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公开(公告)号:DE4039715A1
公开(公告)日:1992-06-17
申请号:DE4039715
申请日:1990-12-13
Applicant: BASF AG
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公开(公告)号:DE3766990D1
公开(公告)日:1991-02-07
申请号:DE3766990
申请日:1987-02-09
Applicant: BASF AG
Inventor: EISENBARTH PHILIPP DR , HEYM MANFRED DR , STUTZ HERBERT DR , SCHORNICK GUNNAR DR
IPC: C08F222/40 , C08G73/12 , C08J5/24
Abstract: In the process, a mixture of bismaleimide and aminophenol is heated in the presence of an amine as addition catalyst and in the presence of an inhibitor, vinyl or allyl monomers and, if desired, epoxy resins and peroxide initiators are added, and the mixture, as a melt, is applied to reinforcing fibres. The prepregs and semifinished products can be cured to form composite materials for the automotive and aerospace industries.
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公开(公告)号:DE3568586D1
公开(公告)日:1989-04-13
申请号:DE3568586
申请日:1985-07-01
Applicant: BASF AG
Inventor: TESCH HELMUT DR , HEYM MANFRED DR , DOERFLINGER WALTER , STUTZ HERBERT DR , NEUMANN PETER DR , NISSEN DIETMAR DR , SCHAEFER GERHARD DR
IPC: C08G59/00 , C08G59/18 , C08G59/50 , C08J3/24 , C08J5/24 , C09D163/00 , C09J163/00
Abstract: A solvent-free curable composition has a long shelf life and consists of A 100 parts by weight of an epoxy resin and B from 10 to 100 parts by weight of, as a curing agent for the epoxy resin, an aromatic diamine containing groups, with or without C from 0.01 to 5 parts by weight of an accelerator, the curing agent for the epoxy resin being finely dispersed in the latter and preferably having a particle size of less than 10 mu m. The preferred epoxy resin curing agent is 4,4'-diaminodiphenyl ketone. The curable composition is used in particular for the preparation of fiber-reinforced materials.
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公开(公告)号:DE3327823A1
公开(公告)日:1985-02-21
申请号:DE3327823
申请日:1983-08-02
Applicant: BASF AG
Inventor: TESCH HELMUT DR , HENNE ANDREAS DR , HEYM MANFRED DR , STUTZ HERBERT DR
IPC: C07D233/60 , C07D521/00 , C08G59/68 , C08K5/3445 , C08L63/00 , C08G59/40 , C08G59/46 , C08K5/34 , C08J5/00 , C08J5/04
Abstract: A curable composition consisting of A. 100 parts by weight of an epoxy resin, B. from 4 to 100 parts by weight of a conventional curing agent for epoxy resins, and C. from 0.1 to 5 parts by weight of an N-acylimidazole which possesses an aromatic acyl component which is substituted at the two positions ortho to the carbonyl group can be used to produce moldings, coatings, finishes, adhesives and composite fiber materials.
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公开(公告)号:DE3545903A1
公开(公告)日:1987-06-25
申请号:DE3545903
申请日:1985-12-23
Applicant: BASF AG
Inventor: TESCH HELMUT DR , STUMPP MICHAEL DR , STUTZ HERBERT DR , SCHAEFER GERHARD DR , NEUMANN PETER DR
Abstract: The invention relates to a storage-stable, solvent-free, curable composition comprising A) 100 parts by weight of an epoxy resin, B) from 20 to 80 parts by weight of an epoxy-resin curing agent having the structure in which the amino groups are in the 3,3'- or 4,4'-position, and C) optionally from 0.1 to 5 parts by weight of an accelerator, where the epoxy-resin curing agent is finely dispersed in the epoxy resin and has a particle size of less than 10 mu m. The curable composition is used, in particular, for the preparation of fibre composite materials.
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公开(公告)号:DE3172667D1
公开(公告)日:1985-11-21
申请号:DE3172667
申请日:1981-07-04
Applicant: BASF AG
Inventor: STUTZ HERBERT DR , WEYLAND PETER DR , BITTNER GERHARD DR
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公开(公告)号:AT16109T
公开(公告)日:1985-11-15
申请号:AT81105198
申请日:1981-07-04
Applicant: BASF AG
Inventor: STUTZ HERBERT DR , WEYLAND PETER DR , BITTNER GERHARD DR
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公开(公告)号:DE3233605A1
公开(公告)日:1984-03-15
申请号:DE3233605
申请日:1982-09-10
Applicant: BASF AG
Inventor: STUTZ HERBERT DR , ECKERT GUENTER DR
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公开(公告)号:DE2963360D1
公开(公告)日:1982-09-09
申请号:DE2963360
申请日:1979-03-24
Applicant: BASF AG
Inventor: JARRE WOLFGANG DR , STUTZ HERBERT DR , SCHOEN ERNST DR
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公开(公告)号:DE3842306A1
公开(公告)日:1990-06-21
申请号:DE3842306
申请日:1988-12-16
Applicant: BASF AG
Inventor: WEBER THOMAS DR , HECKMANN WALTER DR , MERTES JUERGEN DR , TESCH HELMUT DR , ALTSTAEDT VOLKER DR , EBERLE WOLFGANG DR , FOLDA THOMAS DR , STUTZ HERBERT DR , RECKER HANS-GERT DR
Abstract: The invention relates to curable, impact-modified epoxy resin mixtures comprising A. an aromatic epoxide compound, B. an amine curing agent, C. 10 to 40 % by weight of an aromatic, thermoplastic oligomer containing reactive groups, preferably a polyether sulfone, and D. 0.1 to 10 % by weight of a high-molecular-weight emulsifier, preferably a phenoxy resin, an epoxy resin or a thermoplastic copolymer, which is compatible both with the epoxide compound A and with the oligomer C. The epoxy resin mixtures are suitable for the production of high-performance composite materials.
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