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公开(公告)号：US11864322B2
公开(公告)日：2024-01-02
申请号：US18164180
申请日：2023-02-03
Applicant: Apple Inc.
Inventor： Bilal Mohamed Ibrahim Kani , Benjamin J. Grena , Kyusang Kim , David M. Kindlon , Pierpaolo Lupo , Kishore N. Renjan , Manoj Vadeentavida
CPC classification number: H05K1/186 , H05K1/0298 , H05K1/189 , H05K1/0274 , H05K2201/10083 , H05K2201/10106 , H05K2201/10121 , H05K2201/10151 , H05K2201/10159
Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.
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公开(公告)号：US20230055647A1
公开(公告)日：2023-02-23
申请号：US17407670
申请日：2021-08-20
Applicant: Apple Inc.
Inventor： Bilal Mohamed Ibrahim Kani , Ali N. Ergun , Kishore N. Renjan , Kyusang Kim , Manoj Vadeentavida , Benjamin J. Grena , David M. Kindlon , Lan H. Hoang
Abstract: Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.
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公开(公告)号：US11388817B2
公开(公告)日：2022-07-12
申请号：US17184927
申请日：2021-02-25
Applicant: Apple Inc.
Inventor： Daniel D. Sunshine , David M. Kindlon , Michael B. Nussbaum , Andrew L. Rosenberg , Andrew Sterian , Breton M. Saunders , Christopher A. Schultz , David A. Bolt , Mark J. Beesley , Peter W. Mash , Steven Keating , Chang Liu , Lan Hoang
IPC: H05K1/00 , H05K1/03 , H05K1/18 , H05K1/11 , H01L23/31 , H01L23/498 , H05K1/02 , D03D1/00 , A41D1/00
Abstract: An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.
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公开(公告)号：US11315880B2
公开(公告)日：2022-04-26
申请号：US17118392
申请日：2020-12-10
Applicant: Apple Inc.
Inventor： Daniel D. Sunshine , Paul S. Drzaic , Daniel A. Podhajny , David M. Kindlon , Hoon Sik Kim , Kathryn P. Crews , Yung-Yu Hsu
Abstract: A fabric-based item may include fabric such as woven fabric having insulating and conductive yarns or other strands of material. The conductive yarns may form signal paths. Electrical components can be embedded within pockets in the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The electrical device may be a light-emitting diode, a sensor, an actuator, or other electrical device. The electrical device may have contacts that are soldered to contacts on the interposer. The interposer may have additional contacts that are soldered to the signal paths. The fabric may have portions that form transparent windows overlapping the electrical components or that have other desired attributes.
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公开(公告)号：US20210407917A1
公开(公告)日：2021-12-30
申请号：US17472223
申请日：2021-09-10
Applicant: Apple Inc.
Inventor： Daniel D. Sunshine , Paul S. Drzaic , Daniel A. Podhajny , David M. Kindlon , Hoon Sik Kim , Kathryn P. Crews , Yung-Yu Hsu
IPC: H01L23/538 , H05K1/18 , H05K1/03 , D02G3/44 , G01D11/30 , H01L23/31 , H01L25/075 , H01L33/56
Abstract: A fabric-based item may include fabric layers and other layers of material. An array of electrical components may be mounted in the fabric-based item. The electrical components may be mounted to a support structure such as a flexible printed circuit. The flexible printed circuit may have a mesh shape formed from an array of openings. Serpentine flexible printed circuit segments may extend between the openings. The electrical components may be light-emitting diodes or other electrical devices. Polymer with light-scattering particles or other materials may cover the electrical components. The flexible printed circuit may be laminated between fabric layers or other layers of material in the fabric-based item.
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Patent Agency Ranking
公开(公告)号：US11183459B2
公开(公告)日：2021-11-23
申请号：US16935088
申请日：2020-07-21
Applicant: Apple Inc.
Inventor： Daniel D. Sunshine , Paul S. Drzaic , Daniel A. Podhajny , David M. Kindlon , Hoon Sik Kim , Kathryn P. Crews , Yung-Yu Hsu
IPC: H01L23/538 , H05K1/18 , H05K1/03 , D02G3/44 , G01D11/30 , H01L23/31 , H01L25/075 , H01L33/56 , A41D1/00 , H05K1/02 , H05K3/28 , F21Y115/10 , H01L21/48 , H01L23/00 , H01L33/62
Abstract: A fabric-based item may include fabric layers and other layers of material. An array of electrical components may be mounted in the fabric-based item. The electrical components may be mounted to a support structure such as a flexible printed circuit. The flexible printed circuit may have a mesh shape formed from an array of openings. Serpentine flexible printed circuit segments may extend between the openings. The electrical components may be light-emitting diodes or other electrical devices. Polymer with light-scattering particles or other materials may cover the electrical components. The flexible printed circuit may be laminated between fabric layers or other layers of material in the fabric-based item.
