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    FARADAY CAGE FOR WIRELESS CHARGING DEVICES
    13.
    发明公开
    FARADAY CAGE FOR WIRELESS CHARGING DEVICES 审中-公开

    公开(公告)号：EP3451495A1

    公开(公告)日：2019-03-06

    申请号：EP18178206.1

    申请日：2017-09-11

    Applicant: Apple Inc.

    Inventor： GRAHAM, Christopher S. ,  KARANIKOS, Demetrios B. ,  JOL, Eric S. ,  LARSSON, Karl Ruben F. ,  THOMPSON, Paul J. ,  KASAR, Darshan R. ,  HAUG, Grant S. ,  KOWALSKI, Stefan A.

    IPC: H02J50/70 ,  H02J50/40 ,  H02J50/10 ,  H02J7/00

    Abstract: Embodiments describe a wireless charging device that includes:
    a housing having a planar charging surface and one or more walls that define an interior cavity;
    a transmitter coil arrangement positioned within the interior cavity, the transmitter coil arrangement including a plurality of transmitter coils positioned within the interior cavity in an overlapping arrangement such that different coils in the plurality of coils are on different planes and each of the plurality of transmitter coils has a central axis positioned a lateral distance away from the central axes of all other transmitter coils of the plurality of transmitter coils; and
    a faraday cage enclosing the transmitter coil arrangement, the faraday cage comprising:
    an electromagnetic shield positioned between the transmitter coil arrangement and the first shell;
    an interconnection structure positioned within the interior cavity below the transmitter coil arrangement, the interconnection structure including a plurality of packaged electrical components mounted on the interconnection structure;
    a ferromagnetic shield positioned between the transmitter coil arrangement and the interconnection structure; and
    a conductive grounding fence disposed around a perimeter of the interconnection structure and between the electromagnetic shield and the interconnection structure.

    INTERCONNECTIONS FOR MULTI-LAYER TRANSMITTER COIL ARRANGEMENTS IN WIRELESS CHARGING MATS
    16.
    发明公开
    INTERCONNECTIONS FOR MULTI-LAYER TRANSMITTER COIL ARRANGEMENTS IN WIRELESS CHARGING MATS 审中-公开

    公开(公告)号：EP3451494A1

    公开(公告)日：2019-03-06

    申请号：EP18178217.8

    申请日：2017-09-11

    Applicant: Apple Inc.

    Inventor： GRAHAM, Christopher S. ,  KARANIKOS, Demetrios B. ,  JOL, Eric S. ,  LARSSON, Karl Ruben F. ,  THOMPSON, Paul J. ,  KASAR, Darshan R. ,  HAUG, Grant S. ,  KOWALSKI, Stefan A.

    IPC: H02J50/40 ,  H02J7/00 ,  H02J50/70 ,  H02J50/10

    Abstract: Embodiments describe a wireless charging device that includes: a housing having a charging surface, the housing including first and second walls defining an interior cavity;
    a transmitter coil arrangement disposed within the interior cavity, the transmitter coil arrangement including a plurality of transmitter coils arranged in at least a top layer, a bottom layer, and a middle layer between the top and bottom layers, and positioned within the interior cavity in an overlapping arrangement such that different coils in the plurality of coils are on different planes and each of the plurality of transmitter coils has a central axis positioned a lateral distance away from the central axes of all other transmitter coils of the plurality of transmitter coils;
    a plurality of cowlings for confining the plurality of planar transmitter coils in their respective positions;
    an interconnection structure positioned within the interior cavity between the transmitter coil arrangement and the second wall, the interconnection structure comprising a plurality of packaged electrical components mounted onto the interconnection structure; and
    a plurality of standoffs coupled to the interconnection structure and configured to electrically couple the transmitter coil arrangement to the plurality of packaged electrical components, wherein the plurality of standoffs includes:
    a first standoff configured to couple the interconnection structure to a transmitter coil in the top layer;
    a second standoff configured to couple the interconnection structure to a transmitter coil in the middle layer; and
    a third standoff configured to couple the interconnection structure to a transmitter coil in the bottom layer.

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