公开(公告)号：US11521937B2

公开(公告)日：2022-12-06

申请号：US17098597

申请日：2020-11-16

Applicant: Applied Materials, Inc.

Inventor： Steven Verhaverbeke ,  Han-Wen Chen ,  Giback Park ,  Chintan Buch

IPC: H01L23/552 ,  H01L23/538 ,  H01L23/532 ,  H01L25/065

Abstract: The present disclosure relates to thin-form-factor semiconductor packages with integrated electromagnetic interference (“EMI”) shields and methods for forming the same. The packages described herein may be utilized to form high-density semiconductor devices. In certain embodiments, a silicon substrate is laser ablated to include one or more cavities and a plurality of vias surrounding the cavities. One or more semiconductor dies may be placed within the cavities and thereafter embedded in the substrate upon formation of an insulating layer thereon. A plurality of conductive interconnections are formed within the vias and may have contact points redistributed to desired surfaces of the die-embedded substrate assembly. Thereafter, an EMI shield is plated onto a surface of the die-embedded substrate assembly and connected to ground by at least one of the one or more conductive interconnections. The die-embedded substrate assembly may then be singulated and/or integrated with another semiconductor device.

公开(公告)号：US20220246558A1

公开(公告)日：2022-08-04

申请号：US17725003

申请日：2022-04-20

Applicant: Applied Materials, Inc.

Inventor： Chintan Buch ,  Roman Gouk ,  Steven Verhaverbeke

IPC: H01L23/00

Abstract: A method for forming microvias for packaging applications is disclosed. A sacrificial photosensitive material is developed to form microvias with reduced diameter and improved placement accuracy. The microvias are filled with a conductive material and the surrounding dielectric is removed and replaced with an RDL polymer layer.

公开(公告)号：US11315890B2

公开(公告)日：2022-04-26

申请号：US17006277

申请日：2020-08-28

Applicant: Applied Materials, Inc.

Inventor： Chintan Buch ,  Roman Gouk ,  Steven Verhaverbeke

IPC: H01L23/00

Abstract: A method for forming microvias for packaging applications is disclosed. A sacrificial photosensitive material is developed to form microvias with reduced diameter and improved placement accuracy. The microvias are filled with a conductive material and the surrounding dielectric is removed and replaced with an RDL polymer layer.

公开(公告)号：US20220071023A1

公开(公告)日：2022-03-03

申请号：US17005954

申请日：2020-08-28

Applicant: Applied Materials, Inc.

Inventor： Tapash Chakraborty ,  Steven Verhaverbeke ,  Han-Wen Chen ,  Chintan Buch ,  Prerna Goradia ,  Giback Park ,  Kyuil Cho

IPC: H05K3/38 ,  H05K3/00 ,  B32B7/12 ,  B32B15/08

Abstract: Methods for forming circuit boards and circuit boards using an adhesion layer are described. A substrate with two surfaces is exposed to a bifunctional organic compound to form an adhesion layer on the first substrate surface. A resin layer is then deposited on the adhesion layer and the exposed substrate surfaces. Portions of the resin layer may be removed to expose metal pads for contacts.

公开(公告)号：US10937726B1

公开(公告)日：2021-03-02

申请号：US16746681

申请日：2020-01-17

Applicant: Applied Materials, Inc.

Inventor： Han-Wen Chen ,  Steven Verhaverbeke ,  Giback Park ,  Kyuil Cho ,  Kurtis Leschkies ,  Roman Gouk ,  Chintan Buch ,  Vincent DiCaprio

IPC: H01L23/498 ,  H01L23/14 ,  H01L21/48

Abstract: The present disclosure relates to semiconductor core assemblies and methods of forming the same. The semiconductor core assemblies described herein may be utilized to form semiconductor package assemblies, PCB assemblies, PCB spacer assemblies, chip carrier assemblies, intermediate carrier assemblies (e.g., for graphics cards), and the like. In one embodiment, a silicon substrate core is structured by direct laser patterning. One or more conductive interconnections are formed in the substrate core and one or more redistribution layers are formed on surfaces thereof. The silicon substrate core may thereafter be utilized as a core structure for a semiconductor package, PCB, PCB spacer, chip carrier, intermediate carrier, or the like.