公开(公告)号：WO2023048953A1

公开(公告)日：2023-03-30

申请号：PCT/US2022/042892

申请日：2022-09-08

Applicant: APPLE INC.

Inventor： FARROKH BAROUGHI, Mahdi ,  CHALASANI, Sandeep ,  LU, Xiang ,  MEHTA, Anurag ,  BAE, Hopil ,  WANG, Chaohao ,  VELAYUTHAN, Rajesh ,  MOLESA, Steven, E. ,  AZIZI, Yaser ,  BAE, Young, Don ,  JANG, Sunmin ,  LI, Haitao ,  PAUDEL, Hari, P. ,  HUANG, Anatole ,  KAKUDA, Tyler, R. ,  DOYLE, David, A. ,  YAO, Wei, H. ,  GHARGHI, Majid ,  PATEL, Vaibhav, D. ,  LI, Xia ,  JIANG, Yongjie ,  GUPTA, Mittul ,  WANG, Stanley B

IPC: G09G3/20 ,  G09G3/32 ,  G09G3/3216

Abstract: A display may be formed by an array of light-emitting diodes mounted to the surface of a display substrate. The light-emitting diodes may be inorganic light-emitting diodes formed from separate crystalline semiconductor structures. An array of pixel control circuits may be used to control light emission from the light-emitting diodes. Each pixel control circuit may be configured to control one or more respective passive matrices. To control partial pixel cells in the display, a donor pixel control circuit in a partial pixel cell may control the pixels in a receptor partial pixel cell without a pixel control circuit. To mitigate the size of an inactive area of the display, fanout signal lines for the display may be formed in the light-emitting active area of the display. The fanout signal lines may be formed between a row of pixel control circuits and a bottom edge of the light-emitting active area.

公开(公告)号：WO2023278000A1

公开(公告)日：2023-01-05

申请号：PCT/US2022/026394

申请日：2022-04-26

Applicant: APPLE INC.

Inventor： ZHOU, Lixia ,  JOHNSON, Joy, M. ,  CHALASANI, Sandeep ,  SUN, Ting ,  DENG, Yang ,  GHARGHI, Majid ,  ESFANDYARPOUR, Majid ,  YANG, Young, Cheol ,  CHE, Yuchi ,  RIEUTORT-LOUIS, Warren, S. ,  KIM, Kyounghwan ,  KNITTER, Sebastian ,  QIAO, Yi ,  GUILLOU, Jean-Pierre, S. ,  YUAN, Ze ,  BACKER, Adam ,  HUANG, Yi-Pai ,  WANG, Chaohao

IPC: H01L25/075 ,  H01L25/16 ,  H01L27/32

Abstract: An electronic device may include a display and an optical sensor formed underneath the display. The electronic device may include a locally modified region that overlaps the optical sensor. The locally modified region of the display may have a modification relative to a normal region of the display that does not overlap the optical sensor. The modification may mitigate diffractive artifacts that would otherwise impact the optical sensor that senses light passing through the display. To mitigate diffraction artifacts, the locally modified region of the display may use spatial randomization (e.g., spatial randomization of signal paths and/or spatial randomization of via locations), opaque structures may be formed with circular footprints, a black masking layer may be formed with circular openings, apodization may be used, and/or a phase randomization film may be included.

公开(公告)号：WO2022035882A1

公开(公告)日：2022-02-17

申请号：PCT/US2021/045421

申请日：2021-08-10

Applicant: APPLE INC.

Inventor： GEHLEN, Elmar ,  ZHANG, Zhen ,  JACOB, Francois, R. ,  DRZAIC, Paul, S. ,  CHANG, Han-Chieh ,  JAMSHIDI ROUDBARI, Abbas ,  LIANG, Anshi ,  BAE, Hopil ,  FARROKH BAROUGHI, Mahdi ,  DEVINCENTIS, Marc, J. ,  SACCHETTO, Paolo ,  MOY, Tiffany, T. ,  RIEUTORT-LOUIS, Warren, S. ,  SUN, Yong ,  MAR, Jonathan, P. ,  WANG, Zuoqian ,  TRACY, Ian, D. ,  KANG, Sunggu ,  CHOI, Jaein ,  MOLESA, Steven, E. ,  CHALASANI, Sandeep ,  LIAO, Jui-Chih ,  ZHAO, Xin ,  AHMED, Izhar, Z.

