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    ELECTRONIC SIGNAL TRANSMISSION AND SWITCHING JACK
    2.
    发明申请
    ELECTRONIC SIGNAL TRANSMISSION AND SWITCHING JACK 审中-公开
    电子信号传输和开关插座

    公开(公告)号：WO02082585A2

    公开(公告)日：2002-10-17

    申请号：PCT/US0209932

    申请日：2002-03-28

    Applicant: ADC TELECOMMUNICATIONS INC

    Inventor： FOLLINGSTAD MICHAEL JAY ,  ADAMS PETER W ,  PETERS JEFFREY LOUIS

    IPC: H01R13/703 ,  H04Q1/02 ,  H04Q1/14 ,  H01R

    CPC classification number: H01H23/006 ,  H01R12/721 ,  H01R13/703 ,  H04Q2201/10 ,  H04Q2201/12

    Abstract: The present invention relates to an electronic signal switching module with connectors on a first side for connecting with a variety of devices and sources and with jacks for receiving patch cords on a second side. The switching modules include two position switches in the circuitry connecting the jacks with the connectors which allow the module to be configured as a straight-through patching module, a fully normal module with paired jacks or a half normal module with paired jacks. One alternative of the invention utilizes card edge connectors on the first side. Another aspect of the invention involves a chassis for holding a plurality of switching modules adjacent to and electronically connected with a plurality of connecting modules. The switching modules may also include designation lenses adjacent to the jacks for holding indicia.

    Abstract translation: 本发明涉及一种电子信号切换模块，其具有在第一侧上的连接器，用于连接各种设备和源以及用于在第二侧接收跳线的插孔。 开关模块包括将插座与连接器连接的电路中的两个位置开关，其允许模块被配置为直通修补模块，具有配对插孔的完全正常模块或具有成对插孔的半正常模块。 本发明的一个替代方案是利用第一侧上的卡缘连接器。 本发明的另一方面涉及用于保持与多个连接模块相邻并且与多个连接模块电子连接的多个切换模块的底盘。 开关模块还可以包括与用于保持标记的插孔相邻的指定透镜。

    HIGH DENSITY PATCHING SYSTEM
    3.
    发明专利
    HIGH DENSITY PATCHING SYSTEM 未知

    公开(公告)号：CA2370263C

    公开(公告)日：2009-12-22

    申请号：CA2370263

    申请日：2000-04-11

    Applicant: ADC TELECOMMUNICATIONS INC

    Inventor： ADAMS PETER W ,  CONROY JAMES W ,  FOLLINGSTAD MICHAEL JAY

    IPC: H01R13/71 ,  H04Q1/14 ,  H01R12/04 ,  H01R12/16 ,  H01R13/518 ,  H01R13/64 ,  H01R31/06 ,  H01R31/08

    Abstract: The present disclosure relates to high density patching system. The system includes a card housing having a front end positioned opposite from a rear end. The card housing includes top and bottom walls extending between the front and rear ends. The top and bottom walls define opposing sets of top and bottom slots. The patching system also includes a plurality of patch cords including patch plugs each having a width W1 and a height H1. The patching system further includes a plurality of jack access cards adapted to be mounted in the card housing, and a rear interface module positioned at the rear end of the card housing. The jack access cards include circuit boards having top and bottom edges adapted to fit within the sets of top and bottom slots defined by the card housing. The jack access cards also include a plurality of card edge contacts positioned at a rear of each circuit board . The jack access cards further include front interface pieces having heights H2 that are greater than two times the height H1, and widths W2 that are each less than two times the width W1. The front interface pieces each define upper and lower patch plug ports that are vertically spaced along the height H2 of each front interface piece. The upper and lower patch plug ports are sized and shaped to receive onlya single one of the patch plugs at a time. The rear interface module includes a single row of card edge connectors adapted for providing electrical connections with the card edge contacts of the jack access cards. The rear interface module also includes an array of rear connectors including upper and lower rows of rear connectors. The array of rear connectors is electrically connected to the card edge connecto rs by a flexible circuit board. The rear interface module also includes a frame that spaces the card edge connectors from the rear connectors. The frame includes a rear wall defining upper and lower rows of openings that respectively receive the upper and lower rows of rear connectors.

    HIGH DENSITY PATCHING SYSTEM
    6.
    发明专利
    HIGH DENSITY PATCHING SYSTEM 未知

    公开(公告)号：CA2370263A1

    公开(公告)日：2000-10-26

    申请号：CA2370263

    申请日：2000-04-11

    Applicant: ADC TELECOMMUNICATIONS INC

    Inventor： CONROY JAMES W ,  FOLLINGSTAD MICHAEL JAY ,  ADAMS PETER W

    IPC: H01R13/71 ,  H01R12/04 ,  H01R12/16 ,  H01R13/518 ,  H01R13/64 ,  H01R31/06 ,  H01R31/08 ,  H04Q1/14

    Abstract: The present disclosure relates to high density patching system. The system includes a card housing having a front end positioned opposite from a rear end. The card housing includes top and bottom walls extending between the front and rear ends. The top and bottom walls define opposing sets of top an d bottom slots. The patching system also includes a plurality of patch cords including patch plugs each having a width WI and a height HI. The patching system further includes a plurality of jack access cards adapted to be mount ed in the card housing, and a rear interface module positioned at the rear end of the card housing. The jack access cards include circuit boards having top an d bottom edges adapted to fit within the sets of top and bottom slots defined by the card housing. The jack access cards also include a plurality of card edg e contacts positioned at a rear of each circuit board. The jack access cards further include front interface pieces having heights H2 that are greater th an two times the height H1, and widths W2 that are each less than two times the width W1. The front interface pieces each define upper and lower patch plug ports that are vertically spaced along the height H2 of each front interface piece. The upper and lower patch plug ports are sized and shaped to receive onlya single one of the patch plugs at a time. The rear interface module includes a single row of card edge connectors adapted for providing electric al connections with the card edge contacts of the jack access cards. The rear interface module also includes an array of rear connectors including upper a nd lower rows of rear connectors. The array of rear connectors is electrically connected to the card edge connectors by a flexible circuit board. The rear interface module also includes a frame that spaces the card edge connectors from the rear connectors. The frame includes a rear wall defining upper and lower rows of openings that respectively receive the upper and lower rows of rear connectors.

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