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公开(公告)号：US10910315B2
公开(公告)日：2021-02-02
申请号：US15752476
申请日：2016-08-10
Applicant: Apple Inc.
Inventor： Daniel D. Sunshine , Paul S. Drzaic , Daniel A. Podhajny , David M. Kindlon , Hoon Sik Kim , Kathryn P. Crews , Yung-Yu Hsu
Abstract: A fabric-based item may include fabric such as woven fabric having insulating and conductive yarns or other strands of material. The conductive yarns may form signal paths. Electrical components can be embedded within pockets in the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The electrical device may be a light-emitting diode, a sensor, an actuator, or other electrical device. The electrical device may have contacts that are soldered to contacts on the interposer. The interposer may have additional contacts that are soldered to the signal paths. The fabric may have portions that form transparent windows overlapping the electrical components or that have other desired attributes.
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公开(公告)号：US10732728B1
公开(公告)日：2020-08-04
申请号：US15467986
申请日：2017-03-23
Applicant: Apple Inc.
Inventor： Daniel D. Sunshine , Daniel A. Podhajny , David M. Kindlon
Abstract: A keyboard may be provided that has keys overlapped by a touch sensor. The keyboard may have key sensor circuitry for monitoring switching in the keys for key press input. The keyboard may also have touch sensor circuitry such as capacitive touch sensor circuitry that monitors capacitive electrodes in the touch sensor for touch sensor input such as multitouch gesture input. The touch sensor may be formed from a layer of fabric. The fabric may be woven fabric or other fabric in which conductive strands of material serve as the electrodes for the touch sensor.
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公开(公告)号：US20230317626A1
公开(公告)日：2023-10-05
申请号：US18330276
申请日：2023-06-06
Applicant: Apple Inc.
Inventor： Daniel D. Sunshine , Paul S. Drzaic , Daniel A. Podhajny , David M. Kindlon , Hoon Sik Kim , Kathryn P. Crews , Yung-Yu Hsu
IPC: H05K1/03 , G01D11/30 , H01L23/538 , H01L33/56 , H05K1/18 , D02G3/44 , H01L23/31 , H01L25/075
CPC classification number: H01L23/5387 , D02G3/441 , G01D11/30 , H01L23/3121 , H01L23/5386 , H01L25/0753 , H01L33/56 , H05K1/038 , H05K1/189 , A41D1/005 , H05K2201/10106
Abstract: A fabric-based item may include fabric layers and other layers of material. An array of electrical components may be mounted in the fabric-based item. The electrical components may be mounted to a support structure such as a flexible printed circuit. The flexible printed circuit may have a mesh shape formed from an array of openings. Serpentine flexible printed circuit segments may extend between the openings. The electrical components may be light-emitting diodes or other electrical devices. Polymer with light-scattering particles or other materials may cover the electrical components. The flexible printed circuit may be laminated between fabric layers or other layers of material in the fabric-based item.
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公开(公告)号：US11710703B2
公开(公告)日：2023-07-25
申请号：US17472223
申请日：2021-09-10
Applicant: Apple Inc.
Inventor： Daniel D. Sunshine , Paul S. Drzaic , Daniel A. Podhajny , David M. Kindlon , Hoon Sik Kim , Kathryn P. Crews , Yung-Yu Hsu
IPC: H01L23/538 , H05K1/18 , H05K1/03 , D02G3/44 , G01D11/30 , H01L23/31 , H01L25/075 , H01L33/56 , A41D1/00 , H05K1/02 , H05K3/28 , F21Y115/10 , H01L21/48 , H01L23/00 , H01L33/62
CPC classification number: H01L23/5387 , D02G3/441 , G01D11/30 , H01L23/3121 , H01L23/5386 , H01L25/0753 , H01L33/56 , H05K1/038 , H05K1/189 , A41D1/005 , F21Y2115/10 , H01L21/4853 , H01L24/16 , H01L33/62 , H01L2224/16225 , H01L2224/16227 , H01L2924/15174 , H01L2933/0091 , H05K1/0283 , H05K3/284 , H05K2201/10106 , H05K2201/2009
Abstract: A fabric-based item may include fabric layers and other layers of material. An array of electrical components may be mounted in the fabric-based item. The electrical components may be mounted to a support structure such as a flexible printed circuit. The flexible printed circuit may have a mesh shape formed from an array of openings. Serpentine flexible printed circuit segments may extend between the openings. The electrical components may be light-emitting diodes or other electrical devices. Polymer with light-scattering particles or other materials may cover the electrical components. The flexible printed circuit may be laminated between fabric layers or other layers of material in the fabric-based item.
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