公开(公告)号：US11159869B2

公开(公告)日：2021-10-26

申请号：US16584914

申请日：2019-09-26

Applicant: Apple Inc.

Inventor： Scott C. Grinker ,  Esge Andersen ,  Ethan L. Huwe ,  Benjamin A. Cousins ,  Samuel G. Parker ,  Sean T. McIntosh ,  Jason C. Della Rosa ,  Craig M. Stanley ,  Edward Siahaan ,  Ethan W. Juhnke

IPC: H04R1/10 ,  G01V3/08 ,  A45C11/00 ,  A45C13/00 ,  E05F1/12 ,  E05F3/20 ,  H01F7/02 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03 ,  H04R1/02 ,  H04B1/38 ,  H04B1/3827

Abstract: Embodiments describe an eartip including an eartip body having an attachment end and an interfacing end opposite from the attachment end, and an attachment structure coupled to the inner eartip body at the attachment end. The eartip body can include: an inner eartip body having a sidewall extending between the interfacing end and the attachment end, the sidewall defining a channel and having a first thickness near the attachment end and a second thickness different from the first thickness at the interfacing end; and an outer eartip body sized and shaped to be inserted into an ear canal and extending from the interfacing end, the outer eartip body extending toward the attachment end of the eartip. The attachment structure including a sidewall extending around a periphery of the attachment structure and defining an opening extending through the sidewall that fluidly couples the channel to an ambient environment.

公开(公告)号：US20210274273A1

公开(公告)日：2021-09-02

申请号：US17306683

申请日：2021-05-03

Applicant: Apple Inc.

Inventor： Arun D. Chawan ,  Kurt Stiehl ,  Benjamin A. Cousins ,  Jonathan S. Aase ,  Yacine Azmi ,  Paul Choiniere ,  Scott W. Slabaugh

IPC: H04R1/10 ,  A45C11/00 ,  H04R5/033 ,  A45C13/02 ,  H02J50/10 ,  H02J7/00 ,  H04R1/28 ,  H04R1/34 ,  B65D25/02 ,  B65D43/16 ,  H04R1/02 ,  H04B1/3888 ,  H04B5/00 ,  A45C11/24 ,  A45C13/10 ,  H04R9/02 ,  H04R9/06 ,  H01R13/52 ,  A45C13/00

Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.

公开(公告)号：US11026010B2

公开(公告)日：2021-06-01

申请号：US16870373

申请日：2020-05-08

Applicant: Apple Inc.

Inventor： Arun D. Chawan ,  Kurt Stiehl ,  Benjamin A. Cousins ,  Jonathan S. Aase ,  Yacine Azmi ,  Paul Choiniere ,  Scott W. Slabaugh

IPC: H04R1/10 ,  A45C11/00 ,  H04R5/033 ,  A45C13/02 ,  H02J50/10 ,  H02J7/00 ,  H04R1/28 ,  H04R1/34 ,  B65D25/02 ,  B65D43/16 ,  H04R1/02 ,  H04B1/3888 ,  H04B5/00 ,  A45C11/24 ,  A45C13/10 ,  H04R9/02 ,  H04R9/06 ,  H02J7/02 ,  H01R13/52 ,  A45C13/00 ,  H04B1/3827 ,  H04M1/60 ,  F16B1/00

Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.

公开(公告)号：US20200288229A1

公开(公告)日：2020-09-10

申请号：US16882020

申请日：2020-05-22

Applicant: Apple Inc.

Inventor： Arun D. Chawan ,  Kurt Stiehl ,  Benjamin A. Cousins ,  Jonathan S. Aase ,  Yacine Azmi ,  Paul Choiniere ,  Scott W. Slabaugh

IPC: H04R1/10 ,  A45C11/00 ,  H04R5/033 ,  A45C13/02 ,  H04R1/28 ,  H04R1/34 ,  B65D25/02 ,  B65D43/16 ,  H04R1/02 ,  H04B1/3888 ,  H04B5/00 ,  A45C11/24 ,  A45C13/10 ,  H04R9/02 ,  H04R9/06 ,  H02J7/00 ,  H01R13/52 ,  A45C13/00

Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.

公开(公告)号：US20190289383A1

公开(公告)日：2019-09-19

申请号：US16430853

申请日：2019-06-04

Applicant: Apple Inc.

