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    Deformation Compensating Compliant Material
    11.
    发明申请
    Deformation Compensating Compliant Material 有权
    变形补偿材料

    公开(公告)号：US20160195441A1

    公开(公告)日：2016-07-07

    申请号：US14721111

    申请日：2015-05-26

    Applicant: Apple Inc.

    Inventor： Jason C. Sauers ,  Po-Jui Chen ,  Tyler S. Bushnell

    IPC: G01L1/26 ,  G01L1/04

    CPC classification number: G01L1/142 ,  G01L1/26 ,  G06F3/0414 ,  G06F3/044

    Abstract: A force sensor includes compliant material that is configured to stay within a maximum uncompressed dimension in a first direction when compressed in a second direction. The first direction may be perpendicular to the second direction. The compliant material may stay within the maximum uncompressed dimension when compressed by expanding into one or more gaps defined in the compliant material. Such gaps may be defined on an external surface of the compliant material and/or internal to the compliant material. The gaps may be formed using a variety of different processes during or after formation of the compliant material.

    Abstract translation: 力传感器包括柔性材料，其被配置为当沿第二方向被压缩时在第一方向上保持在最大未压缩尺寸内。 第一方向可以垂直于第二方向。 当通过膨胀到柔性材料中限定的一个或多个间隙中时，柔性材料可以保持在最大未压缩尺寸内。 这种间隙可以限定在顺应性材料的外表面上和/或柔性材料的内部。 可以在形成顺应性材料期间或之后使用各种不同的工艺形成间隙。

    Methods for Bonding Substrates Using Liquid Adhesive
    12.
    发明申请
    Methods for Bonding Substrates Using Liquid Adhesive 有权
    使用液体粘合剂粘合基材的方法

    公开(公告)号：US20140246148A1

    公开(公告)日：2014-09-04

    申请号：US14183224

    申请日：2014-02-18

    Applicant: Apple Inc.

    Inventor： Cyrus Y. Liu ,  Kuo-Hua Sung ,  Po-Jui Chen ,  Silvio Grespan

    IPC: H05K5/06 ,  H05K13/00

    CPC classification number: F16B11/006 ,  B32B5/26 ,  B32B7/12 ,  B32B2457/00 ,  B32B2457/20 ,  C09J5/00 ,  C09J2205/31 ,  G02F2202/28 ,  Y10T156/10

    Abstract: Structures in an electronic device such as substrates associated with a display may be bonded together using liquid adhesive. Fiber-based equipment may be used to apply ultraviolet light to peripheral edges of an adhesive layer during bonding. There-dimensional adhesive shapes may be produced using nozzles with adjustable openings, computer-controlled positioners, and other adhesive dispensing equipment. Ultraviolet light may be applied to liquid adhesive through a mask with an opacity gradient. Adjustable shutter structures may control adhesive exposure to ultraviolet light. Ultraviolet light exposure may be used to create an adhesive dam that helps create a well defined adhesive border. Multiple layers of adhesive may be applied between a pair of substrates.

    Abstract translation: 诸如与显示器相关联的基板的电子设备中的结构可以使用液体粘合剂粘合在一起。 可以使用基于光纤的设备在粘合期间将紫外光施加到粘合剂层的周边边缘。 可以使用具有可调开口的喷嘴，计算机控制的定位器和其它粘合剂分配设备来制造尺寸的粘合剂形状。 可以通过具有不透明度梯度的面罩将紫外光施加到液体粘合剂上。 可调节的快门结构可以控制粘合剂暴露于紫外线。 可以使用紫外线曝光来创建粘合剂坝，有助于创建良好界定的粘合剂边界。 可以在一对基板之间施加多层粘合剂。

    Electronic Device Having Force Sensor Air Flow Promotion Structures
    14.
    发明申请
    Electronic Device Having Force Sensor Air Flow Promotion Structures 审中-公开

    公开(公告)号：US20190179450A1

    公开(公告)日：2019-06-13

    申请号：US16212488

    申请日：2018-12-06

    Applicant: Apple Inc.

