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公开(公告)号：US20190267718A1
公开(公告)日：2019-08-29
申请号：US15906979
申请日：2018-02-27
Applicant: Apple Inc.
Inventor： Harish Rajagopalan , Rodney A. Gomez Angulo , Simone Paulotto , Matthew A. Mow , Bilgehan Avser , Hao Xu , Jennifer M. Edwards , Mattia Pascolini
Abstract: An electronic device may be provided with a sidewall, a display module separated from the sidewall by a gap a display cover, a conductive bucket mounted to the display cover within the gap, and a phased antenna array mounted to the bucket for conveying millimeter wave signals through the display cover. The sidewall may form part of an antenna for conveying non-millimeter wave signals. The array may include resonating elements on a substrate. The resonating elements may be fed using feed terminals coupled to alternating sides of the resonating elements. Dielectric layers having a dielectric constant lower than that of the display cover may be provided on a surface of the display cover within the bucket. The array may operate with satisfactory efficiency despite the small amount of available space within the device, electromagnetic interference from the sidewall and the display module, and dielectric loading by the display cover.
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公开(公告)号：US20190173160A1
公开(公告)日：2019-06-06
申请号：US16272932
申请日：2019-02-11
Applicant: Apple Inc.
Inventor： Matthew A. Mow , Basim H. Noori , Mattia Pascolini , Xu Han , Victor C. Lee , Ming-Ju Tsai , Simone Paulotto
Abstract: An electronic device may be provided with wireless circuitry. The wireless circuitry may include one or more antennas. The antennas may include millimeter wave antenna arrays formed from arrays of patch antennas, dipole antennas or other millimeter wave antennas on millimeter wave antenna array substrates. Circuitry such as upconverter and downconverter circuitry may be mounted on the substrates. The upconverter and downconverter may be coupled to wireless communications circuitry such as a baseband processor circuit using an intermediate frequency signal path. The electronic device may have opposing front and rear faces. A display may cover the front face. A rear housing wall may cover the rear face. A metal midplate may be interposed between the display and rear housing wall. Millimeter wave antenna arrays may transmit and receive antenna signals through the rear housing wall.
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公开(公告)号：US20190027838A1
公开(公告)日：2019-01-24
申请号：US15658141
申请日：2017-07-24
Applicant: Apple Inc.
Inventor： Simone Paulotto , Basim H. Noori , Matthew A. Mow
CPC classification number: H01Q21/065 , H01Q1/2266 , H01Q1/242 , H01Q1/243 , H01Q1/38 , H01Q1/48 , H01Q5/335 , H01Q5/385 , H01Q9/045 , H01Q21/0025 , H01Q21/08 , H01Q21/22 , H01Q21/24 , H01Q21/28
Abstract: An electronic device may be provided with millimeter wave transceiver circuitry and an antenna having a ground and a resonating element. The resonating element may include first and second patches symmetrically distributed about an axis. The antenna may be fed using an antenna feed having a first feed terminal coupled to both the first and second patches and a second feed terminal coupled to the ground. The first feed terminal may be coupled to the first patch at a side closest to the second patch and may be coupled to the second patch at a side closest to the first patch. The first and second patches may be shorted to the ground if desired. Antenna currents on the first patch may be 180 degrees out of phase with antenna currents on the second patch. The antenna may be arranged in an array of antennas with different polarizations.
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公开(公告)号：US20240072417A1
公开(公告)日：2024-02-29
申请号：US18502979
申请日：2023-11-06
Applicant: Apple Inc.
Inventor： Jennifer M. Edwards , Harish Rajagopalan , Simone Paulotto , Bilgehan Avser , Hao Xu , Rodney A. Gomez Angulo , Siwen Yong , Matthew A. Mow , Mattia Pascolini
CPC classification number: H01Q1/243 , H01Q1/38 , H01Q3/26 , H01Q3/2605 , H01Q3/2658 , H01Q9/0414 , H01Q21/061 , H01Q21/065 , H01Q21/22
Abstract: An electronic device may be provided with a dielectric cover layer, a dielectric substrate, and a phased antenna array on the dielectric substrate for conveying millimeter wave signals through the dielectric cover layer. The array may include conductive traces mounted against the dielectric layer. The conductive traces may form patch elements or parasitic elements for the phased antenna array. The dielectric layer may have a dielectric constant and a thickness selected to form a quarter wave impedance transformer for the array at a wavelength of operation of the array. The substrate may include fences of conductive vias that laterally surround each of the antennas within the array. When configured in this way, signal attenuation, destructive interference, and surface wave generation associated with the presence of the dielectric layer over the phased antenna array may be minimized.
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公开(公告)号：US11811133B2
公开(公告)日：2023-11-07
申请号：US17314740
申请日：2021-05-07
Applicant: Apple Inc.
Inventor： Jennifer M. Edwards , Harish Rajagopalan , Simone Paulotto , Bilgehan Avser , Hao Xu , Rodney A. Gomez Angulo , Siwen Yong , Matthew A. Mow , Mattia Pascolini
CPC classification number: H01Q1/243 , H01Q1/38 , H01Q3/26 , H01Q3/2605 , H01Q3/2658 , H01Q21/061 , H01Q21/065 , H01Q21/22
Abstract: An electronic device may be provided with a dielectric cover layer, a dielectric substrate, and a phased antenna array on the dielectric substrate for conveying millimeter wave signals through the dielectric cover layer. The array may include conductive traces mounted against the dielectric layer. The conductive traces may form patch elements or parasitic elements for the phased antenna array. The dielectric layer may have a dielectric constant and a thickness selected to form a quarter wave impedance transformer for the array at a wavelength of operation of the array. The substrate may include fences of conductive vias that laterally surround each of the antennas within the array. When configured in this way, signal attenuation, destructive interference, and surface wave generation associated with the presence of the dielectric layer over the phased antenna array may be minimized.
