公开(公告)号：JPS5399334A

公开(公告)日：1978-08-30

申请号：JP1157978

申请日：1978-02-06

Applicant: BAYER AG

Inventor： GERUHARUTO DEIITAA BORUFU ,  ROBERUTO BIIRURINKU ,  DERUFU SHIYUMITSUTO

IPC: A61K31/765 ,  A61K31/74 ,  A61K31/785 ,  A61P35/00 ,  C08F8/00 ,  C08F8/12 ,  C08F16/00 ,  C08F18/00 ,  C08F18/02 ,  C08F20/00 ,  C08F20/34

公开(公告)号：JPH04269519A

公开(公告)日：1992-09-25

申请号：JP32394691

申请日：1991-11-13

Applicant: BAYER AG

Inventor： GERUHARUTO DEIITAA BORUFU ,  HENINGU GIZETSUKE ,  YOAHIMU BANKU

IPC: B29C45/14 ,  B29C45/16 ,  B29K105/20 ,  B29L31/34 ,  H05K1/00 ,  H05K3/00 ,  H05K3/10 ,  H05K3/18 ,  H05K3/20

Abstract: PURPOSE: To obtain an injection-molded printed circuit board of high quality by forming a copper layer of a conductor track pattern in a specified thickness on a flexible support in an electroless copper bath and by injection-molding thermoplastic resin on the rear of the support. CONSTITUTION: A conductor track pattern is printed on a flexible support of a polyester film or the like by using paste for screen printing which contains a metallization activator. As for a composition containing this activator, the composition stated in German open specification DE-OS 3,627,256 or the like is used, for instance. After drying, the composition is reduced to be sensitized by using formaldehyde or the like, for instance, and the pattern is metallized in an electroless metal bath. At this time, direct reduction and metallization are made preferably in a copper bath containing formalin. This metallization may be conducted also after injection molding. The thickness of a copper layer is preferably 0.05-10 μm. It is also possible to form a circuit by a common semi-addition technique after the whole surface is metallized by applying the aforesaid compounding additive thereto.

公开(公告)号：JPH0351790B2

公开(公告)日：1991-08-07

申请号：JP18564487

申请日：1987-07-27

Applicant: BAYER AG

Inventor： HENINGU GIIZETSUKE ,  GERUHARUTO DEIITAA BORUFU ,  YOAHIMU PUROPUSUTO ,  KURAUSU SHUSUTAA

IPC: C23C18/20 ,  C23C18/28 ,  H05K3/18 ,  H05K3/38

公开(公告)号：JPH01205080A

公开(公告)日：1989-08-17

申请号：JP31871588

申请日：1988-12-19

Applicant: BAYER AG

Inventor： HENINGU GIIZETSUKE ,  GERUHARUTO DEIITAA BORUFU ,  BIRUFURIITO TSUETSUHIYAA

IPC: C08J7/12 ,  C08L79/08 ,  C23C18/30 ,  C23C18/40 ,  H05K1/03 ,  H05K3/18 ,  H05K3/38

公开(公告)号：JPS6118195A

公开(公告)日：1986-01-27

申请号：JP13805185

申请日：1985-06-26

Applicant: Bayer Ag

Inventor： KIRUKORU JIRINIAN ,  GERUHARUTO DEIITAA BORUFU ,  URURITSUHI FUON GITSUITSUKI ,  RUDORUFU MERUTEN

IPC: H05K3/18 ,  C23C18/16 ,  C23C18/26 ,  C23C18/28 ,  C23C18/30 ,  C23C18/31 ,  C23C18/40 ,  C23C18/44 ,  C23C18/50 ,  C23C18/52 ,  C25D7/00

CPC classification number: C23C18/28

公开(公告)号：JPS60206085A

公开(公告)日：1985-10-17

申请号：JP3468285

申请日：1985-02-25

Applicant: BAYER AG

Inventor： KIRUKORU JIRINIAN ,  GERUHARUTO DEIITAA BORUFU ,  URURITSUHI FUON GITSUITSUKI ,  RUDORUFU MERUTEN

IPC: C23C18/16 ,  C23C18/28 ,  C23C18/30 ,  H05K3/18 ,  H05K3/24 ,  H05K3/38

公开(公告)号：JPS6039166A

公开(公告)日：1985-02-28

申请号：JP13741884

申请日：1984-07-04

Applicant: BAYER AG

Inventor： KIRUKORU JIRINIAN ,  RUDORUFU MERUTEN ,  HENINGU GIIZETSUKE ,  GERUHARUTO DEIITAA BORUFU

IPC: C23C18/30 ,  C23C18/28 ,  H05K3/18

公开(公告)号：JPH04231476A

公开(公告)日：1992-08-20

申请号：JP13216491

申请日：1991-05-09

Applicant: BAYER AG

Inventor： GIYUNTAA RAIHERUTO ,  HENINGU GIIZETSUKE ,  GERUHARUTO DEIITAA BORUFU

IPC: C23C18/30 ,  C23C18/28 ,  H05K3/18 ,  H05K3/38

公开(公告)号：JPH0247547B2

公开(公告)日：1990-10-22

申请号：JP22809284

申请日：1984-10-31

Applicant: BAYER AG

Inventor： KIRUKORU JIRINIAN ,  GERUHARUTO DEIITAA BORUFU ,  RUDORUFU MERUTEN ,  URURITSUHI FUON GIJITSUKI

IPC: C08J7/12 ,  C23C18/22 ,  C23C18/28 ,  C23C18/30 ,  H05K3/18 ,  H05K3/38

公开(公告)号：JPS6345379A

公开(公告)日：1988-02-26

申请号：JP18564487

申请日：1987-07-27

Applicant: BAYER AG

Inventor： HENINGU GIIZETSUKE ,  GERUHARUTO DEIITAA BORUFU ,  YOAHIMU PUROPUSUTO ,  KURAUSU SHIYUSUTAA

IPC: C23C18/20 ,  C23C18/28 ,  H05K3/18 ,  H05K3/38