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公开(公告)号:US20180084323A1
公开(公告)日:2018-03-22
申请号:US15699064
申请日:2017-09-08
Applicant: Apple Inc.
Inventor: Thomas R. Luce , Anthony P. Grazian , Hongdan Tao , Christopher Wilk , Daniel W. Jarvis , David A. Pakula
CPC classification number: H04R1/025 , H04R1/023 , H04R1/028 , H04R1/2811 , H04R7/18 , H04R9/025 , H04R9/06 , H04R2400/11 , H04R2499/11
Abstract: An electronic device is disclosed that includes one or more sealed audio modules that are unaffected by changes in the internal pressure within the electronic device. The audio modules can also include one or more features that increase the audible bandwidth of the electronic device.
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公开(公告)号:US10397693B1
公开(公告)日:2019-08-27
申请号:US15917426
申请日:2018-03-09
Applicant: Apple Inc.
Inventor: Hongdan Tao , Anthony P. Grazian , Christopher Wilk , Matthew A. Donarski , Michael J. Newman , Onur I. Ilkorur
Abstract: An acoustic enclosure has a housing at least partially defining an acoustic chamber for an acoustic radiator. The housing defines an acoustic port from the acoustic chamber to a surrounding environment. An acoustic resonator has a first resonant chamber and a second resonant chamber. The acoustic resonator also has a first duct to acoustically couple the first resonant chamber with the acoustic chamber and a second duct to acoustically couple the second resonant chamber with the first resonant chamber. An electronic device can have an electro-acoustic transducer. Circuitry in the electronic device can drive the electro-acoustic transducer to emit sound over a selected frequency bandwidth. Damping provided by the first and the second resonant chambers can de-emphasize one or more frequencies and/or extend a frequency response of the acoustic enclosure to improve perceived sound quality emitted by the electronic device.
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公开(公告)号:US10299032B2
公开(公告)日:2019-05-21
申请号:US15701335
申请日:2017-09-11
Applicant: Apple Inc.
Inventor: Anthony P. Grazian , Christopher Wilk , Claudio Notarangelo , Hongdan Tao , Michael J. Newman , Onur I. Ilkorur , Thomas H. Tsang
Abstract: A micro-speaker assembly including an enclosure having an enclosure wall separating a surrounding environment from an encased space, wherein the enclosure wall defines an acoustic port from the encased space to the surrounding environment; a sound radiating surface positioned within the encased space and dividing the encased space into a front volume chamber and a back volume chamber, wherein the front volume chamber is acoustically coupled to a first surface of the sound radiating surface and the acoustic port, and the back volume chamber acoustically coupled to a second surface of the sound radiating surface; and a resonator acoustically coupled to the front volume chamber, wherein the resonator comprises a neck acoustically coupled to an acoustic cavity, and an opening to the neck is positioned at a distance from the acoustic port that corresponds to a quarter wavelength resonance of the front volume chamber.
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公开(公告)号:US20190149925A1
公开(公告)日:2019-05-16
申请号:US16224584
申请日:2018-12-18
Applicant: Apple Inc.
Inventor: Anthony P. Grazian , Christopher Wilk , Hongdan Tao , Scott P. Porter , Michael Asfaw
Abstract: A speaker assembly including a frame and a magnet assembly positioned within the frame. The magnet assembly may include a magnet and a top plate. The assembly further including a sound radiating surface suspended over the magnet assembly. The sound radiating surface includes a flexible circuit. A suspension suspending the sound radiating surface over the magnet assembly is further provided. The suspension may be over molded to the sound radiating surface and the frame. A voice coil extends from a bottom side of the sound radiating surface and electrically connects to the flexible circuit.
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公开(公告)号:US10219057B2
公开(公告)日:2019-02-26
申请号:US15699064
申请日:2017-09-08
Applicant: Apple Inc.
Inventor: Thomas R. Luce , Anthony P. Grazian , Hongdan Tao , Christopher Wilk , Daniel W. Jarvis , David A. Pakula
Abstract: An electronic device is disclosed that includes one or more sealed audio modules that are unaffected by changes in the internal pressure within the electronic device. The audio modules can also include one or more features that increase the audible bandwidth of the electronic device.
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