公开(公告)号：US20250132175A1

公开(公告)日：2025-04-24

申请号：US18489214

申请日：2023-10-18

Applicant: Applied Materials, Inc.

Inventor： Tetsuya ISHIKAWA ,  Kim Ramkumar VELLORE ,  Amir H. TAVAKOLI

IPC: H01L21/67 ,  H01L21/687

Abstract: A window component, a chamber, and a method of processing substrates are described herein. In one example, a semiconductor process chamber window component comprises a transparent quartz body. The body comprises a top surface, a bottom surface, a central portion disposed near a center axis of the body, and one or more fluid channels formed within the body. The one or more fluid channels are configured to flow a fluid from a first side of the body towards a second side of the body and the first side is disposed opposite the second side.

公开(公告)号：US20210028044A1

公开(公告)日：2021-01-28

申请号：US16552967

申请日：2019-08-27

Applicant: Applied Materials, Inc.

Inventor： Kim Ramkumar VELLORE ,  Alexander N. LERNER ,  Steven Trey TINDEL

IPC: H01L21/68 ,  H01L21/67 ,  H01L21/677 ,  H01L21/687 ,  H01L21/683 ,  H01L21/673

Abstract: A method includes aligning and positioning a carrier in a predetermined orientation and location within a first front opening pod (FOUP) of a cluster tool, transferring the carrier to a charging station of the cluster tool, transferring a substrate from a second front opening pod (FOUP) of the cluster tool to the charging station and chucking the substrate onto the carrier, transferring the carrier having the substrate thereon from the charging station to a factory interface of the cluster tool, aligning the carrier having the substrate thereon in the factory interface of the cluster tool such that during substrate processing within a processing platform of the cluster tool the carrier is properly oriented and positioned relative to components of the processing platform, where the processing platform comprises one or more processing chambers, transferring the aligned carrier having the substrate thereon from the factory interface to the processing platform of the cluster tool for substrate processing, and transferring the aligned carrier having the processed substrate thereon from the processing platform to the factory interface.

公开(公告)号：US20200373134A1

公开(公告)日：2020-11-26

申请号：US16848614

申请日：2020-04-14

Applicant: Applied Materials, Inc.

Inventor： Alexander N. LERNER ,  Michael P. KARAZIM ,  Andrew J. CONSTANT ,  Jeffrey A. BRODINE ,  Kim Ramkumar VELLORE ,  Kevin MORAES ,  Roey SHAVIV

IPC: H01J37/32 ,  C23C16/04 ,  H01L21/68 ,  H01L21/677 ,  H01L21/673

Abstract: An alignment module for housing and cleaning masks. The alignment module comprises a mask stocker, a cleaning chamber, an alignment chamber, an alignment stage a transfer robot. The mask stocker is configured to house a mask cassette configured to store a plurality of masks. The cleaning chamber is configured to clean the plurality of masks by providing one or more cleaning gases into a chamber after a mask is inserted into the cleaning chamber. The alignment stage is configured to support a carrier and a substrate. The transfer robot is configured to transfer a mask from one or more of the alignment stage and the mask stocker to the cleaning chamber.

公开(公告)号：US20250029850A1

公开(公告)日：2025-01-23

申请号：US18224996

申请日：2023-07-21

Applicant: Applied Materials, Inc.

Inventor： Kim Ramkumar VELLORE ,  Tetsuya ISHIKAWA ,  Ala MORADIAN

IPC: H01L21/67 ,  H01L21/66 ,  H01L21/687

Abstract: The present disclosure relates to methods of analyzing uniformity for substrate processing, and related apparatus and systems, for semiconductor manufacturing. In one or more embodiments, a non-uniformity is indicated, and the non-uniformity is a temperature non-uniformity and/or a physical non-uniformity. In one or more embodiments, a signal profile is accepted or rejected. In one or more embodiments, a method of analyzing uniformity for substrate processing applicable for semiconductor manufacturing includes heating an internal volume of a processing chamber using a target value. The method includes rotating a substrate support, and scanning, while rotating the substrate support, a sensor across one or more sections to take a plurality of readings. The method includes generating a signal profile including the plurality of readings, and analyzing the signal profile by comparing the signal profile to a range.

公开(公告)号：US20210028726A1

公开(公告)日：2021-01-28

申请号：US16655168

申请日：2019-10-16

Applicant: Applied Materials, Inc.

Inventor： Alexander N. LERNER ,  Kim Ramkumar VELLORE ,  Steven Trey TINDEL

IPC: H02N13/00 ,  H01L51/00 ,  H01L51/56 ,  C23C16/458

Abstract: A chucking station comprises a chuck, a power supply, and one or more pumping elements. The chuck comprises a plurality of first vacuum ports configured to interface with a surface of a substrate and a plurality of second vacuum ports configured to interface with a surface of a carrier. The chuck further comprises a first electrical pin configured to be in electrical communication with a first electrode of the carrier, and a second electrical pin configured to be in electrical communication with a second electrode of the carrier. The power supply is configured to apply a chucking voltage and a de-chucking voltage to the first and second electrical pins. The one or more pumping elements is coupled to the first and second vacuum ports and configured to generate a vacuum between the substrate and the chuck and a vacuum between the carrier and the chuck.

