公开(公告)号：DE59001632D1

公开(公告)日：1993-07-15

申请号：DE59001632

申请日：1990-01-25

Applicant: BASF AG

Inventor： STUMPP MICHAEL DR ,  NEUMANN PETER DR ,  EILINGSFELD HEINZ DR

IPC: C07C315/00 ,  C07C317/14

公开(公告)号：DE4001615A1

公开(公告)日：1990-08-02

申请号：DE4001615

申请日：1990-01-20

Applicant: BASF AG

Inventor： STUMPP MICHAEL DR ,  NEUMANN PETER DR

IPC: C07C315/00 ,  C07C317/14

Abstract: Prodn. of bis(4-chlorophenyl) sulphone (I) is effected by reacting chlorobenzene (II) with bis(trimethylsilyl) pyrosulphate (III) and SO3 at 20-100 deg.C. (III) is formed with situ from bis(trimethylsilyl) sulphate (IV) and SO3. The (III):SO3 molar ratio is 0.1-10:1, esp. 0.5-1.2:1. The (II):SO3 molar ratio is 0.1-20:1, esp. 0.9-2:1.

公开(公告)号：DE3902897A1

公开(公告)日：1990-08-02

申请号：DE3902897

申请日：1989-02-01

Applicant: BASF AG

Inventor： STUMPP MICHAEL DR ,  NEUMANN PETER DR

IPC: C07C315/00 ,  C07C317/22

Abstract: Process for the preparation of bis(4-hydroxyphenyl) sulphone by reacting phenyl with sulphuric acid at temperatures from 150 to 200@C, carrying out the reaction in an excess of phenol in the absence of an inert solvent and distilling off the excess phenol continuously at 160 to 200@C during and after the initial step or during and after the intermediate step of the reaction or removing the phenol by distillation after the reaction has more or less ended.

公开(公告)号：DE3902893A1

公开(公告)日：1990-08-02

申请号：DE3902893

申请日：1989-02-01

Applicant: BASF AG

Inventor： STUMPP MICHAEL DR ,  NEUMANN PETER DR

IPC: C07C315/00 ,  C07C317/14

Abstract: Process for the preparation of bis(4-chlorophenyl) sulphone by reacting bismuth tri(4-chlorobenzenesulphinate) in the presence of oxygen at a temperature of 200 to 250@C and pressures of 0.1 to 500 bar.

公开(公告)号：DE3545903A1

公开(公告)日：1987-06-25

申请号：DE3545903

申请日：1985-12-23

Applicant: BASF AG

Inventor： TESCH HELMUT DR ,  STUMPP MICHAEL DR ,  STUTZ HERBERT DR ,  SCHAEFER GERHARD DR ,  NEUMANN PETER DR

IPC: C08G59/50 ,  C08L63/00 ,  C08J5/24 ,  C08K5/43

Abstract: The invention relates to a storage-stable, solvent-free, curable composition comprising A) 100 parts by weight of an epoxy resin, B) from 20 to 80 parts by weight of an epoxy-resin curing agent having the structure in which the amino groups are in the 3,3'- or 4,4'-position, and C) optionally from 0.1 to 5 parts by weight of an accelerator, where the epoxy-resin curing agent is finely dispersed in the epoxy resin and has a particle size of less than 10 mu m. The curable composition is used, in particular, for the preparation of fibre composite materials.