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Patent Agency Ranking
公开(公告)号：US20230327339A1
公开(公告)日：2023-10-12
申请号：US18335905
申请日：2023-06-15
Applicant: Apple Inc.
Inventor： Bilgehan Avser , Harish Rajagopalan , Simone Paulotto , Jennifer M. Edwards , Mattia Pascolini
CPC classification number: H01Q9/0407 , H01Q5/40 , H01Q1/241 , H01Q3/2658 , H01Q3/267
Abstract: An electronic device may be provided with a phased antenna array and a display cover layer. The phased antenna array may include a probe-fed dielectric resonator antenna. The antenna may include a dielectric resonating element mounted to a flexible printed circuit. A feed probe may be formed from a patch of conductive traces on a sidewall of the resonating element. The feed probe may excite resonant modes of the resonating element. The resonating element may convey corresponding radio-frequency signals through the display cover layer. An additional feed probe may be mounted to an orthogonal sidewall of the resonating element for covering additional polarizations. Probe-fed dielectric resonator antennas for covering different polarizations and frequencies may be interleaved across the phased antenna array.
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公开(公告)号：US11728569B2
公开(公告)日：2023-08-15
申请号：US17111131
申请日：2020-12-03
Applicant: Apple Inc.
Inventor： Bilgehan Avser , Harish Rajagopalan , Simone Paulotto , Jennifer M. Edwards , Hao Xu , Rodney A. Gomez Angulo , Matthew D. Hill , Mattia Pascolini
CPC classification number: H01Q9/0485 , H01Q1/243 , H01Q21/0075
Abstract: An electronic device may be provided with a phased antenna array and a display cover layer. The phased antenna array may include a dielectric resonator antenna. The dielectric resonator antenna may include a dielectric resonating element embedded in a lower permittivity dielectric substrate. The substrate and the resonating element may be mounted to a flexible printed circuit. A slot may be formed in ground traces on the flexible printed circuit and aligned with the resonating element. The slot may excite resonant modes of the resonating element. The resonating element may convey corresponding radio-frequency signals through the cover layer. A dielectric matching layer may be interposed between the resonating element and the cover layer. If desired, the slot may radiate additional radio-frequency signals and the matching layer may have a tapered shape. Dielectric resonator antennas for covering different polarizations and frequencies may be interleaved across the array.
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公开(公告)号：US11700035B2
公开(公告)日：2023-07-11
申请号：US16920297
申请日：2020-07-02
Applicant: Apple Inc.
Inventor： Harish Rajagopalan , Bilgehan Avser , David Garrido Lopez , Forhad Hasnat , Mattia Pascolini , Mikal Askarian Amiri , Rodney A. Gomez Angulo , Thomas W. Yang , Jiechen Wu , Eric N. Nyland , Simone Paulotto , Jennifer M. Edwards , Matthew D. Hill , Ihtesham H. Chowdhury , David A. Hurrell , Siwen Yong , Jiangfeng Wu , Daniel C. Wagman , Soroush Akbarzadeh , Robert Scritzky , Subramanian Ramalingam
CPC classification number: H04B3/52 , G01R31/2822 , H01Q1/2283 , H01Q13/24 , H04B3/54
Abstract: An electronic device may be provided with an antenna module having a substrate. A phased antenna array of dielectric resonator antennas and a radio-frequency integrated circuit for the array may be mounted to one or more surfaces of the substrate. The dielectric resonator antennas may include dielectric columns excited by feed probes. The feed probes may be printed onto sidewalls of the dielectric columns or may be pressed against the sidewalls by biasing structures. A plastic substrate may be molded over each dielectric column and each of the feed probes in the array. The feed probes may cover multiple polarizations. The array may include elements for covering multiple frequency bands. The dielectric columns may be aligned a longitudinal axis and may be rotated at a non-zero and non-perpendicular angle with respect to the longitudinal axis.
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公开(公告)号：US11340329B2
公开(公告)日：2022-05-24
申请号：US16563658
申请日：2019-09-06
Applicant: Apple Inc.
Inventor： Simone Paulotto , Carlo Di Nallo
Abstract: An electronic device may be provided with control circuitry and wireless circuitry. The wireless circuitry may include a phased antenna array and a radio-frequency integrated circuit having transmit and receive ports. The array may include a first set of stacked patch antennas coupled to the transmit ports and a second set of stacked patch antennas coupled to the receive ports. The integrated circuit may transmit ranging signals at millimeter wave frequencies using the transmit ports and the first set of antennas. The integrated circuit may receive a reflected version of the transmitted ranging signals that has been reflected off of an external object using the receive ports and the second set of antennas. The control circuitry may identify a distance between the electronic device and the external object based on the transmitted and received signals.
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公开(公告)号：US20220109464A1
公开(公告)日：2022-04-07
申请号：US17223888
申请日：2021-04-06
Applicant: Apple Inc.
Inventor： Bilgehan Avser , Harish Rajagopalan , Jennifer M. Edwards , Simone Paulotto , Siwen Yong
Abstract: An electronic device may include a transmission line path having a signal conductor embedded in a substrate. A contact pad may be patterned on a surface of the substrate. A radio-frequency component may be mounted to the contact pad using solder. Multi-layer impedance matching structures may couple the signal conductor to the contact pad. The matching structures may include a set of via pads and a set of conductive vias coupled in series between the signal conductor and the contact pad. The area of the via pads may vary across the set of via pads and/or the aspect ratio of the conductive vias may vary across the set of conductive vias. The matching structures may perform impedance matching between the signal conductor and the radio-frequency component at frequencies greater than 10 GHz while occupying a minimal amount of space in the device.
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