Inventor： Arun D. Chawan ,  Kurt Stiehl ,  Benjamin A. Cousins ,  Jonathan S. Aase ,  Yacine Azmi ,  Paul Choiniere ,  Scott W. Slabaugh

IPC: H04R1/10 ,  A45C11/24 ,  H02J7/02 ,  A45C13/02 ,  H04R1/28 ,  H04R1/34 ,  B65D25/02 ,  B65D43/16 ,  H04R1/02 ,  H04B1/3888 ,  H04B5/00 ,  A45C13/10 ,  A45C13/00 ,  H04R5/033 ,  A45C11/00 ,  H01R13/52 ,  H02J7/00 ,  H04R9/06 ,  H04R9/02

Abstract: An earbud includes a housing that includes a driver assembly positioned within the housing forming a front volume in front of the driver and a back volume behind the driver. An acoustic insert is positioned behind the driver assembly and attached to an interior surface of the housing such that it forms a bass channel that is routed from the back volume to a vent in the housing.

公开(公告)号：US09946295B2

公开(公告)日：2018-04-17

申请号：US15256433

申请日：2016-09-02

Applicant: Apple Inc.

Inventor： Samuel Gilkison Smith ,  Daniel J. Coster ,  Sean S. Corbin ,  Melody L. Kuna ,  Siddhartha Hegde ,  Benjamin A. Cousins ,  Robert Sean Murphy

IPC: G06F1/16 ,  G06F1/20

CPC classification number: G06F1/1628 ,  G06F1/1615 ,  G06F1/1654 ,  G06F1/1656 ,  G06F1/1669 ,  G06F1/1681 ,  G06F1/20 ,  G06F2200/1633

Abstract: An accessory device for use with an electronic device is disclosed. The accessory device may include a cover configured to overlay an electronic device (or device) or fold to form a support structure for the electronic device. The cover may include an attachment feature that electrically couples with the device, and a keyboard foldable with respect to the cover. Further, the keyboard may include a retention feature designed to receive the attachment feature in a folded configuration of the cover. The accessory device may further include an electrically conductive fabric that folds with the cover. The accessory device may include an array of magnets throughout the attachment feature, the cover, and the keyboard. The magnets may be used to magnetically couple together 1) segments of the cover, 2) the cover and the keyboard assembly, 3) and/or the device with the cover.

公开(公告)号：US09883583B2

公开(公告)日：2018-01-30

申请号：US14843617

申请日：2015-09-02

Applicant: Apple Inc.

Inventor： Benjamin A. Cousins ,  Kurt R. Stiehl ,  Samuel G. Smith ,  Kirk M. Mayer ,  Siddhartha Hegde ,  Melody Kuna

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/10 ,  G06F1/16 ,  H05K1/09 ,  H05K1/11 ,  A45C13/00 ,  H04M1/18 ,  H04M1/23 ,  A45C11/00

CPC classification number: H05K1/028 ,  A45C13/005 ,  A45C2011/003 ,  G06F1/1626 ,  G06F1/1656 ,  G06F1/1662 ,  G06F1/1683 ,  H04M1/185 ,  H04M1/23 ,  H05K1/0296 ,  H05K1/038 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/111 ,  H05K1/189 ,  H05K3/06 ,  H05K3/10 ,  H05K3/108 ,  H05K2201/05

Abstract: An electronic device such as a cover for a portable device may be provided with a body having hinge portions. The hinge portions may allow the body to bend about one or more bend axes. The cover may have electrical components such as a keyboard. A keyboard may be mounted at one end of the cover and a connector may be mounted at an opposing end of the cover. A flexible fabric signal path structure may be formed from metal traces on a flexible fabric substrate. At one end of the cover, the flexible fabric signal path structure may be coupled to a printed circuit in the keyboard using conductive adhesive. At the opposing end of the cover, the metal traces on the flexible fabric substrate may be coupled to the connector.

公开(公告)号：US20170245038A1

公开(公告)日：2017-08-24

申请号：US15588444

申请日：2017-05-05

Applicant: Apple Inc.

Inventor： Arun D. Chawan ,  Rico L. Zörkendörfer ,  Kurt Stiehl ,  Lee M. Panecki ,  Shannon X. Yang ,  Daniel Max Strongwater ,  Marcus Albonico ,  Benjamin A. Cousins ,  Eric S. Jol ,  Daniel C. Wagman

