公开(公告)号：US11860549B2

公开(公告)日：2024-01-02

申请号：US17251419

申请日：2019-05-01

Applicant: ASML NETHERLANDS B.V.

Inventor： Wolter Siemons ,  Daan Maurits Slotboom ,  Erik Peter De Kort

IPC: G03F7/00

CPC classification number: G03F7/70633 ,  G03F7/70725

Abstract: A method for determining a correction for control of at least one manufacturing apparatus used in a manufacturing process for providing structures to a region on a substrate, the region including a plurality of sub-regions. The method includes obtaining measurement data relating to a process parameter of the manufacturing process for the region; and determining a correction for the manufacturing apparatus based on the measurement data. The correction is configured to maintain the process parameter within a specified range across a boundary between two of the sub-regions and/or to better correct the process parameter across the boundary between two of the sub-regions with respect to within the remainder of the region.

公开(公告)号：US11860548B2

公开(公告)日：2024-01-02

申请号：US17425355

申请日：2020-02-06

Applicant: ASML NETHERLANDS B.V.

Inventor： Wim Tjibbo Tel ,  Hermanus Adrianus Dillen ,  Marc Jurian Kea ,  Mark John Maslow ,  Koen Thuijs ,  Peter David Engblom ,  Ralph Timotheus Huijgen ,  Daan Maurits Slotboom ,  Johannes Catharinus Hubertus Mulkens

IPC: G03F7/00

CPC classification number: G03F7/705 ,  G03F7/7065 ,  G03F7/70525 ,  G03F7/70658

Abstract: A method of determining a characteristic of one or more processes for manufacturing features on a substrate, the method including: obtaining image data of a plurality of features on a least part of at least one region on a substrate; using the image data to obtain measured data of one or more dimensions of each of at least some of the plurality of features; determining a statistical parameter that is dependent on the variation of the measured data of one or more dimensions of each of at least some of the plurality of features; determining a probability of defective manufacture of features in dependence on a determined number of defective features in the image data; and determining the characteristic of the one or more processes to have the probability of defective manufacture of features and the statistical parameter.

公开(公告)号：US11366396B2

公开(公告)日：2022-06-21

申请号：US17268177

申请日：2019-08-01

Applicant: ASML NETHERLANDS B.V.

Inventor： Daan Maurits Slotboom ,  Hermannes Theodorus Heijmerikx ,  Javier Augusto Loaiza Rivas ,  Jeroen Cottaar

IPC: G03F7/20

Abstract: A method of configuring a step of scanning a beam of photons or particles across a patterning device for exposing a pattern onto a substrate, wherein the method includes determining a spatial resolution of a patterning correction configured to improve quality of the exposing, and determining a spatial dimension of the beam based on the determined spatial resolution of the patterning correction.

公开(公告)号：US09989858B2

公开(公告)日：2018-06-05

申请号：US15111457

申请日：2014-12-05

Applicant: ASML Netherlands B.V.

Inventor： Daan Maurits Slotboom ,  Pieter Jacob Kramer ,  Martinus Hendrikus Antonius Leenders ,  Bart Dinand Paarhuis

IPC: G03F7/20 ,  G03F9/00

CPC classification number: G03F7/70141 ,  G03F9/7046 ,  G03F9/7096

Abstract: Disclosed is an apparatus and method for performing a measurement operation on a substrate in accordance with one or more substrate alignment models. The one or more substrate alignment models are selected from a plurality of candidate substrate alignment models. The apparatus, which may be a lithographic apparatus, includes an external interface which enables selection of the substrate alignment model(s) and/or alteration of the substrate alignment model(s) prior to the measurement operation.

公开(公告)号：US20140168627A1

公开(公告)日：2014-06-19

申请号：US14069287

申请日：2013-10-31

Applicant: ASML Netherlands B.V.

Inventor： Emil Peter SCHMITT-WEAVER ,  Paul Frank Luehrmann ,  Eduardus Johannes Gerardus Boon ,  Daan Maurits Slotboom ,  Jean-Philippe Xavier Van Damme ,  Wolfgang Henke ,  Alexander Ypma ,  Marc Jurian Kea

IPC: G03F7/20

CPC classification number: G03F7/70908 ,  G03F7/707 ,  G03F7/7085 ,  G03F7/70916 ,  G03F9/70

Abstract: A reticle is loaded into a lithographic apparatus. The apparatus performs measurements on the reticle, so as to calculate alignment parameters for transferring the pattern accurately to substrates. Tests are performed to detect possible contamination of the reticle or its support. Either operation proceeds with a warning, or the patterning of substrates is stopped. The test uses may use parameters of the alignment model itself, or different parameters. The integrity parameters may be compared against reference values reflecting historic measurements, so that sudden changes in a parameter are indicative of contamination. Integrity parameters may be calculated from residuals of the alignment model. In an example, height residuals are used to calculate parameters of residual wedge (Rx′) and residual roll (Ryy′). From these, integrity parameters expressed as height deviations are calculated and compared against thresholds.

Abstract translation: 将掩模版加载到光刻设备中。 该装置对掩模版进行测量，以便计算用于将图案精确地转印到基底上的对准参数。 执行测试以检测掩模版或其支撑体的可能污染。 任一操作都进行警告，或者停止基板的图案化。 测试使用可以使用对齐模型本身的参数或不同的参数。 可以将完整性参数与反映历史测量的参考值进行比较，使得参数中的突然变化指示污染。 可以从对齐模型的残差计算完整性参数。 在一个例子中，高度残差用于计算残余楔（Rx'）和残余辊（Ryy'）的参数。 从这些，计算表示为高度偏差的完整性参数，并将其与阈值进行比较。