IPC: H01L25/075 ,  G09F9/302 ,  H05K3/46

Abstract: An electronic device display may have pixels formed from crystalline semiconductor light-emitting diode dies, organic light-emitting diodes, or other pixel structures. The pixels may be formed on a display panel substrate. A display panel may extend continuously across the display or multiple display panels may be tiled in two dimensions to cover a larger display area. Interconnect substrates may have outwardly facing contacts that are electrically shorted to corresponding inwardly facing contacts such as inwardly facing metal pillars associated with the display panels. The interconnect substrates may be supported by glass layers. Integrated circuits may be embedded in the display panels and/or in the interconnect substrates. A display may have an active area with pixels that includes non-spline pixels in a non-spline display portion located above a straight edge of the display and spline pixel in a spline display portion located above a curved edge of the display.

公开(公告)号：EP4405932A1

公开(公告)日：2024-07-31

申请号：EP22783153.4

申请日：2022-09-08

Applicant: Apple Inc.

Inventor： FARROKH BAROUGHI, Mahdi ,  CHALASANI, Sandeep ,  LU, Xiang ,  MEHTA, Anurag ,  BAE, Hopil ,  WANG, Chaohao ,  VELAYUTHAN, Rajesh ,  MOLESA, Steven, E. ,  AZIZI, Yaser ,  BAE, Young, Don ,  JANG, Sunmin ,  LI, Haitao ,  PAUDEL, Hari, P. ,  HUANG, Anatole ,  KAKUDA, Tyler, R. ,  DOYLE, David, A. ,  YAO, Wei, H. ,  GHARGHI, Majid ,  PATEL, Vaibhav, D. ,  LI, Xia ,  JIANG, Yongjie ,  GUPTA, Mittul ,  WANG, Stanley B

IPC: G09G3/20 ,  G09G3/32 ,  G09G3/3216

CPC classification number: G09G3/32 ,  G09G3/3216 ,  G09G2300/0620130101 ,  G09G2300/040820130101 ,  G09G3/2088 ,  G09G3/2085 ,  G09G2300/080420130101 ,  G09G2330/0820130101 ,  G09G2300/042620130101 ,  G09G2330/02120130101

公开(公告)号：EP3384530A1

公开(公告)日：2018-10-10

申请号：EP17707450.7

申请日：2017-02-10

Applicant: Apple Inc.

Inventor： HU, Hsin-Hua ,  PEDDER, James E. ,  BITA, Ion ,  CHOI, Jaein ,  TANG, Hairong ,  HSU, Chin Wei ,  CHALASANI, Sandeep ,  CHEN, Chih-Lei ,  ONO, Shinya ,  KANG, Sunggu ,  HUANG, Jung Yen ,  TSAI, Lun

IPC: H01L25/075 ,  H01L25/16 ,  H01L23/00

CPC classification number: H01L25/0753 ,  H01L23/3157 ,  H01L23/3192 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/16 ,  H01L25/167 ,  H01L2224/10145 ,  H01L2224/11002 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/13007 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1601 ,  H01L2224/16112 ,  H01L2224/16238 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/3841 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/03 ,  H01L2224/11

Abstract: Micro LED and microdriver chip integration schemes are described. In an embodiment a microdriver chip includes a plurality of trenches formed in a bottom surface of the microdriver chip, with each trench surrounding a conductive stud extending below a bottom surface of the microdriver chip body. Integration schemes are additionally described for providing electrical connection to conductive terminal contacts and micro LEDs bonded to a display substrate and adjacent to a microdriver chip.

公开(公告)号：EP4173040A1

公开(公告)日：2023-05-03

申请号：EP21766036.4

申请日：2021-08-10

Applicant: Apple Inc.

Inventor： GEHLEN, Elmar ,  ZHANG, Zhen ,  JACOB, Francois, R. ,  DRZAIC, Paul, S. ,  CHANG, Han-Chieh ,  JAMSHIDI ROUDBARI, Abbas ,  LIANG, Anshi ,  BAE, Hopil ,  FARROKH BAROUGHI, Mahdi ,  DEVINCENTIS, Marc, J. ,  SACCHETTO, Paolo ,  MOY, Tiffany, T. ,  RIEUTORT-LOUIS, Warren, S. ,  SUN, Yong ,  MAR, Jonathan, P. ,  WANG, Zuoqian ,  TRACY, Ian, D. ,  KANG, Sunggu ,  CHOI, Jaein ,  MOLESA, Steven, E. ,  CHALASANI, Sandeep ,  LIAO, Jui-Chih ,  ZHAO, Xin ,  AHMED, Izhar, Z.

IPC: H01L25/075 ,  G09F9/302 ,  H05K3/46