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公开(公告)号：CA2029466A1
公开(公告)日：1991-05-10
申请号：CA2029466
申请日：1990-11-07
Applicant: ADVANCED INTERCONNECTIONS
Inventor： MURPHY JAMES V
IPC: H01R33/76 , B23P19/00 , H01R9/00 , H01R12/52 , H01R13/11 , H01R31/06 , H01R33/94 , H05K3/30 , H05K7/10
Abstract: An apparatus and method are disclosed for making connections between the pins of a multi-pin component and sockets mounted on a circuit board. A plurality of converter elements are installed between the component pins and sockets. Each converter element includes a receptor for mating with a pin of the multiple pin component. The receptor is sized to engage a pin having any diameter within a coarse range of diameters. Each converter element also includes a precision pin for mating with a socket on the circuit board. The diameter of the precision pin is held to a tolerance so that it is within a precision range of diameters. The variation in diameter within the precision range is less than the variation within the coarse range of diameters.
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公开(公告)号：US20180083379A1
公开(公告)日：2018-03-22
申请号：US15707362
申请日：2017-09-18
Applicant: Advanced Interconnections Corp.
Inventor： Burton J. Fisher , Glenn Goodman
IPC: H01R13/28 , H01R13/05 , H01R13/213
CPC classification number: H01R13/28 , H01R12/7082 , H01R12/716 , H01R13/052 , H01R13/111 , H01R13/213
Abstract: A terminal assembly includes an insulating support member including first and second arrays of apertures, each aperture extending from an upper surface of the insulating support member to an opposite lower surface of the insulating support member. The terminal assembly also includes first and second terminals for providing electrical connections arranged in a configuration corresponding with the first and second arrays of apertures. Each of the first terminals is received within a corresponding aperture of the first array of apertures and has an end with an opening configured to receive one of the first plurality of terminals and an opposite end configured to contact a corresponding electrical contact. Each of the second terminals is received within a corresponding aperture of the second array of apertures and has an end configured to be received within a socket and an opposite end configured to contact a corresponding electrical contact.
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公开(公告)号：US09577375B2
公开(公告)日：2017-02-21
申请号：US14832093
申请日：2015-08-21
Applicant: Advanced Interconnections Corp.
Inventor： Glenn Goodman
IPC: H01R12/00 , H01R13/629 , H01R12/91 , H05K7/10
CPC classification number: H01R13/629 , H01R12/7076 , H01R12/91 , H05K7/10
Abstract: A connector alignment assembly comprises a support member having a surface from which an array of male connector pins extend outwardly, each male connector pin having a base region proximate the surface of the support member and a tip region proximate the end of each male connector pin. Guide posts extend from the surface in the direction of the array of male connector pins and compression mechanisms, one associated with each of the guide posts. The compression mechanisms are adapted to transition from the uncompressed position to a compressed position. An alignment plate has guide holes which engage with the guide posts to position the alignment plate in a spaced relationship from the surface of the support member. The alignment plate has an array of male connector pin holes which engage with the array of male connector pins.
Abstract translation: 连接器对准组件包括具有表面的支撑构件，阳连接器针阵列从该表面向外延伸，每个阳连接器销具有靠近支撑构件的表面的基部区域和靠近每个阳连接器针的端部的尖端区域。 引导柱从阳连接器针阵列和压缩机构的阵列的方向上从表面延伸，一个与每个引导柱相关联。 压缩机构适于从未压缩位置转换到压缩位置。 对准板具有与引导柱接合的引导孔，以将定位板定位成与支撑构件的表面成间隔开的关系。 对准板具有与阳连接器针阵列接合的阳连接器针孔的阵列。
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公开(公告)号：US20160064839A1
公开(公告)日：2016-03-03
申请号：US14832093
申请日：2015-08-21
Applicant: Advanced Interconnections Corp.
