公开(公告)号：DE10143173A1

公开(公告)日：2002-06-06

申请号：DE10143173

申请日：2001-09-04

Applicant: CASCADE MICROTECH INC

Inventor： HAYDEN LEONARD ,  MARTIN JOHN ,  ANDREWS MIKE

IPC: G01R31/26 ,  G01R1/06 ,  G01R1/073 ,  H01L21/66 ,  G01R31/28

Abstract: A wafer probe (10) has an integrated contact finger array (12) connected through an impedance network to the connector pins (22).

公开(公告)号：EP1627235A4

公开(公告)日：2010-08-18

申请号：EP04785615

申请日：2004-04-26

Applicant: CASCADE MICROTECH INC

Inventor： GLEASON K REED ,  LESHER TIM ,  ANDREWS MIKE ,  MARTIN JOHN

IPC: G01R1/06 ,  G01R1/067 ,  G01R1/073

CPC classification number: G01R1/07342 ,  G01R1/06738 ,  G01R1/06772