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    METHOD FOR BONDING SEMICONDUCTOR PELLET
    11.
    发明专利
    METHOD FOR BONDING SEMICONDUCTOR PELLET 失效

    公开(公告)号：JPS61207025A

    公开(公告)日：1986-09-13

    申请号：JP4851585

    申请日：1985-03-12

    Applicant: CASIO COMPUTER CO LTD

    Inventor： KASHIO YUKIO ,  MASAKI HISASHI ,  SUGIYAMA KAZUHIRO ,  DEGUCHI TOSHIYOSHI ,  TAMAKI TOSHIHARU ,  YARITA YOSHIO ,  ATSUMI YOSHINORI

    IPC: H01L21/60 ,  H05K1/09 ,  H05K3/04 ,  H05K3/24

    Abstract: PURPOSE:To prevent the oxidation of pads by a method wherein, after carbon ink is coated at least on one surface of the external circuit connecting pad of a semiconductor pellet and a pellet connecting terminal, each pad is adhered to the surface of a substrate in such a manner that each pad is opposed to each terminal located on the surface of a wiring substrate. CONSTITUTION:Carbon ink 20 is coated on the upper surface of a flat plate 40 in uniform thickness, and the carbon ink 20 is adhered to each protruded part 41a by pressing the protrusion arranged member 41 whereon a number of protruded parts 41a which are a little wider than the pads 11 of a semiconductor pellet 10 are projectingly provided leaving a space corresponding to each pad 11 of an LSI pellet 10. Then, the member 41 is pulled up, each protruded part 41a is opposed to each pad 11 of the pellet 10 and pressed against the pellet 10, and after the carbon ink 20 which is adhered to each protruded part 51a is coated on the surface of each pad 11, the letterpress member 41 is pulled up, and the carbon ink 20 coated on the surface of each pad 11 is dried up. As a result, the oxidation of the pad can be prevented.

    MANUFACTURE OF DOUBLE-SIDED WIRING BOARD
    14.
    发明专利
    MANUFACTURE OF DOUBLE-SIDED WIRING BOARD 失效

    公开(公告)号：JPH0465187A

    公开(公告)日：1992-03-02

    申请号：JP17621390

    申请日：1990-07-05

    Applicant: CASIO COMPUTER CO LTD

    Inventor： YARITA YOSHIO

    IPC: H05K3/42 ,  H05K3/00

    Abstract: PURPOSE:To easily form a metallic film at the inwall, too, of a pinhole, to say nothing of the obverse and the reverse of an insulating film, and connect the wiring patterns at the obverse and the reverse surely by forming metallic films by deposition at the obverse and the reverse of the insulating film where pinholes are made. CONSTITUTION:The insulating film 1 on a reel 2 is drawn out intermittently, and there a pinhole 5 is made by the needle 4 of an upper perforator 3, and then it is wound up on a reel 6. A metallic needle 4 is provided at the bottom of the perforator 3, and by this needle 4 piercing through the film 1, the specified point of the film 1 is bored through from the top to the bottom. Next, the film 1 is arranged in a sputtering device 7, and the ions of the target 13 being sputtered by the glow discharge adhere to the insulating film 1 inside the gas discharge chamber 8 of the sputtering device 7, and metallic films 14 are formed at the top and bottom of the film 1 and the inwall of the pinhole 5.

    MANUFACTURE OF FILM CONNECTOR
    15.
    发明专利
    MANUFACTURE OF FILM CONNECTOR 失效

    公开(公告)号：JPH02220380A

    公开(公告)日：1990-09-03

    申请号：JP3830889

    申请日：1989-02-20

    Applicant: CASIO COMPUTER CO LTD

    Inventor： YARITA YOSHIO ,  KAWAMURA YOSHIHIRO

    IPC: H01R43/00 ,  H05K3/02

    Abstract: PURPOSE:To make the thickness of a wiring pattern thin and improve the bend property, fold resistance and bend resistance by forming a metal film by deposition or sputtering on one surface of an insulation film. CONSTITUTION:A metal film 5 is formed on an insulation film 2 by deposition or sputtering, and a plating layer 6 is formed on its surface. A resist layer 7 is pattern formed on the surface of the layer 6. The layer 6 and film 5 are etched using the layer 7 for a mask, and the resist 7 is removed to form a double structure wiring pattern 3 consisting of the plating layer 6 and metal film 5. A large number of such wiring patterns 3 are formed parallel along the length of the film 2, with both ends of each reaching both ends of the film 2. Anisotropic conductive adhesive agent 4, 4 is printed crossing the pattern 3 at both ends of the film 2 to obtain a film connector 1.

