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公开(公告)号：US20200211845A1
公开(公告)日：2020-07-02
申请号：US16730897
申请日：2019-12-30
Applicant: ASML Netherlands B.V.
Inventor： Lingling PU , Wei FANG , Zhong-wei CHEN
Abstract: Systems and methods for in-die metrology using target design patterns are provided. These systems and methods include selecting a target design pattern based on design data representing the design of an integrated circuit, providing design data indicative of the target design pattern to enable design data derived from the target design pattern to be added to second design data, wherein the second design data is based on the first design data. Systems and methods can further include causing structures derived from the second design data to be printed on a wafer, inspecting the structures on the wafer using a charged-particle beam tool, and identifying metrology data or process defects based on the inspection. In some embodiments the systems and methods further include causing the charged-particle beam tool, the second design data, a scanner, or photolithography equipment to be adjusted based on the identified metrology data or process defects.
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公开(公告)号：US20200211178A1
公开(公告)日：2020-07-02
申请号：US16718706
申请日：2019-12-18
Applicant: ASML Netherlands B.V.
Inventor： Wentian ZHOU , Liangjiang YU , Teng WANG , Lingling PU , Wei FANG
Abstract: Disclosed herein is a method of automatically obtaining training images to train a machine learning model that improves image quality. The method may comprise analyzing a plurality of patterns of data relating to a layout of a product to identify a plurality of training locations on a sample of the product to use in relation to training the machine learning model. The method may comprise obtaining a first image having a first quality for each of the plurality of training locations, and obtaining a second image having a second quality for each of the plurality of training locations, the second quality being higher than the first quality. The method may comprise using the first image and the second image to train the machine learning model.
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公开(公告)号：US20200018944A1
公开(公告)日：2020-01-16
申请号：US16508087
申请日：2019-07-10
Applicant: ASML Netherlands B.V
Inventor： Wei FANG , Lingling PU , Thomas Jarik HUISMAN , Erwin Paul SMAKMAN
Abstract: Systems and methods for image enhancement are disclosed. A method for enhancing an image may include acquiring a first scanning electron microscopy (SEM) image at a first resolution. The method may also include acquiring a second SEM image at a second resolution. The method may further include providing an enhanced image by using the first SEM image as a reference to enhance the second SEM image. The enhanced image may be provided by using one or more features extracted from the first image to enhance the second SEM image, or using the first SEM image as a reference to numerically enhance the second SEM image.
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公开(公告)号：US20190187670A1
公开(公告)日：2019-06-20
申请号：US16326172
申请日：2017-08-14
Applicant: ASML Netherlands B.V.
Inventor： Wei FANG
IPC: G05B19/418
CPC classification number: G05B19/41875 , G05B19/4183 , G05B2219/32193 , G05B2219/37224 , G05B2219/37448 , Y02P90/14 , Y02P90/18 , Y02P90/20 , Y02P90/22
Abstract: Embodiments of the present disclosure provide systems and methods for enhancing the semiconductor manufacturing yield. Embodiments of the present disclosure provide a yield improvement system. The system comprises a training tool configured to generate training data based on receipt of one or more verified results of an inspection of a first substrate. The system also comprises a point determination tool configured to determine one or more regions on a second substrate to inspect based on the training data, weak point information for the second substrate, and an exposure recipe for a scanner of the second substrate.
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公开(公告)号：US20250095116A1
公开(公告)日：2025-03-20
申请号：US18557584
申请日：2022-04-28
Applicant: ASML Netherlands B.V.
Inventor： Hairong LEI , Wei FANG
Abstract: An improved systems and methods for generating a denoised inspection image are disclosed. An improved method for generating a denoised inspection image comprises acquiring an inspection image; generating a first denoised image by executing a first type denoising algorithm on the inspection image; and generating a second denoised image by executing a second type denoising algorithm on the first denoised image.
