SYSTEMS AND METHODS FOR FOCUSING CHARGED -PARTICLE BEAMS

    公开(公告)号:US20220068590A1

    公开(公告)日:2022-03-03

    申请号:US17418741

    申请日:2019-12-19

    Abstract: Systems and methods for irradiating a sample with a charged-particle beam are disclosed. The charged-particle beam system may comprise a stage configured to hold a sample and is movable in at least one of X-Y-Z axes. The charged-particle beam system may further comprise a position sensing system to determine a lateral and vertical displacement of the stage, and a beam deflection controller configured to apply a first signal to deflect a primary charged-particle beam incident on the sample to at least partly compensate for the lateral displacement, and to apply a second signal to adjust a focus of the deflected charged-particle beam incident on the sample to at least partly compensate for the vertical displacement of the stage. The first and second signals may comprise an electrical signal having a high bandwidth in a range of 10 kHz to 50 kHz, and 50 kHz to 200 kHz, respectively.

    FULLY AUTOMATED SEM SAMPLING SYSTEM FOR E-BEAM IMAGE ENHANCEMENT

    公开(公告)号:US20250078478A1

    公开(公告)日:2025-03-06

    申请号:US18882681

    申请日:2024-09-11

    Abstract: Disclosed herein is a method of automatically obtaining training images to train a machine learning model that improves image quality. The method may comprise analyzing a plurality of patterns of data relating to a layout of a product to identify a plurality of training locations on a sample of the product to use in relation to training the machine learning model. The method may comprise obtaining a first image having a first quality for each of the plurality of training locations, and obtaining a second image having a second quality for each of the plurality of training locations, the second quality being higher than the first quality. The method may comprise using the first image and the second image to train the machine learning model.

    CROSS-TALK CANCELLATION IN MULTIPLE CHARGED-PARTICLE BEAM INSPECTION

    公开(公告)号:US20250006456A1

    公开(公告)日:2025-01-02

    申请号:US18787932

    申请日:2024-07-29

    Abstract: An improved apparatus and method for enhancing an image, and more particularly an apparatus and method for enhancing an image through cross-talk cancellation in a multiple charged-particle beam inspection are disclosed. An improved method for enhancing an image includes acquiring a first image signal of a plurality of image signals from a detector of a multi-beam inspection system. The first image signal corresponds to a detected signal from a first region of the detector on which electrons of a first secondary electron beam and of a second secondary electron beam are incident. The method includes reducing, from the first image signal, cross-talk contamination originating from the second secondary electron beam using a relationship between the first image signal and beam intensities associated with the first secondary electron beam and the second secondary electron beam. The method further includes generating a first image corresponding to first secondary electron beam after reduction.

    IN-DIE METROLOGY METHODS AND SYSTEMS FOR PROCESS CONTROL

    公开(公告)号:US20230076943A1

    公开(公告)日:2023-03-09

    申请号:US17985087

    申请日:2022-11-10

    Abstract: Systems and methods for in-die metrology using target design patterns are provided. These systems and methods include selecting a target design pattern based on design data representing the design of an integrated circuit, providing design data indicative of the target design pattern to enable design data derived from the target design pattern to he added to second design data, wherein the second design data is based on the first design data. Systems and methods can further include causing structures derived from the second design data to be printed on a wafer, inspecting the structures on the wafer using a charged-particle beam tool, and identifying metrology data or process defects based on the inspection. In some embodiments the systems and methods further include causing the charged-particle beam tool, the second design data, a scanner, or photolithography equipment to be adjusted based on the identified metrology data or process defects.

    IN-DIE METROLOGY METHODS AND SYSTEMS FOR PROCESS CONTROL

    公开(公告)号:US20200211845A1

    公开(公告)日:2020-07-02

    申请号:US16730897

    申请日:2019-12-30

    Abstract: Systems and methods for in-die metrology using target design patterns are provided. These systems and methods include selecting a target design pattern based on design data representing the design of an integrated circuit, providing design data indicative of the target design pattern to enable design data derived from the target design pattern to be added to second design data, wherein the second design data is based on the first design data. Systems and methods can further include causing structures derived from the second design data to be printed on a wafer, inspecting the structures on the wafer using a charged-particle beam tool, and identifying metrology data or process defects based on the inspection. In some embodiments the systems and methods further include causing the charged-particle beam tool, the second design data, a scanner, or photolithography equipment to be adjusted based on the identified metrology data or process defects.

    FULLY AUTOMATED SEM SAMPLING SYSTEM FOR E-BEAM IMAGE ENHANCEMENT

    公开(公告)号:US20200211178A1

    公开(公告)日:2020-07-02

    申请号:US16718706

    申请日:2019-12-18

    Abstract: Disclosed herein is a method of automatically obtaining training images to train a machine learning model that improves image quality. The method may comprise analyzing a plurality of patterns of data relating to a layout of a product to identify a plurality of training locations on a sample of the product to use in relation to training the machine learning model. The method may comprise obtaining a first image having a first quality for each of the plurality of training locations, and obtaining a second image having a second quality for each of the plurality of training locations, the second quality being higher than the first quality. The method may comprise using the first image and the second image to train the machine learning model.

    SEM IMAGE ENHANCEMENT METHODS AND SYSTEMS
    19.
    发明申请

    公开(公告)号:US20200018944A1

    公开(公告)日:2020-01-16

    申请号:US16508087

    申请日:2019-07-10

    Abstract: Systems and methods for image enhancement are disclosed. A method for enhancing an image may include acquiring a first scanning electron microscopy (SEM) image at a first resolution. The method may also include acquiring a second SEM image at a second resolution. The method may further include providing an enhanced image by using the first SEM image as a reference to enhance the second SEM image. The enhanced image may be provided by using one or more features extracted from the first image to enhance the second SEM image, or using the first SEM image as a reference to numerically enhance the second SEM image.

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