公开(公告)号：WO2008006045A3

公开(公告)日：2008-03-27

申请号：PCT/US2007072901

申请日：2007-07-06

Applicant: ADVANCED INTERCONNECTIONS ,  GOODMAN GLENN

Inventor： GOODMAN GLENN

IPC: G01R1/04 ,  H01L23/32 ,  H01R13/24

CPC classification number: H01R13/2421 ,  G01R1/0483 ,  H01L23/4338 ,  H01L2924/0002 ,  H05K7/1069 ,  H01L2924/00

Abstract: An intercoupling component used to couple an array of electrical connection regions disposed on a first substrate to an array of electrical connection regions disposed on a second substrate. The intercoupling component includes an insulative support member including an array of holes extending therethrough, the array of holes located in a pattern corresponding to the array of electrical connection regions on the first substrate; and a plurality of terminals. Each terminal includes a socket including a socket head and a socket body, the socket defining a socket cavity; a pin including a pin head and a pin body, the pin head positioned within one of the array of holes, the pin body extending from the pin head and received at least partially within the socket cavity; and a resilient member configured to bias the socket head is biased away from the pin head.

Abstract translation: 用于将设置在第一基板上的电连接区域阵列耦合到设置在第二基板上的电连接区域阵列的互耦组件。 所述互耦组件包括绝缘支撑构件，所述绝缘支撑构件包括延伸穿过其中的孔阵列，所述阵列阵列以对应于所述第一基板上的电连接区域阵列的图案定位; 和多个终端。 每个终端包括一个包括一个插座头和一个插座主体的插座，该插座限定一个插座腔; 销钉包括销头和销体，所述销头位于所述孔阵列之一内，所述销体从所述销头延伸并至少部分地容纳在所述插座腔内; 并且构造成偏置插座头的弹性构件被偏压远离销头。

公开(公告)号：EP1787361A4

公开(公告)日：2010-07-21

申请号：EP05784437

申请日：2005-08-09

Applicant: ADVANCED INTERCONNECTIONS

Inventor： GOODMAN GLENN ,  MURPHY JAMES V

IPC: H01R24/18 ,  H01R12/22 ,  H01R13/631

CPC classification number: H01R12/714 ,  H01R12/716 ,  H01R13/631 ,  H01R24/84