define upper and lower patch plug ports that are vertically spaced along the height H2 of each front interface piece. The upper and lower patch plug ports are sized and shaped to receive onlya single one of the patch plugs at a time. The rear interface module includes a single row of card edge connectors adapted for providing electric al connections with the card edge contacts of the jack access cards. The rear interface module also includes an array of rear connectors including upper a nd lower rows of rear connectors. The array of rear connectors is electrically connected to the card edge connectors by a flexible circuit board. The rear interface module also includes a frame that spaces the card edge connectors from the rear connectors. The frame includes a rear wall defining upper and lower rows of openings that respectively receive the upper and lower rows of rear connectors.

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