公开(公告)号：US20220415810A1

公开(公告)日：2022-12-29

申请号：US17903921

申请日：2022-09-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hao-Chih HSIEH ,  Tun-Ching PI ,  Sung-Hung CHIANG ,  Yu-Chang CHEN

IPC: H01L23/538 ,  H01L23/13 ,  H01L23/31 ,  H01L25/16 ,  H01L23/552

Abstract: A semiconductor device package includes a number of interposers mounted to the carrier, wherein the number of interposers may be arranged in an irregular pattern.

公开(公告)号：US20210375706A1

公开(公告)日：2021-12-02

申请号：US17404912

申请日：2021-08-17

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hao-Chih HSIEH ,  Tun-Ching PI ,  Sung-Hung CHIANG ,  Yu-Chang CHEN

IPC: H01L23/13 ,  H01L23/14 ,  H01L23/498

Abstract: A semiconductor device package includes a carrier, a first interposer disposed and a second interposer. The second interposer is stacked on the first interposer, and the first interposer is mounted to the carrier. The combination of the first interposer and the second interposer is substantially T-shaped.