公开(公告)号：EP3610513A1

公开(公告)日：2020-02-19

申请号：EP18724702.8

申请日：2018-04-27

Applicant: Apple Inc.

Inventor： CHOI, Jaein ,  LIN, Andrew ,  LO, Cheuk Chi ,  HUANG, Chun-Yao ,  WONG, Gloria ,  TANG, Hairong ,  YAMAMOTO, Hitoshi ,  PEDDER, James E. ,  KIM, Kibeom ,  CHEON, Kwang Ohk ,  YUAN, Lei ,  SLOOTSKY, Michael ,  LIU, Rni ,  MOLESA, Steven E. ,  KANG, Sunggu ,  CHANG, Wendi ,  TANG, Chun-Ming ,  CHEN, Cheng ,  KNEZ, Ivan ,  DORJGOTOV, Enkhamgalan ,  CARBONE, Giovanni ,  MYHRE, Graham B. ,  LEE, Jungmin

IPC: H01L27/32

公开(公告)号：EP3384530A1

公开(公告)日：2018-10-10

申请号：EP17707450.7

申请日：2017-02-10

Applicant: Apple Inc.

Inventor： HU, Hsin-Hua ,  PEDDER, James E. ,  BITA, Ion ,  CHOI, Jaein ,  TANG, Hairong ,  HSU, Chin Wei ,  CHALASANI, Sandeep ,  CHEN, Chih-Lei ,  ONO, Shinya ,  KANG, Sunggu ,  HUANG, Jung Yen ,  TSAI, Lun

IPC: H01L25/075 ,  H01L25/16 ,  H01L23/00

CPC classification number: H01L25/0753 ,  H01L23/3157 ,  H01L23/3192 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/16 ,  H01L25/167 ,  H01L2224/10145 ,  H01L2224/11002 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/13007 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1601 ,  H01L2224/16112 ,  H01L2224/16238 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/3841 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/03 ,  H01L2224/11

Abstract: Micro LED and microdriver chip integration schemes are described. In an embodiment a microdriver chip includes a plurality of trenches formed in a bottom surface of the microdriver chip, with each trench surrounding a conductive stud extending below a bottom surface of the microdriver chip body. Integration schemes are additionally described for providing electrical connection to conductive terminal contacts and micro LEDs bonded to a display substrate and adjacent to a microdriver chip.

公开(公告)号：EP4298471A1

公开(公告)日：2024-01-03

申请号：EP22717955.3

申请日：2022-03-14

Applicant: Apple Inc.

Inventor： PEDDER, James E. ,  STAMENOV, Igor ,  TOPLISS, Richard J. ,  GREGORY, Thomas M. ,  SIMMONDS, Michael D.

IPC: G02B3/14 ,  G02B27/01 ,  G02B26/00 ,  G02C7/08

公开(公告)号：EP4241127A1

公开(公告)日：2023-09-13

申请号：EP21815008.4

申请日：2021-10-29

Applicant: Apple Inc.

Inventor： BOLIS, Sebastien ,  POUYDEBASQUE, Arnaud ,  STAMENOV, Igor ,  PEDDER, James E. ,  CHIDAMBARAM, Nachiappan

IPC: G02B27/01 ,  G02C7/08 ,  G02B3/14

公开(公告)号：EP3308373A1

公开(公告)日：2018-04-18

申请号：EP16729707.6

申请日：2016-05-27

Applicant: Apple Inc.

Inventor： NAUTA, Tore ,  BAE, Hopil ,  SAKARIYA, Kapil V. ,  JEN, Henry C. ,  KANG, Sunggu ,  BAROUGHI, Mahadi Farrokh ,  HATANAKA, Shingo ,  LU, Xiang ,  PEDDER, James E. ,  CHOUDHARY, Saif ,  BITA, Ion ,  AKYOL, Hasan

IPC: G09G3/20 ,  G09G3/32 ,  H01L27/32

CPC classification number: G09G3/2088 ,  G09G3/2014 ,  G09G3/32 ,  G09G2300/0413 ,  G09G2300/0426 ,  G09G2300/0804 ,  G09G2300/0857 ,  G09G2310/027 ,  G09G2310/0272 ,  G09G2310/0291 ,  G09G2310/08 ,  G09G2330/08

Abstract: Display panel redundancy schemes and methods of operation are described. In an embodiment, and display panel includes an array of drivers (e.g. microdrivers), each of which including multiple portions to independently receive control and pixel bits. In an embodiment, each driver portion is to control a group of redundant emission elements.