    Inventor： Wei Lin ,  Henry E. Herman, III ,  Po-Jui Chen ,  Robert W. Rumford ,  Steve L. Terry ,  Yindar Chuo

    IPC: G06F3/044

    Abstract: An electronic device such as a device with a display may have a force sensor. The force sensor may include capacitive electrodes separated by a deformable layer such as a layer of an elastomeric polymer. The display or other layers in the electronic device may deform inwardly under applied force from a finger of a user or other external object. As the deformed layers contact the deformable layer, the deformable layer is compressed and the spacing between the capacitive electrodes of the force sensor decreases. This causes a measurable rise in the capacitance signal and therefore the force signal output of the force sensor. To prevent the deformable layer from sticking to the inner surface of the display layers, air flow promotion structures may be interposed between the deformable layer and the inner surface of the display. The air flow promotion structures may include spacer pads with anti-stick surfaces.

    Conductive adhesive film structures
    15.
    发明授权
    Conductive adhesive film structures 有权

    公开(公告)号：US10224304B2

    公开(公告)日：2019-03-05

    申请号：US15421194

    申请日：2017-01-31

    Applicant: Apple Inc.

    Inventor： Wei Lin ,  Nathan K. Gupta ,  Po-Jui Chen

    IPC: H01L23/00 ,  C09J9/02 ,  C09J11/04 ,  C08K7/00 ,  C08K9/02 ,  C08K3/08

    Abstract: Conductive adhesive films can include a binding material having a first set of conductive particles therewithin. The binding material can be electrically non-conductive and can flow between and bond external electronic components during a bonding process. The first set of conductive particles can each have cores formed of a first material, such as polymer, and coatings surrounding the cores, the coatings formed of a second material that is electrically conductive, such as nickel. The binding material can also include a second set of smaller conductive particles formed of a third material that is electrically conductive, such as copper, which can have coatings formed of a fourth material that is electrically conductive, such as silver. The first set of conductive particles can each be sphere shaped, and the second set of conductive particles can each be flake shaped. The conductive particles can form electrical paths between the external electronic components.

    Reinforcement components for electrical connections with limited accessibility and systems and methods for making the same
    16.
    发明授权
    Reinforcement components for electrical connections with limited accessibility and systems and methods for making the same 有权

    公开(公告)号：US10098224B1

    公开(公告)日：2018-10-09

    申请号：US15871585

    申请日：2018-01-15

    Applicant: Apple Inc.

    Inventor： Yindar Chuo ,  Nathan K. Gupta ,  Po-Jui Chen ,  Wei Lin ,  Wei-Hao Sun ,  Jui-Ming Yang

    IPC: H05K1/00 ,  H05K1/02 ,  H01R12/77 ,  H01R12/59 ,  H05K1/03 ,  B32B38/00 ,  H01R43/02

    Abstract: Reinforcement components for electrical connections with limited accessibility Shield structures with reduced spacing between adjacent insulation components and systems and methods for making the same are provided. In some embodiments, a reinforcement component may be compressed between two portions of a first electronic component in order to deform the reinforcement component for filling in a void between the reinforcement component and a coupling formed between the first electronic component and a second electronic component. The first electronic component may be a flexible circuit component that may be folded over the reinforcement component prior to the reinforcement component being compressed. This may enable the reinforcement component to be effectively positioned with respect to the first electronic component prior to being deformed for reinforcing one or more couplings made between the first electronic component and the second electronic component.

    Deformation compensating compliant material
    17.
    发明授权
    Deformation compensating compliant material 有权

    公开(公告)号：US09863822B2

    公开(公告)日：2018-01-09

    申请号：US14721111

    申请日：2015-05-26

    Applicant: Apple Inc.

    Inventor： Jason C. Sauers ,  Po-Jui Chen ,  Tyler S. Bushnell

    IPC: G01L1/00 ,  G01L1/14 ,  G01L1/26 ,  G06F3/044 ,  G06F3/041

    CPC classification number: G01L1/142 ,  G01L1/26 ,  G06F3/0414 ,  G06F3/044

    Abstract: A force sensor includes compliant material that is configured to stay within a maximum uncompressed dimension in a first direction when compressed in a second direction. The first direction may be perpendicular to the second direction. The compliant material may stay within the maximum uncompressed dimension when compressed by expanding into one or more gaps defined in the compliant material. Such gaps may be defined on an external surface of the compliant material and/or internal to the compliant material. The gaps may be formed using a variety of different processes during or after formation of the compliant material.

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