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Patent Agency Ranking
公开(公告)号：US20230386021A1
公开(公告)日：2023-11-30
申请号：US18365130
申请日：2023-08-03
Applicant: ASML Netherlands B.V.
Inventor： Wei FANG , Zhaohui GUO , Ruoyu ZHU , Chuan LI
CPC classification number: G06T7/001 , G06F18/24 , G06T2207/20081 , G06T2207/30148
Abstract: A pattern grouping method may include receiving an image of a first pattern, generating a first fixed-dimensional feature vector using trained model parameters applying to the received image, and assigning the first fixed-dimensional feature vector a first bucket ID. The method may further include creating a new bucket ID for the first fixed-dimensional feature vector in response to determining that the first pattern does not belong to one of a plurality of buckets corresponding to defect patterns, or mapping the first fixed-dimensional feature vector to the first bucket ID in response to determining that the first pattern belongs to one of a plurality of buckets corresponding to defect patterns.
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17.发明申请公开(公告)号：US20230117237A1
公开(公告)日：2023-04-20
申请号：US17799576
申请日：2021-01-27
Applicant: ASML Netherlands B.V.
Inventor： Lingling PU , Wei FANG
Abstract: An improved apparatus and method for extracting pattern contour information from an inspection image in a multiple charged-particle beam inspection system are disclosed. An improved method for extracting pattern contour information from an inspection image comprises identifying, from an inspection image obtained from a charged-particle beam inspection system, a first pattern and a second pattern that partially overlap in the inspection image. The method also comprises generating a first separation image by removing an image area corresponding to the second pattern from the inspection image. The first separation image includes the first pattern of which a first part is removed when removing the image area corresponding to the second pattern. The method also comprises updating the first separation image to include image data representing the removed first part of the first pattern based on a first reference image corresponding to the first pattern.
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18.发明申请公开(公告)号：US20230012946A1
公开(公告)日：2023-01-19
申请号：US17786190
申请日：2020-12-17
Applicant: ASML NETHERLANDS B.V.
Inventor： Wei FANG , Zhengwei ZHOU , Lingling PU
IPC: H01J37/28 , H01J37/24 , H01J37/26 , H01J37/244
Abstract: A system and method for defect inspection using voltage contrast in a charged particle system are provided. Some embodiments of the system and method include positioning the stage at a first position to enable a first beam of the plurality of beams to scan a first surface area of the wafer at a first time to generate a first image associated with the first surface area; positioning the stage at a second position to enable a second beam of the plurality of beams to scan the first surface area at a second time to generate a second image associated with the first surface area; and comparing the first image with the second image to enable detecting whether a defect is identified in the first surface area of the wafer.
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公开(公告)号：US20220319805A1
公开(公告)日：2022-10-06
申请号：US17639322
申请日：2020-08-20
Applicant: ASML Netherlands B.V.
Inventor： Wei FANG , Lingling PU
Abstract: Systems and methods for image enhancement are disclosed. A method for enhancing an image may include receiving records of a performance metric for beams of the multi-beam system in an imaging process, each record associated with a beam. The method may also include determining whether an abnormality of a beam occurs based on a baseline value determined using a portion of the records. The method may further include providing an abnormality indication in response to the determination that the abnormality has occurred.
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公开(公告)号：US20220245787A1
公开(公告)日：2022-08-04
申请号：US17723322
申请日：2022-04-18
Applicant: ASML Netherlands B.V.
Inventor： Zhichao CHEN , Wei FANG
Abstract: A defect inspection system is disclosed. According to certain embodiments, the system includes a memory storing instructions implemented as a plurality of modules. Each of the plurality of modules is configured to detect defects having a different property. The system also includes a controller configured to cause the computer system to: receive inspection data representing an image of a wafer; input the inspection data to a first module of the plurality of modules, the first module outputs a first set of points of interests (POIs) having a first property; input the first set of POIs to a second module of the plurality of modules, the second module output a second set of POIs having the second property; and report that the second set of POIs as defects having both the first property and the second property.
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