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11.发明公开THERMOPLASTIC MOLDING COMPOSITION COMPRISING MICROENCAPSULATED LATENT-HEAT-ACCUMULATOR MATERIAL 审中-公开热塑性弹性体麻醉药物MIT EINEM MIKROVERKAPSELTEN材料FÜRLATENTEWÄRMEAKKUMULATION
公开(公告)号：EP2643393A4
公开(公告)日：2014-07-02
申请号：EP11843396
申请日：2011-11-21
Applicant: BASF SE
Inventor： ALTMANN STEPHAN , OPFERMANN DIRK , SCHRÖDER-GRIMONPONT TINA , SCHMIDT MARCO
CPC classification number: C08L47/00 , C08L23/06 , C08L29/10 , C08L2205/20 , C09K5/063 , Y10T428/2984 , Y10T428/2985 , Y10T428/2987 , Y10T428/2989
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