Inventor： Glenn Goodman
IPC: H01R12/70 , H01R13/629
CPC classification number: H01R13/629 , H01R12/7076 , H01R12/91 , H05K7/10
Abstract: A connector alignment assembly comprises a support member having a surface from which an array of male connector pins extend outwardly, each male connector pin having a base region proximate the surface of the support member and a tip region proximate the end of each male connector pin. Guide posts extend from the surface in the direction of the array of male connector pins and compression mechanisms, one associated with each of the guide posts. The compression mechanisms are adapted to transition from the uncompressed position to a compressed position. An alignment plate has guide holes which engage with the guide posts to position the alignment plate in a spaced relationship from the surface of the support member. The alignment plate has an array of male connector pin holes which engage with the array of male connector pins.
Abstract translation: 连接器对准组件包括具有表面的支撑构件，阳连接器针阵列从该表面向外延伸，每个阳连接器销具有靠近支撑构件的表面的基部区域和靠近每个阳连接器针的端部的尖端区域。 引导柱从阳连接器针阵列和压缩机构的阵列的方向上从表面延伸，一个与每个引导柱相关联。 压缩机构适于从未压缩位置转换到压缩位置。 对准板具有与引导柱接合的引导孔，以将定位板定位成与支撑构件的表面成间隔开的关系。 对准板具有与阳连接器针阵列接合的阳连接器针孔的阵列。
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公开(公告)号：US20040166704A1
公开(公告)日：2004-08-26
申请号：US10786248
申请日：2004-02-25
Inventor： Michael N. Perugini , Gary D. Eastman , Alfred J. Langon , Raymond A. Prew , Erol D. Saydam
IPC: H01R012/00
CPC classification number: H01R12/716 , H01R12/52 , H01R13/187 , H01R13/405 , H01R13/514 , H01R13/6471 , H01R13/6477 , H01R13/6586 , H01R13/6591 , H01R13/6598
Abstract: An intercoupling component for receiving an array of contacts includes a non-conductive substrate having a plurality of holes disposed on its upper surface and arranged in a predetermined footprint corresponding to the array of contacts. Contacts are disposed within the holes and a cavities, which may be open to air or filled with some other dielectric material, are disposed in the substrate between adjacent contacts.
Abstract translation: 用于接收触点阵列的相互耦合部件包括具有设置在其上表面上的多个孔并且以对应于触点阵列的预定尺寸布置的非导电衬底。 触点设置在孔内，并且可以对空气开放或填充有一些其它介电材料的空腔设置在相邻触点之间的基板中。
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Patent Agency Ranking
公开(公告)号：WO2006055307A2
公开(公告)日：2006-05-26
申请号：PCT/US2005040248
申请日：2005-11-04
Applicant: ADVANCED INTERCONNECTIONS , GOODMAN GLENN , EASTMAN GARY D , LANGON ALFRED J , SAYDAM EROL D
Inventor： GOODMAN GLENN , EASTMAN GARY D , LANGON ALFRED J , SAYDAM EROL D
CPC classification number: G01R1/0483 , H01R2201/20 , Y10T29/5313 , Y10T29/53183 , Y10T29/53213 , Y10T29/53283
Abstract: A compression device has a frame sized to accept an integrated circuit package and a pressor. The frame includes a surface defining an opening with an axis and at least one ramp extending from the surface. The ramp or ramps have upper and lower flat portions, substantially parallel with a plane perpendicular to the axis, and a sloped portion at an angle relative to the plane, the sloped portion connecting the upper and lower flat portions. The pressor is configured to engage the ramp and rotate in response to applied force. When the pressor is engaged with the sloped portion(s) of the ramp(s), this rotation causes movement of the pressor along the axis. However, when engagement between the ramps and the pressor is in the flat portions of the ramp, continued movement of the pressor along the axis is limited in spite of any continued rotation.