IPC: H04R1/10 ,  H04R9/06 ,  A45C13/02 ,  H02J7/02 ,  A45C13/00 ,  A45C11/00 ,  H02J7/00 ,  H04R1/34 ,  A45C13/10

CPC classification number: H04R1/1016 ,  A45C11/00 ,  A45C11/24 ,  A45C13/005 ,  A45C13/02 ,  A45C13/1069 ,  A45C2011/001 ,  A45C2013/026 ,  B65D25/02 ,  B65D43/16 ,  F16B2001/0035 ,  H01R13/521 ,  H02J7/0044 ,  H02J7/0047 ,  H02J7/025 ,  H02J7/027 ,  H02J2007/0096 ,  H04B1/385 ,  H04B1/3888 ,  H04B5/0037 ,  H04M1/6033 ,  H04R1/02 ,  H04R1/1025 ,  H04R1/1041 ,  H04R1/1058 ,  H04R1/1075 ,  H04R1/2826 ,  H04R1/2857 ,  H04R1/345 ,  H04R5/033 ,  H04R9/025 ,  H04R9/06 ,  H04R2201/105 ,  H04R2420/07 ,  H04R2460/03 ,  H04R2460/09 ,  H04R2460/17

Abstract: A case for an earbud includes a receiving cavity sized and shaped to accept the earbud within the receiving cavity. The case includes one or more housing magnetic components configured to magnetically attract and secure the earbud within the receiving cavity.

公开(公告)号：US20170178840A1

公开(公告)日：2017-06-22

申请号：US15449663

申请日：2017-03-03

Applicant: Apple Inc.

Inventor： Siddhartha Hegde ,  Benjamin A. Cousins ,  Benjamin A. Shaffer ,  Samuel G. Smith ,  Melody Kuna

IPC: H01H13/83 ,  G06F3/02 ,  G06F1/16

CPC classification number: H01H13/83 ,  B29C45/14221 ,  B29C45/14336 ,  B29C45/14786 ,  B29C59/02 ,  G06F1/1656 ,  G06F1/1662 ,  G06F1/1675 ,  G06F1/181 ,  G06F1/182 ,  G06F3/0202 ,  H04M1/0202 ,  H04M1/23

Abstract: An electronic device such as a cover for a portable device or other electronic equipment may have circuitry mounted in a housing. The housing may be formed from layers of material such as fabric and polymer layers. The fabric may be formed from woven polymer yarn. The fabric may be treated with chemicals to improve stain resistance and wear resistance, may be provided with a polymer backing layer, and may receive molded plastic structures. Patterned areas ma be woven into the fabric, may be formed by placing coatings on selected portions of the fabric, or may be formed by embroidering or otherwise locally processing the fabric. The patterned, areas may tot labels for keyboard keys, logos, key trim patterns, and other features for an electronic device. Patterned areas may have locally enhanced light transmission characteristics and may be backlit.

公开(公告)号：US09588551B1

公开(公告)日：2017-03-07

申请号：US14843634

申请日：2015-09-02

Applicant: Apple Inc.

Inventor： Siddhartha Hegde ,  Benjamin A. Cousins ,  Benjamin A. Shaffer ,  Samuel G. Smith ,  Melody Kuna

IPC: G06F1/16

CPC classification number: H01H13/83 ,  B29C45/14221 ,  B29C45/14336 ,  B29C45/14786 ,  B29C59/02 ,  G06F1/1656 ,  G06F1/1662 ,  G06F1/1675 ,  G06F1/181 ,  G06F1/182 ,  G06F3/0202 ,  H04M1/0202 ,  H04M1/23

Abstract: An electronic device such as a cover for a portable device or other electronic equipment may have circuitry mounted in a housing. The housing may be formed from layers of material such as fabric and polymer layers. The fabric may be formed from woven polymer yarn. The fabric may be treated with chemicals to improve stain resistance and wear resistance, may be provided with a polymer backing layer, and may receive molded plastic structures. Patterned areas may be woven into the fabric, may be formed by placing coatings on selected portions of the fabric, or may be formed by embroidering or otherwise locally processing the fabric. The patterned areas may form labels for keyboard keys, logos, key trim patterns, and other features for an electronic device. Patterned areas may have locally enhanced light transmission characteristics and may be backlit.

Abstract translation: 诸如用于便携式设备或其他电子设备的盖子的电子设备可以具有安装在壳体中的电路。 壳体可以由诸如织物和聚合物层的材料层形成。 织物可以由编织聚合物纱线形成。 织物可以用化学品处理以改善耐污性和耐磨性，可以提供聚合物背衬层，并且可以接收模塑塑料结构。 图案化区域可以编织到织物中，可以通过在织物的选定部分上放置涂层而形成，或者可以通过刺绣或以其它方式局部加工织物而形成。 图案化区域可以形成用于键盘键，徽标，键修剪图案和电子设备的其它特征的标签。 图案化区域可以具有局部增强的光透射特性并且可以是背光的。