Abstract:
PROBLEM TO BE SOLVED: To surely attain sufficient scrubbing pressure and reliable tilting and returning effect of each contact in a membrane probing assembly. SOLUTION: The membrane probing assembly 42 includes a membrane assembly 72 having a central region 80 interconnected to a support 54 by an elastomeric layer 98. Flexible traces form data/signal lines 76 to contacts 88 on the central region 80. Each contact 88 comprises a rigid beam 90 and a bump 92 located in off-centered location on the beam 90, which bump 92 includes a contacting portion 93. After initial touchdown of these contacting portions 93, further overtravel of pads 100 causes each beam 90 to independently tilt locally so that different portions of each beam 90 move different distances relative to the support 54 thus driving each contact into lateral scrubbing movement across the pads 100. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
A probe measurement system for measuring the electrical characteristics of integrated circuits at high frequencies include a coaxial cable (40) for supporting and electrically connected to a microstrip probe having a dielectric substrate (88), an elongated conductor (92), a conductive member (90) electrically connected to a ground signal support by a second side of the substrate (88) and wherein the conductive member is under a majority of the length of an elongate conductor located on a first side of the substrate, a conductive path (94) between the first and second side of the substrate (88), and a contact electrically connected to the conductive path for making contact with a device under test.
Abstract:
A membrane probing assembly includes a support element having an incompressible forward support tiltably coupled to a rearward base and a membrane assembly, formed of polyimide layers, with its central region interconnected to the support by an elastomeric layer. Flexible traces form data/signal lines to contacts on the central region. Each contact comprises a rigid beam and a bump located in off-centered location on the beam, which bump includes a contacting portion. After initial touchdown of these contacting portions, further over-travel of the pads causes each beam to independently tilt locally so that different portions of each beam move different distances relative to the support thus driving each contact into lateral scrubbing movement across the pad thereby clearing away oxide buildup. The elastomeric member backed by the incompressible support ensures sufficient scrub pressure and reliable tilt recovery of each contact without mechanical straining of the beam. In an alternative embodiment, the contacts comprise conductive beams each supported on a loose U-shaped flap formed in the membrane assembly where each flap and beam is tiltably supported in inclined position by an elastomeric hub interposed between the flap and support.
Abstract:
An interconnect assembly for evaluating a probe measurement network includes a base, respective inner and outer probing areas in mutually coplanar relationship on the upper face of the base, a reference junction, and a high-frequency transmission structure connecting the probing areas and the reference junction so that high-frequency signals can be uniformly transferred therebetween. A preferred method for evaluating the signal channels of the network includes connecting a reference unit to the reference junction and successively positioning each device-probing end that corresponds to a signal channel of interest on the inner probing area.
Abstract:
A membrane probing assembly includes a support element having an incompressible forward support tiltably coupled to a rearward base and a membrane assembly, formed of polyimide layers, with its central region interconnected to the support by an elastomeric layer. Flexible traces form data/signal lines to contacts on the central region. Each contact comprises a rigid beam and a bump located in off-centered location on the beam, which bump includes a contacting portion. After initial touchdown of these contacting portions, further over-travel of the pads causes each beam to independently tilt locally so that different portions of each beam move different distances relative to the support thus driving each contact into lateral scrubbing movement across the pad thereby clearing away oxide buildup. The elastomeric member backed by the incompressible support ensures sufficient scrub pressure and reliable tilt recovery of each contact without mechanical straining of the beam. In an alternative embodiment, the contacts comprise conductive beams each supported on a loose U-shaped flap formed in the membrane assembly where each flap and beam is tiltably supported in inclined position by an elastomeric hub interposed between the flap and support.
Abstract:
Resilient electrical interposers that may be utilized to form a plurality of electrical connections between a first device and a second device, as well as systems that may utilize the resilient electrical interposers and methods of use and/or fabrication thereof. The resilient electrical interposers may include a resilient dielectric body with a plurality of electrical conduits contained therein. The plurality of electrical conduits may be configured to provide a plurality of electrical connections between a first surface of the electrical interposer and/or the resilient dielectric body and a second, opposed, surface of the electrical interposer and/or the resilient dielectric body. The systems and methods disclosed herein may provide for improved vertical compliance, improved contact force control, and/or improved dimensional stability of the resilient electrical interposers.
Abstract:
High frequency interconnect structures, electronic assemblies that utilize high frequency interconnect structures, and methods of operating the same. The high frequency interconnect structures include a plurality of dielectric waveguides and are configured to communicatively connect a plurality of transmitters with a plurality of receivers and to convey a plurality of signals therebetween. The plurality of signals may include a plurality of electromagnetic waves and may have a frequency of at least 200 GHz. The high frequency interconnect structures further may be configured to decrease a potential for crosstalk between a first signal that is conveyed by a first dielectric waveguide of the plurality of dielectric waveguides and a second signal that is conveyed by a second dielectric waveguide of the plurality of dielectric waveguides, such as through control of a passband of the first dielectric waveguide relative to the second dielectric waveguide and/or the use of a crosstalk mitigation structure.
Abstract:
A probe suitable for probing a semiconductor wafer that includes an active circuit (16). The probe may include a flexible interconnection (14) between the active circuit (16) and a support structure (10). The probe may impose a relatively low capacitance on the device under test.
Abstract:
The probe has active circuits (410, 412) with resistive units, each of which is supported by a substrate. Elongate probing units (414, 416) are interconnected to the respective active circuits. The active circuits are interconnected to a substrate by a respective pair of flexible interconnects (432, 434). The active circuits are also interconnected to a respective set of signal paths (420, 422).