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公开(公告)号：US20250133662A1
公开(公告)日：2025-04-24
申请号：US19007363
申请日：2024-12-31
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Tun-Ching PI , Ming-Hung CHEN
Abstract: The present disclosure provides an electronic device and method of manufacturing the same. The electronic device includes a first region, a second region, an electronic component, and a first sensing element. The second region is adjacent to the first region. The first region has a first pliability. The second region has a second pliability. The second pliability is greater than the first pliability. The electronic component is disposed at the first region. The first sensing element is disposed at the second region and electrically connected to the electronic component.
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公开(公告)号：US20180226348A1
公开(公告)日：2018-08-09
申请号：US15428069
申请日：2017-02-08
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Hao-Chih HSIEH , Tun-Ching PI
IPC: H01L23/538 , H01L23/31 , H01L25/065 , H01L25/00 , H01L21/56
CPC classification number: H01L23/5387 , H01L21/561 , H01L23/3121 , H01L23/3142 , H01L23/5386 , H01L25/0655 , H01L25/50
Abstract: A semiconductor device package includes a flexible substrate, an electronic component, at least one flexible member, and a package body. The electronic component is disposed on the flexible substrate. The at least one flexible member is disposed on the flexible substrate. The package body encapsulates the electronic component and has a first part and a second part separated from the first part by the at least one flexible member.
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公开(公告)号：US20220346239A1
公开(公告)日：2022-10-27
申请号：US17239475
申请日：2021-04-23
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Tun-Ching PI , Ming-Hung CHEN
Abstract: The present disclosure provides an electronic device and method of manufacturing the same. The electronic device includes a first region, a second region, an electronic component, and a first sensing element. The second region is adjacent to the first region. The first region has a first pliability. The second region has a second pliability. The second pliability is greater than the first pliability. The electronic component is disposed at the first region. The first sensing element is disposed at the second region and electrically connected to the electronic component.
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公开(公告)号：US20200083172A1
公开(公告)日：2020-03-12
申请号：US16560862
申请日：2019-09-04
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Hao-Chih HSIEH , Tun-Ching PI , Sung-Hung CHIANG , Yu-Chang CHEN
IPC: H01L23/538 , H01L23/31 , H01L23/13 , H01L25/16 , H01L23/552
Abstract: A semiconductor device package includes a number of interposers mounted to the carrier, wherein the number of interposers may be arranged in an irregular pattern.
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公开(公告)号：US20220254699A1
公开(公告)日：2022-08-11
申请号：US17169230
申请日：2021-02-05
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Tun-Ching PI
Abstract: A semiconductor device, a semiconductor package, and a method of manufacturing the same are provided. The semiconductor device includes an electronic component, a first thermal conductive layer, a second thermal conductive layer, and a solderable element. The first thermal conductive layer is disposed adjacent to a surface of the electronic component. The second thermal conductive layer is disposed on the first thermal conductive layer and exposes a portion of the first thermal conductive layer. The solderable element is disposed on the second thermal conductive layer.
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Patent Agency Ranking
公开(公告)号：US20210043527A1
公开(公告)日：2021-02-11
申请号：US16537371
申请日：2019-08-09
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Hao-Chih HSIEH , Tun-Ching PI , Sung-Hung CHIANG , Yu-Chang CHEN
IPC: H01L23/13 , H01L23/14 , H01L23/498
Abstract: A semiconductor device package includes a carrier, a first interposer disposed and a second interposer. The second interposer is stacked on the first interposer, and the first interposer is mounted to the carrier. The combination of the first interposer and the second interposer is substantially T-shaped.
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公开(公告)号：US20220367308A1
公开(公告)日：2022-11-17
申请号：US17876468
申请日：2022-07-28
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Tun-Ching PI , Yen-Chi HUANG , Hao-Chih HSIEH , Jin Han SHIH
Abstract: A semiconductor device package includes a carrier and an encapsulant disposed on the carrier. At least one portion of the encapsulant is spaced from the carrier by a space.
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公开(公告)号：US20200083132A1
公开(公告)日：2020-03-12
申请号：US16409665
申请日：2019-05-10
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Yen-Chi HUANG , Hao-Chih HSIEH , Jin Han SHIH , Yung I. YEH , Tun-Ching PI
Abstract: A semiconductor device package includes a carrier and an encapsulant disposed on the carrier. At least one portion of the encapsulant is spaced from the carrier by a space.
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公开(公告)号：US20250105161A1
公开(公告)日：2025-03-27
申请号：US18976228
申请日：2024-12-10
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Hao-Chih HSIEH , Tun-Ching PI , Sung-Hung CHIANG , Yu-Chang CHEN
IPC: H01L23/538 , H01L23/13 , H01L23/31 , H01L23/552 , H01L25/16
Abstract: A semiconductor device package includes a number of interposers mounted to the carrier, wherein the number of interposers may be arranged in an irregular pattern.
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公开(公告)号：US20240126327A1
公开(公告)日：2024-04-18
申请号：US17966700
申请日：2022-10-14
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Chao Wei LIU , Wei-Hao CHANG , Yung-I YEH , Jen-Chieh KAO , Tun-Ching PI , Ming-Hung CHEN , Hui-Ping JIAN , Shang-Lin WU
IPC: G06F1/16
CPC classification number: G06F1/163 , G06F1/1632
Abstract: The present disclosure provides an electronic wearable device. The electronic wearable device includes a first module having a first contact and a second module having a second contact. The first contact is configured to keep electrical connection with the second contact in moving with respect to each other during a wearing period.
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