Abstract translation: 压缩装置具有尺寸适于接收集成电路封装和加压件的框架。 框架包括限定具有轴线的开口的表面和从表面延伸的至少一个斜面。 斜坡或斜坡具有大致平行于垂直于该轴线的平面的上部平坦部分和下部平坦部分，以及连接上部和下部平坦部分的倾斜部分，该部分与该平面成一定角度。 加压件构造成接合斜坡并响应于施加的力而旋转。 当加压件与斜面的倾斜部分接合时，该旋转引起加压件沿轴线的移动。 然而，当斜面和加压件之间的接合处于斜面的平坦部分中时，加压件沿轴线的继续移动受到限制，尽管有任何持续的旋转。
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公开(公告)号：WO9966599A8
公开(公告)日：2000-03-09
申请号：PCT/US9913038
申请日：1999-06-11
Applicant: ADVANCED INTERCONNECTIONS
Inventor： MURPHY JAMES V
CPC classification number: H01R43/0235 , H05K3/3426 , H05K3/3436 , H05K3/3478 , H05K7/1084
Abstract: A method of providing such an intercoupling component (10) includes positioning terminals (50) within holes (64) of an insulative support member (62) and attaching a solder ball (52) to each of the terminals. Attaching the solder balls to the terminals is accomplished using a fixture having a number of recesses located in a pattern corresponding to a pattern of the holes in the insulative support member; filling each of the recesses with a solder ball; positioning the insulative support member over the fixture so that an end of each of the terminals contact a corresponding solder ball soldering the solder ball to the end of the terminal while maintaining the generally spherical of the solder ball.
Abstract translation: 提供这种相互耦合部件（10）的方法包括在绝缘支撑部件（62）的孔（64）内定位端子（50）并将焊球（52）附接到每个端子。 使用具有位于与绝缘支撑构件中的孔的图案对应的图案的多个凹部的固定器来实现将焊球附接到端子上; 用焊球填充每个凹槽; 将绝缘支撑构件定位在固定装置上，使得每个端子的端部接触将焊球焊接到端子的相应焊球，同时保持焊球的大致球形。
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公开(公告)号：US20040192089A1
公开(公告)日：2004-09-30
申请号：US10820296
申请日：2004-04-08
Inventor： Michael N. Perugini , Gary D. Eastman , Alfred J. Langon , Raymond A. Prew , Erol D. Saydam
IPC: H01R012/00
CPC classification number: H01R12/716 , H01R12/52 , H01R13/187 , H01R13/405 , H01R13/514 , H01R13/6471 , H01R13/6477 , H01R13/6586 , H01R13/6591 , H01R13/6598
Abstract: An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component including a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint and one or more a shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts within the plurality of holes disposed on the segment. One or more of these contacts may be configured to electrically connect with the electrical ground circuit of the system. The intercoupling component may also include a cavity located between signal contacts to adjust the differential impedance between signal contacts.
Abstract translation: 一种用于在具有电接地电路和底盘接地电路的数字或模拟传输系统内接收接触阵列的相互耦合部件，所述互耦部件包括由电绝缘材料形成并具有上表面和下表面的部分，所述部分包括多个 设置在其上表面上并且以预定的占地面积布置的孔，以及一个或多个由导电材料形成的屏蔽构件，该屏蔽构件设置在该段内并被配置为连接到该系统的底盘接地电路。 相互耦合部件可以包括在设置在片段上的多个孔内的导电触点阵列。 这些触点中的一个或多个可以被配置为与系统的电接地电路电连接。 相互耦合分量还可以包括位于信号触点之间的空腔，以调节信号触点之间的差分阻抗。
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公开(公告)号：CA2490096A1
公开(公告)日：2003-12-31
申请号：CA2490096
申请日：2003-06-24
Applicant: ADVANCED INTERCONNECTIONS
Inventor： PREW RAYMOND A , LANGON ALFRED J , PERUGINI MICHAEL , EASTMAN GARY D , SAYDAM EROL D
IPC: H01R13/648 , H05K9/00
Abstract: An intercoupling component for receiving an array of contacts within a digit al or analog transmission system having an electrical ground circuit and chassi s ground circuit, the intercoupling component including a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint and one or more shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts within th e plurality of holes disposed on the segment. One or more of these contacts ma y be configured to electrically connect with the electrical ground circuit of the system. The intercoupling component may also include a cavity located between signal contacts to adjust the differential impedance between signal contacts.
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