THERMALLY CONDUCTIVE POLYAMIDES
    13.
    发明专利

    公开(公告)号:MY144314A

    公开(公告)日:2011-08-29

    申请号:MYPI20083827

    申请日:2008-09-26

    Applicant: BASF SE

    Abstract: THERMALLY CONDUCTIVE POLYAMIDES 5 THERMOPLASTIC MOULDING MATERIALS COMPRISING A) FROM 19.9 TO 59.9BY WEIGHT OF A THERMOPLASTIC POLYAMIDE, B) FROM 40 TO 80BY WEIGHT OF AN ALUMINIURN OXIDE OR MAGNESIUM OXIDE OR MIXTURES THEREOF, C) FROM 0.1 TO 2BY WEIGHT OF NIGROSINE, D) FROM 0 TO 20BY WEIGHT OF FURTHER ADDITIVES, WHERE THE SUM OF PERCENTAGES BY WEIGHT OF A) TO D) ADDS UP TO 1 00

    HEAT AGING-RESISTANT POLYAMIDES WITH FLAME RETARDANCY

    公开(公告)号:MY156004A

    公开(公告)日:2015-12-31

    申请号:MYPI2012001336

    申请日:2010-10-18

    Applicant: BASF SE

    Abstract: THERMOPLASTIC MOLDING COMPOSITIONS, COMPRISING A) FROM 10 TO 98% BY WEIGHT OF A POLYAMIDE B) FROM 0.001 TO 20% BY WEIGHT OF IRON POWDER WITH A PARTICLE SIZE OF AT MOST 10 µM (D50 VALUE) C) FROM 1 TO 40% BY WEIGHT OF A HALOGEN-FREE FLAME RETARDANT FROM THE GROUP OF THE PHOSPHORUS- OR NITROGEN-COMPOUNDS OR P-N CONDENSATES, OR A MIXTURE OF THESE D) FROM 0 TO 70% BY WEIGHT OF FURTHER ADDITIVES, WHERE THE TOTAL OF THE PERCENTAGES BY WEIGHT OF COMPONENTS A) TO D) IS 100%.

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