11.
    发明专利
    未知

    公开(公告)号:DE102004051214A1

    公开(公告)日:2006-05-04

    申请号:DE102004051214

    申请日:2004-10-20

    Applicant: BASF AG

    Abstract: Thermoplastic molding compositions, comprising A) from 10 to 98% by weight of at least one polyoxymethylene homo- or copolymer, B) from 0.01 to 50% by weight of B1) at least one highly branched or hyperbranched polycarbonate with an OH number of from 1 to 600 mg KOH/g of polycarbonate (to DIN 53240, Part 2), or B2) at least one highly branched or hyperbranched polyester of A x B y type, where x is at least 1.1 and y is at least 2.1, or a mixture of these, C) from 0 to 60% by weight of other additives, where the total of the percentages by weight of components A) to C) is 100%.

    15.
    发明专利
    未知

    公开(公告)号:DE102005005847A1

    公开(公告)日:2006-08-10

    申请号:DE102005005847

    申请日:2005-02-08

    Applicant: BASF AG

    Abstract: Thermoplastic molding compositions comprising A) from 10 to 99% by weight of at least one thermoplastic polyamide, B) from 0.1 to 5% by weight of at least one polyethyleneimine homo- or copolymer, C) from 0.05 to 3% by weight of a lubricant, D) from 0.05 to 3% by weight of a copper-containing stabilizer or of a sterically hindered phenol or mixtures thereof, E) from 0 to 60% by weight of further additives, the sum of the percentages by weight of components A) to E) adding up to 100%.

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