Seals for Optical Components
    11.
    发明公开

    公开(公告)号:US20240118538A1

    公开(公告)日:2024-04-11

    申请号:US18543843

    申请日:2023-12-18

    Applicant: Apple Inc.

    CPC classification number: G02B27/0006

    Abstract: An electronic device may have optical components that each have first and second transparent layers such as first and second glass layers. The glass layers may have outer surfaces that face away from each other and inner surfaces that face towards each other. A polymer layer is formed between the inner surfaces of the glass layers. Along the periphery of each optical component, a hermetic seal is formed to protect the polymer material of the polymer layer. The seal may include one or more metal layers that are coupled to the first and second glass layers. Alternatively or additionally, the seal may include an internal seal, such as a metal foil layer that extends between the first and second glass layers, within the optical component to reduce the width of the optical component.

    Electronic devices with drawn sheet-packed coherent fiber bundles

    公开(公告)号:US11525955B1

    公开(公告)日:2022-12-13

    申请号:US17327441

    申请日:2021-05-21

    Applicant: Apple Inc.

    Abstract: An electronic device may have a display, a display cover layer, and a drawn sheet-packed coherent fiber bundle. The coherent fiber bundle may have an input surface that receives an image from the display and a corresponding output surface to which the image is transported. The coherent fiber bundle may be placed between the display and the display cover layer and mounted to a housing. The coherent fiber bundle may have fiber cores with bends that help conceal the housing from view and make the display appear borderless. The coherent fiber bundle has filaments formed from elongated strands of binder in which multiple fibers are embedded. Sheets of filaments are stacked and fused together to form a block of material that is subsequently drawn to form the drawn sheet-packed coherent fiber bundle.

    Load cell array for detection of force input to an electronic device enclosure

    公开(公告)号:US11340725B2

    公开(公告)日:2022-05-24

    申请号:US17027296

    申请日:2020-09-21

    Applicant: Apple Inc.

    Abstract: A force input sensor includes a load cell to adapt a compressive force applied to the force input sensor into a strain experienced by a strain sensor in the load cell. In particular, the load cell includes two compression plates separated from one another by a gap so as to define a volume between them. A flexible substrate (a “diaphragm”)—includes a strain sensor and is disposed and supported within the volume. One of the two compression plates includes a feature (a “loading feature”) that extends toward a central region of the flexible substrate. As a result of this construction, when the compression plates receive a compressive force, the loading feature induces a bending moment in the flexible substrate, thereby straining the strain sensor.

    Electronic devices with image transport layers

    公开(公告)号:US11215752B1

    公开(公告)日:2022-01-04

    申请号:US17112147

    申请日:2020-12-04

    Applicant: Apple Inc.

    Abstract: An electronic device may have a housing with a display. A protective display cover layer for the display may have an image transport layer such as an image transport layer formed from optical fibers. Extruded filaments of binder material may be fused together to form a layer of binder for the image transport layer. Each filament may contain multiple embedded optical fibers. As a result of the extrusion process, the optical fibers may be characterized by increasing lateral deformation at increasing distances from the center of the filament in which the optical fibers are embedded. Tension variations and variations in the orientation angle of the fibers in the image transport layer can be maintained below desired limits to ensure satisfactory optical performance for the image transport layer. The optical fibers and binder may be formed from polymers or other clear materials.

    Shield structures with reduced spacing between adjacent insulation components and systems and methods for making the same

    公开(公告)号:US10238018B1

    公开(公告)日:2019-03-19

    申请号:US15836424

    申请日:2017-12-08

    Applicant: Apple Inc.

    Abstract: Shield structures with reduced spacing between adjacent insulation components and systems and methods for making the same are provided. In some embodiments, different insulation components of different layers of a stack may be attached to the same surface of a shield component during a single attachment (e.g., lamination) operation to attenuate the spacing between the different insulation components attached to the shield component. Limiting the size of a spacing between adjacent insulation components along a shield component of a shield structure may limit the size of an exposed portion of the shield component, which may limit the opportunity for that exposed shield component portion to be shorted to another structure (e.g., a support structure of an electronic device that includes the shield structure).

    Electronic devices with coherent fiber bundles

    公开(公告)号:US11754779B1

    公开(公告)日:2023-09-12

    申请号:US17376460

    申请日:2021-07-15

    Applicant: Apple Inc.

    CPC classification number: G02B6/06

    Abstract: An electronic device may have a display, a display cover layer, and an image transport layer formed from a coherent fiber bundle. The coherent fiber bundle may have an input surface that receives an image from the display and a corresponding output surface to which the image is provide through the coherent fiber bundle. The coherent fiber bundle may be placed between the display and the display cover layer and mounted to a housing. The coherent fiber bundle may have fiber cores with bends that help conceal the housing from view and make the display appear borderless. A central portion of the coherent fiber bundle may be formed from different materials and/or structures than a surrounding border portion of the layer.

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