Abstract:
Disclosed is a method for metallizing a plastic surface. The method may comprise the steps: 1) gasifying the plastic surface to expose the electroless plating promoter; and 2) electroless plating a layer of copper or nickel on the plastic surface, followed by electroplating or a second electroless plating to form a metallized layer on the plastic surface. Further, disclosed are a method for preparing a plastic article and a plastic article as manufactured by the method as described.
Abstract:
A mthod of metalizing a surface of an insulation substrate includes: applying an ink composition onto the surface to form an ink layer; subjecting the insulation substrate to heat treatment at a temperature of about 500 to 1000 degrees Celsius in a non-reactive atmosphere; plating a metal layer on the ink layer. The ink composition comprises a metal compound and an ink vehicle. The metal compound includes at least one selected from a group consisting of a nano-copper oxide, a nano-cuprous oxide, a compound of formula I, and a compound of formula II, TiO2-σ(I), M1M2pOq (II), 0.05≦σ
Abstract:
Disclosed is a method for metallizing a plastic surface. The method may comprise the steps: 1) gasifying the plastic surface to expose the electroless plating promoter; and 2) electroless plating a layer of copper or nickel on the plastic surface, followed by electroplating or a second electroless plating to form a metallized layer on the plastic surface. Further, disclosed are a method for preparing a plastic article and a plastic article as manufactured by the method as described.
Abstract:
The present disclosure provides a metal compound. The metal compound is represented by a formula (I): Cu2AαB2-αO4-β (I). A contains at least one element selected from the groups 6 and 8 of the periodic table. B contains at least one element selected from the group 13 of the periodic table, 0
Abstract:
The present disclosure provides a metal compound. The metal compound is represented by a formula(I): Cu 2 A α B 2-α O 4-β . A contains at least one element selected from the groups 6 and 8 of the periodic table. B contains at least one element selected from the group13 of the periodic table, 0
Abstract:
Metalized plastic substrate and methods of producing the same are provided herein. The method includes providing a plastic having at least one accelerator dispersed in the plastic. The accelerator/s have a formula AM x B y O z , in which A is one or more elements selected from groups 10 and 11 of the Element Periodic Table; M is one or more metal elements in three plus selected from the group consisting of Fe, Co, Mn, Al, Ga, In, TI, and rare earth elements; and O is oxygen; and x=0-2, y=0.01-2; z=1-4; and the accelerator/s further have an alternative formula A'M' m O n , in which A' is one or more elements selected from groups 9, 10, and 11 of the periodic table; M' is one or more elements selected from the group consisting of Cr, Mo, W, Se, Te, and Po; and O is oxygen; and m=0.01-2; n=2-4. The method includes the step of irradiating a surface of plastic substrate to expose at least a first accelerator. The method further includes plating the irradiated surface of the plastic substrate to form at least a first metal layer on the irradiated surface, and then plating the first metal layer to form at least a second metal layer.
Abstract translation:金属化塑料基材及其制备方法。 该方法包括提供一种具有分散在塑料中的至少一种促进剂的塑料。 加速器具有公式AM x B y O z,其中A是选自元素周期表的组10和11的一种或多种元素; M是选自Fe,Co,Mn,Al,Ga,In,TI和稀土元素中的三种加成中的一种或多种金属元素; 和O是氧; x = 0-2,y = 0.01-2; Z = 1-4; 并且加速剂进一步具有另外的式A'M'm O n,其中A'是选自元素周期表第9,10和11族的一种或多种元素; M'是选自Cr,Mo,W,Se,Te和Po中的一种或多种元素; 和O是氧; m = 0.01-2; N = 2-4。 该方法包括照射塑料基板的表面以暴露至少第一加速器的步骤。 该方法还包括电镀塑料基板的照射表面以在被照射的表面上形成至少第一金属层,然后电镀第一金属层以形成至少第二金属层。
Abstract:
A method for metalizing a plastic surface is provided. The method may comprise the steps of: 1) gasifying the plastic surface to expose the chemical plating promoter; 2) chemical plating a layer of copper or nickel on the plastic surface, and 3) plating the plated surface in step 2) by electroplating or chemical plating at least one more time to form a metalized layer on the plastic surface. Further, A method for preparing a plastic article and a plastic article manufactured by the method as described may be provided.
Abstract:
A metalized plastic article and a method for selectively metallizing a surface of a plastic substrate are provide. The metalized plastic article includes a plastic substrate and a metal plating layer formed on the surface of the plastic substrate. At least a surface layer of the plastic substrate covered by the metal plating layer is formed by a plastic composition. The plastic composition includes a base resin and a doped tin oxide. A doping element of the doped tin oxide is at least one selected from a group consisting of cerium, lanthanum, fluorine and tantalum. The metalized plastic article of the present disclosure has a good light absorption performance and a high chemical plating activity.