Abstract:
A lithographic apparatus operates by moving a substrate and a patterning device relative to each other in a sequence of movements such that a pattern is applied at a successive portions on the substrate. Each portion of the substrate is patterned by a scanning operation in which the patterning device is scanned through the radiation beam while synchronously scanning the substrate through the patterned radiation beam so as to apply the pattern to the desired portion on the substrate. An intrafield correction is applied during each scanning operation so as to compensate for distortion effects which vary during the scanning operation. The intrafield correction includes corrective variations of one or more properties of the projection system, and optionally out-of-plane movements of the patterning device and/or substrate table.
Abstract:
Disclosed is a method of correcting metrology signal data relating to a structure on a substrate. The method comprises obtaining measured metrology signal data related to a measurement of the structure on a substrate with measurement radiation; obtaining simulated metrology signal data related to a simulated measurement of a model of said structure using said measurement radiation; and using the simulated metrology signal data to correct the measured metrology signal data for at least a polarization dependent offset in the measured metrology signal data resultant from an asymmetry in said structure, to obtain corrected measured metrology signal data.