公开(公告)号：JPH0416548B2

公开(公告)日：1992-03-24

申请号：JP13741884

申请日：1984-07-04

Applicant: BAYER AG

Inventor： KIRUKORU JIRINIAN ,  RUDORUFU MERUTEN ,  HENINGU GIIZETSUKE ,  GERUHARUTO DEIITAA BORUFU

IPC: C23C18/30 ,  C23C18/28 ,  H05K3/18

公开(公告)号：JPH021913B2

公开(公告)日：1990-01-16

申请号：JP19834687

申请日：1987-08-10

Applicant: BAYER AG

Inventor： HENINGU GIIZETSUKE ,  GERUHARUTO DEIITAA BORUFU ,  HANSU PEETAA MYURAA ,  URURITSUHI FUON GITSUITSUKI ,  MARUTEIN BIINKENHEEBAA

IPC: C08G18/80 ,  C23C18/28 ,  C23C18/30 ,  H05K3/18 ,  H05K3/38

公开(公告)号：JPS6191996A

公开(公告)日：1986-05-10

申请号：JP22047785

申请日：1985-10-04

Applicant: Bayer Ag

Inventor： KIRUKORU JIRINIAN ,  GERUHARUTO DEIITAA BORUFU ,  URURITSUHI FUON GITSUITSUKI ,  RUDORUFU MERUTEN

IPC: C23C18/28 ,  C23C18/30 ,  H05K3/18

CPC classification number: H05K3/181 ,  C23C18/28 ,  Y10T428/31663 ,  Y10T428/31699

公开(公告)号：JPS6039165A

公开(公告)日：1985-02-28

申请号：JP14774884

申请日：1984-07-18

Applicant: BAYER AG

Inventor： URURITSUHI FUON GIJITSUKI ,  GERUHARUTO DEIITAA BORUFU ,  KIRUKORU JIRINIAN

IPC: C23C18/16 ,  C23C18/30 ,  H05K3/18

公开(公告)号：JPS5454191A

公开(公告)日：1979-04-28

申请号：JP11242178

申请日：1978-09-14

Applicant: BAYER AG

Inventor： KURAUSU ERUFUAATO ,  HANSU YURUGEN ROOZENKURANTSU ,  GERUHARUTO DEIITAA BORUFU ,  FURANSHISU BENTSU

IPC: C08F220/00 ,  B01D71/40 ,  B01D71/42 ,  B01D71/44 ,  C08F220/42 ,  C08F220/44

公开(公告)号：JP2588600B2

公开(公告)日：1997-03-05

申请号：JP31871588

申请日：1988-12-19

Applicant: BAYER AG

Inventor： HENINGU GIIZETSUKE ,  GERUHARUTO DEIITAA BORUFU ,  BIRUFURIITO TSUETSUHYAA

IPC: C08J7/12 ,  C08L79/08 ,  C23C18/30 ,  C23C18/40 ,  H05K1/03 ,  H05K3/18 ,  H05K3/38

公开(公告)号：JPH04365872A

公开(公告)日：1992-12-17

申请号：JP32237691

申请日：1991-11-12

Applicant: BAYER AG

Inventor： GERUHARUTO DEIITAA BORUFU ,  KIRUKAA SHIRINYAN ,  BORUFUGANGU HENINGU ,  RUDORUFU MERUTEN ,  URURITSUHI FUON GITSUIKII ,  BURUUSU BENDA

IPC: C08J7/04 ,  C09D5/38 ,  C09D175/00 ,  C09D175/04 ,  C23C18/18 ,  C23C18/28 ,  G12B17/02 ,  H05K9/00

公开(公告)号：JPH0247548B2

公开(公告)日：1990-10-22

申请号：JP22809384

申请日：1984-10-31

Applicant: BAYER AG

Inventor： KIRUKORU JIRINIAN ,  GERUHARUTO DEIITAA BORUFU ,  RUDORUFU MERUTEN ,  URURITSUHI FUON GIJITSUKI

IPC: C23C18/30 ,  C08J7/12 ,  C23C18/22 ,  C23C18/28 ,  H05K1/03 ,  H05K3/18 ,  H05K3/38

公开(公告)号：JPH01225390A

公开(公告)日：1989-09-08

申请号：JP142189

申请日：1989-01-09

Applicant: BAYER AG

Inventor： GERUHARUTO DEIITAA BORUFU ,  KIRUKORU JIRINIAN ,  URURITSUHI FUON GITSUITSUKI ,  RUDORUFU MERUTEN ,  FURIIDORITSUHI RANGAA

IPC: H05K3/24 ,  C23C2/02 ,  H05K3/10 ,  H05K3/18 ,  H05K3/38 ,  H05K3/42

Abstract: PURPOSE: To strengthen bonding strength of Cu track by removing a coating after opening a hole on two-sides Cu coated substrate, submerging it in an active bath for activation, further, after sensitizing, forming Ni, Co, Mn, Ni-Fe, or Ni-Co layer of 0.05-2.0μm, and then forming a conductive pattern on a Cu layer on it. CONSTITUTION: A copper-coated epoxy resin plate is etched for removing a Cu coating, then it is activated in a solution of 4-cyclohexanone-1.2-anhydrous dicarboxylic acid-palladium chloride, CH2 Cl2 , tetrabutyltitasnate, and then dimethylamineborane-sensitized for nickel-plating. A copper layer of 2μm thickness is stuck on a nickel layer of about 0.2μm in a chemical copper bath, and then annealed at 150 deg.C. Thereby, a conductive metal coating of good adhesive property is obtained, and on it, a conductive pattern is formed by semi-addition- difference etching.

公开(公告)号：JPS61219195A

公开(公告)日：1986-09-29

申请号：JP5842586

申请日：1986-03-18

Applicant: BAYER AG

Inventor： KIRUKORU JIRINIAN ,  GERUHARUTO DEIITAA BORUFU ,  URURITSUHI FUON GITSUITSUKI ,  RUDORUFU MERUTEN

IPC: H05K1/00 ,  H05K3/10 ,  H05K3/18 ,  H05K3/38 ,  H05K3/42