    MANUFACTURE OF DOUBLE-SIDED WIRING BOARD
    16.
    发明专利
    MANUFACTURE OF DOUBLE-SIDED WIRING BOARD 失效

    公开(公告)号：JPH02201994A

    公开(公告)日：1990-08-10

    申请号：JP2062389

    申请日：1989-01-30

    Applicant: CASIO COMPUTER CO LTD

    Inventor： YARITA YOSHIO ,  KAWAMURA YOSHIHIRO

    IPC: H05K3/42 ,  H05K3/00

    Abstract: PURPOSE:To prevent relief and the like of a mask and a screen and so on in an after-process and perform the afterprocess excellently by making each burr developed in the case of forming a pinhole smooth or pushing its burr into the pinhole. CONSTITUTION:A pinhole 3 is formed in an insulating film 1 by penetration from an upper face to a lower face and a metal layer 6 is formed by laminating a metal thin film 4 and a plating layer 5 in serial order to both the surface and rear of the insulating film 1 and to the inner wall of the pinhole. After that, the burr 3a which develops at the extraction side of the pinhole is buried in the pinhole by a pair of upper and lower rollers 7 and 7 and it is so smooth that the lower face of the insulating film 1 becomes flat. When pattern formation is performed in the afterprocess, no relief of a screen and a mask due to the burrs 3 develops and close contact between the surface of the metal layer 6 and the above screen and mask takes place satisfactorily. An excellent after-process is performed without any hindrance in the after-process.

    PRINTING HEAD
    17.
    发明专利
    PRINTING HEAD 失效

    公开(公告)号：JPH021335A

    公开(公告)日：1990-01-05

    申请号：JP14183788

    申请日：1988-06-10

    Applicant: CASIO COMPUTER CO LTD

    Inventor： YARITA YOSHIO

    IPC: B41J2/335 ,  B41J2/345

    Abstract: PURPOSE:To reduce cost by folding back the first electrode body with the first electrode formed with the surface where the electrode is formed facing inside on one surface of flexible sheet and then the second electrode body with the second electrode by allowing a thermal resistance layer to exist in the fold-back section. CONSTITUTION:The first electrode body 4 with a number of recording electrodes 8 arranged is formed on one surface of flexible heat-resistant film 7. A thermal resistance layer 5 is formed on the recording electrodes 8. After this, the flexible sheet is folded back in a V shape with the recording electrode side facing inside. The second electrode body 6 consists of an insulation layer 10 formed on the surface of a return electrode 9 of thin metal plate, and the lower end of the insulation layer 10 is partly cut off to allow the return electrode 9 to be exposed. The return electrode 9 which is arranged and exposed in the fold-back section of the first electrode body 4 is allowed to come in contact with the thermal resistance layer 5 and communicates with the recording electrodes 8. Subsequently, the structure is simple and a printing head is manufactured at low cost.

    METHOD FOR JOINTING SEMICONDUCTOR PELLET AND SUBSTRATE
    19.
    发明专利
    METHOD FOR JOINTING SEMICONDUCTOR PELLET AND SUBSTRATE 失效

    公开(公告)号：JPS61194731A

    公开(公告)日：1986-08-29

    申请号：JP3395085

    申请日：1985-02-22

    Applicant: CASIO COMPUTER CO LTD

    Inventor： DEGUCHI TOSHIYOSHI ,  SUGIYAMA KAZUHIRO ,  MASAKI HISASHI ,  YARITA YOSHIO ,  ATSUMI YOSHINORI ,  TAMAKI TOSHIHARU

    IPC: H05K3/32 ,  H01L21/52 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60

    Abstract: PURPOSE:To enable a semiconductor pellet and a substrate to be positively conductively connected without causing a poorly conductive portion, by directly contacting the external circuit connection pads of the semiconductor pellet with the terminal portions of the substrate thereby to conductively connect the pads and the terminal portions, and simultaneously bonding the pellet and the substrate. CONSTITUTION:In a substrate 4, respective wirings 5, 5... and terminal portions 5a, 5a... respectively corresponding to the respective pads 2, 2... of a semiconductor pellet 1 are formed on the surface thereof, and padding portions 6, 6... slightly thicker than the protective film 3 of the main surface of the semiconductor pellet 1 are formed on the respective terminal portions 5a, 5a.... When joining the semiconductor pellet 1 to the substrate 4, first in the surface of the substrate 4, an insulating adhesive 7 is applied in a substantially uniform thickness from above the respective terminal portions 5a, 5a... over the entire joint area for the semiconductor pellet including the respective terminal portions 5a, 5a.... Thereafter, the semiconductor pellet 1 is placed on the insulating adhesive 7 so that the respective pads 2, 2... of the semiconductor pellet 1 are made to correspond to the respective terminal portions 5a, 5a.... With this state, the semiconductor pellet 1 is pressed from thereabove by a pressing jig 8 so as to be bonded.

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