公开(公告)号：DE2451217A1

公开(公告)日：1976-05-13

申请号：DE2451217

申请日：1974-10-29

Applicant: BASF AG

Inventor： STABENOW JOACHIM DIPL PHYS DR ,  WUNSCH GERD DIPL CHEM DR ,  DEIGNER PAUL DR ,  MUELLER FRANZ-JOSEF DIPL CHEM ,  LOESER WERNER DIPL ING DR ,  STECK WERNER DIPL CHEM DR

IPC: C07F15/00 ,  C23C18/30 ,  C23C17/02 ,  C23C3/02

Abstract: A process for metallizing substrates by activation of the substrate by deposition of palladium from a palladium complex, followed by electroless metallization. The palladium is deposited on the substrate by dipping the substrate into a solution of a palladium(O) complex and decomposing this complex at from 100 DEG to 300 DEG C.