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    SYSTEMS AND METHODS FOR COOLING ELECTRONIC DEVICES USING AIRFLOW DIVIDERS
    12.
    发明申请
    SYSTEMS AND METHODS FOR COOLING ELECTRONIC DEVICES USING AIRFLOW DIVIDERS 审中-公开
    使用气流分流器冷却电子设备的系统和方法

    公开(公告)号：WO2009088862A3

    公开(公告)日：2010-02-25

    申请号：PCT/US2008088542

    申请日：2008-12-30

    Applicant: APPLE INC ,  ALI IHAB A ,  MATHEW DINESH ,  WILSON THOMAS W JR ,  HENDREN KEITH

    Inventor： ALI IHAB A ,  MATHEW DINESH ,  WILSON THOMAS W JR ,  HENDREN KEITH

    IPC: G06F1/20 ,  H01L23/34

    CPC classification number: G06F1/203 ,  H01L23/4093 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An electronic device can be provided with a heat-generating component and a cooling module for dissipating heat. In some embodiments, the cooling component may include a fan configured to produce an outflow of air, and a divider configured not only to direct a first portion of the outflow between a first surface of the divider and the heat-generating component, but also to direct a second portion of the outflow along a second surface of the divider. In other embodiments, the cooling component may include a divider and a pressure clip. A first portion of the pressure clip may be configured to exert a pressure on a first surface of the divider such that the pressure may hold a portion of a second surface of the divider in contact with the heat-generating component.

    Abstract translation: 电子设备可以设置有用于散热的发热部件和冷却模块。 在一些实施例中，冷却部件可以包括构造成产生空气流出的风扇，以及分配器，其不仅构造成在分隔器的第一表面和发热部件之间引导流出物的第一部分，而且还 沿着分隔器的第二表面引导流出物的第二部分。 在其他实施例中，冷却部件可以包括分隔器和压力夹。 压力夹的第一部分可以构造成在分隔器的第一表面上施加压力，使得压力可以保持分隔器的第二表面的一部分与发热部件接触。

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