公开(公告)号：US20200286760A1

公开(公告)日：2020-09-10

申请号：US16752502

申请日：2020-01-24

Applicant: Applied Materials, Inc.

Inventor： Shreyas PATIL SHANTHAVEERASWAMY ,  Ribhu GAUTAM ,  Kumaresan NAGARAJAN ,  Vijay SINGH ,  Andrew J. CONSTANT ,  Michael P. KARAZIM ,  Kim Ramkumar VELLORE

IPC: H01L21/673 ,  H01L21/67

Abstract: Embodiments of the present disclosure relate to a substrate transfer device having a contactless latch and contactless coupling providing the ability to lock and unlock the substrate transfer device at atmospheric and vacuum pressure with without particle generation at a base of the substrate transfer device, the contactless latch, and the contactless coupling. The substrate transfer device includes a lid having one or more lid grooves, a base having one or more base grooves, and a rotation member rotatably coupled to the lid. Each flange of one or more flanges of the substrate transfer device is rotatable in aligned lid grooves and base grooves, and each flange of the one or more flanges has an arm with a ferromagnetic material coupled thereto. The base is coupled to the lid when the ferromagnetic material of the arm is aligned and spaced from a magnetic material of a slot of the one or more base grooves.

公开(公告)号：US20180374736A1

公开(公告)日：2018-12-27

申请号：US16008569

申请日：2018-06-14

Applicant: Applied Materials, Inc.

Inventor： Niranjan KUMAR ,  Kim Ramkumar VELLORE ,  Douglas H. BURNS ,  Gautam PISHARODY ,  Seshadri RAMASWAMI ,  Douglas A. BUCHBERGER, JR.

IPC: H01L21/683 ,  H01L21/02 ,  H01L21/67

Abstract: Embodiments of the disclosure relate to the use of an electrostatic carrier for securing, transporting and assembling dies on a substrate. In one embodiment, an electrostatic carrier includes a body having a top surface and a bottom surface, at least a first bipolar chucking electrode disposed within the body, at least two contact pads disposed on the bottom surface of the body and connected to the first bipolar chucking electrode, and a floating electrode disposed between the first bipolar chucking electrode and the bottom surface. In another embodiment, a die-assembling system includes the electrostatic carrier configured to electrostatically secure a plurality of dies, a carrier-holding platform configured to hold the electrostatic carrier, a die input platform and a loading robot having a range of motion configured to pick the plurality of dies from the die input platform and place them on the electrostatic carrier.