公开(公告)号：US20200381278A1

公开(公告)日：2020-12-03

申请号：US16885909

申请日：2020-05-28

Applicant: Applied Materials, Inc.

Inventor： Kim Ramkumar VELLORE ,  Leonid M. TERTITSKI ,  Matthew D. SCOTNEY-CASTLE

IPC: H01L21/67 ,  G01J5/00 ,  H04N5/33

Abstract: A method and apparatus for measuring a temperature of a substrate located in a semiconductor processing environment is disclosed. The substrate has a top surface and an edge surface, and is positioned in a prescribed location within the semiconductor processing environment. An infrared camera oriented to view one side of the edge surface of the substrate is triggered to obtain an infrared image of the one side of the edge surface of the substrate. The infrared image is processed to obtain a temperature profile of the substrate.

公开(公告)号：US20210159106A1

公开(公告)日：2021-05-27

申请号：US17157428

申请日：2021-01-25

Applicant: Applied Materials, Inc.

Inventor： Kim Ramkumar VELLORE ,  Alexander N. LERNER ,  Steven Trey TINDEL

IPC: H01L21/68 ,  H01L21/67 ,  H01L21/677 ,  H01L21/673 ,  H01L21/683 ,  H01L21/687

Abstract: A method includes aligning and positioning a carrier in a predetermined orientation and location within a first front opening pod (FOUP) of a cluster tool, transferring the carrier to a charging station of the cluster tool, transferring a substrate from a second front opening pod (FOUP) of the cluster tool to the charging station and chucking the substrate onto the carrier, transferring the carrier having the substrate thereon from the charging station to a factory interface of the cluster tool, aligning the carrier having the substrate thereon in the factory interface of the cluster tool such that during substrate processing within a processing platform of the cluster tool the carrier is properly oriented and positioned relative to components of the processing platform, where the processing platform comprises one or more processing chambers, transferring the aligned carrier having the substrate thereon from the factory interface to the processing platform of the cluster tool for substrate processing, and transferring the aligned carrier having the processed substrate thereon from the processing platform to the factory interface.

公开(公告)号：US20210028039A1

公开(公告)日：2021-01-28

申请号：US16568910

申请日：2019-09-12

Applicant: Applied Materials, Inc.

Inventor： Steven Trey TINDEL ,  Alexander N. LERNER ,  Kim Ramkumar VELLORE

IPC: H01L21/673 ,  H01L21/68

Abstract: A carrier FOUP and a method of placing a carrier are provided. The carrier FOUP includes a body and a door. The body includes a plurality of chamfers, and one or more carriers are placed on, and supported by, the plurality of chamfers. The method of placing a carrier includes placing the carrier in the carrier FOUP and closing the door of the carrier FOUP. When the door is closed, the door pushes against the carrier and aligns the carrier with the alignment feature. The alignment features align the carrier, removing the need to be aligned by the factory interface robot when placing or removing the carrier from the carrier FOUP.

公开(公告)号：US20200373183A1

公开(公告)日：2020-11-26

申请号：US16848645

申请日：2020-04-14

Applicant: Applied Materials, Inc.

Inventor： Alexander N. LERNER ,  Michael P. KARAZIM ,  Andrew J. CONSTANT ,  Jeffrey A. BRODINE ,  Kim Ramkumar VELLORE ,  Kevin MORAES ,  Roey SHAVIV

IPC: H01L21/68 ,  H01J37/32 ,  C23C16/04 ,  H01L21/677 ,  H01L21/673

Abstract: An alignment module for positioning a mask on a substrate comprises a mask stocker, an alignment stage, and a transfer robot. The mask stocker houses a mask cassette that stores a plurality of masks. The alignment stage is configured to support a carrier and a substrate. The transfer robot is configured to transfer one of the one or more masks from the mask stocker to the alignment stage and position the mask over the substrate. The alignment module may be part of an integrated platform having one or more transfer chambers, a factory interface having a substrate carrier chamber and one or more processing chambers. A carrier may be coupled to a substrate within the substrate carrier chamber and moved between the processing chambers to generate a semiconductor device.

公开(公告)号：US20250027202A1

公开(公告)日：2025-01-23

申请号：US18225007

申请日：2023-07-21

Applicant: Applied Materials, Inc.

Inventor： Tetsuya ISHIKAWA ,  Kim Ramkumar VELLORE

IPC: C23C16/46 ,  G05D23/27

Abstract: The present disclosure relates to methods of adjusting uniformity for substrate processing, and related apparatus and systems, for semiconductor manufacturing. In one or more embodiments, a heating power applied to a set of one or more heat sources is adjusted by an adjustment factor. In one or more embodiments, a method of adjusting uniformity. The method includes scanning a sensor across one or more sections to take a plurality of readings, generating a signal profile including the plurality of readings, and analyzing the signal profile by comparing the signal profile to a range. The method includes adjusting one or more heating parameters if at least one portion of the signal profile is outside of the range. The adjusting includes identifying a set of one or more heat sources that correlate with the at least one portion of the signal profile, and adjusting a heating power by an adjustment factor.