公开(公告)号：US20180084323A1

公开(公告)日：2018-03-22

申请号：US15699064

申请日：2017-09-08

Applicant: Apple Inc.

Inventor： Thomas R. Luce ,  Anthony P. Grazian ,  Hongdan Tao ,  Christopher Wilk ,  Daniel W. Jarvis ,  David A. Pakula

IPC: H04R1/02 ,  H04R9/06 ,  H04R1/28 ,  H04R9/02 ,  H04R7/18

CPC classification number: H04R1/025 ,  H04R1/023 ,  H04R1/028 ,  H04R1/2811 ,  H04R7/18 ,  H04R9/025 ,  H04R9/06 ,  H04R2400/11 ,  H04R2499/11

Abstract: An electronic device is disclosed that includes one or more sealed audio modules that are unaffected by changes in the internal pressure within the electronic device. The audio modules can also include one or more features that increase the audible bandwidth of the electronic device.

公开(公告)号：US10219057B2

公开(公告)日：2019-02-26

申请号：US15699064

申请日：2017-09-08

Applicant: Apple Inc.

Inventor： Thomas R. Luce ,  Anthony P. Grazian ,  Hongdan Tao ,  Christopher Wilk ,  Daniel W. Jarvis ,  David A. Pakula

IPC: H04R1/02 ,  H04R1/28 ,  H04R7/18 ,  H04R9/02 ,  H04R9/06

Abstract: An electronic device is disclosed that includes one or more sealed audio modules that are unaffected by changes in the internal pressure within the electronic device. The audio modules can also include one or more features that increase the audible bandwidth of the electronic device.

公开(公告)号：US10015574B1

公开(公告)日：2018-07-03

申请号：US15693888

申请日：2017-09-01

Applicant: Apple Inc.

Inventor： Thomas R. Luce ,  Robert I. Luan ,  Thomas H. Tsang

IPC: H04R1/02 ,  H04R1/04 ,  H04R1/28 ,  H04R7/18 ,  H04R3/00

CPC classification number: H04R1/025 ,  H04R1/023 ,  H04R1/04 ,  H04R1/2853 ,  H04R1/2876 ,  H04R1/288 ,  H04R3/00 ,  H04R7/18 ,  H04R7/22 ,  H04R2499/11

Abstract: A portable electronic device is described and includes a device housing, an acoustic housing disposed within the device housing and defining an interior volume, a speaker diaphragm assembly disposed within the interior volume and in fluid communication with a first opening leading out of the housing, and a microphone disposed within the interior volume and in fluid communication with a second opening leading out of the acoustic housing. Placing both the speaker diaphragm assembly and microphone within the same acoustic housing allows both components to share common power and data transfer circuitry. Furthermore, the additional volume of the acoustic housing used to accommodate the microphone can improve the acoustic performance of the speaker diaphragm assembly by increasing the back volume associated with the speaker diaphragm assembly.