公开(公告)号：JPH04313544A

公开(公告)日：1992-11-05

申请号：JP10511691

申请日：1991-04-11

Applicant: CASIO COMPUTER CO LTD

Inventor： YARITA YOSHIO

IPC: B65G13/00 ,  B65H5/06 ,  B65H5/36 ,  H05K13/02

Abstract: PURPOSE:To cause constantly reliable entrance of a flexible base sheet to a gap between a pair of upper and lower conveyance rollers by arranging a board guide belt to the shaft of a conveyance roller. CONSTITUTION:An upper board guide belt 21 is run around shafts 12 of adjoining upper conveyance rollers 11 and a lower board guide belt 21 is run around shafts 12 of adjoining lower conveyance rollers 11. The upper and lower board guide belts 21 prevents dislocation of easily flexible board 2 from a board conveyance surface, and the flexible board 2 is caused to constantly reliably enter a gap between a pair of the upper and lower conveyance rollers 11.

公开(公告)号：JPH03258558A

公开(公告)日：1991-11-18

申请号：JP5641890

申请日：1990-03-09

Applicant: CASIO COMPUTER CO LTD

Inventor： YARITA YOSHIO ,  MUTO JIRO

IPC: B41J2/335

Abstract: PURPOSE:To permit a clear printing at a uniform printing density by a method wherein a heat resisting layer is given such a wavy form that it is high and low alternately according to the corresponding layer thickness of a common electrode and a signal electrode, respectively. CONSTITUTION:Since heat resisting layers 13 located in the corresponding positions of common electrodes 12 are made high and since said layers 13 located in the corresponding positions of signal electrodes 11 are made lower, at the time of heat-sensitive printing with a heat-sensitive paper 21 placed on the heat resisting layer 13, the heat- sensitive paper 21 comes in contact with only a high part 19 of each of said layers 13 located in the corresponding positions of the common electrodes 12, being out of contact with the other parts thereof. Because of this, the places at which said layers 13 make contact with the heat-sensitive paper 21 are reduced in number and the adhesiveness of the paper 21 thereto is improved. Also, since a space between their contacting places become large, a space between dots can be made narrower to some extent.m Since, in this way, the heat-sensitive paper 21 can be closely attached to the heat resisting layers 13, even if the dot space is narrow, an uneven printing is avoided at the time of printing, the printing density is uniform and a clear printing can be effected.

公开(公告)号：JPH0563027A

公开(公告)日：1993-03-12

申请号：JP2089792

申请日：1992-02-06

Applicant: CASIO COMPUTER CO LTD

Inventor： SUGIYAMA KAZUHIRO ,  DEGUCHI TOSHIYOSHI ,  MASAKI HISASHI ,  YARITA YOSHIO ,  ATSUMI YOSHINORI ,  TAMAKI TOSHIHARU

IPC: H01L21/60

Abstract: PURPOSE:To provide a junction method between a semiconductor device and a substrate which is capable of reducing production cost by a further extent compared with an anisotropic conductive bonding agent-based method and, what is more, applicable to substrates having lower heat resistant properties. CONSTITUTION:An ultraviolet setting type insulating bonding agent 6 is applied to one side of a semiconductor device 1 at a thick coat in such a fashion that bumps 2b may be buried therein while each connection terminal 5a of a substrate 4 is formed in smaller width compared with the bumps 2b. Each bump 2b of the semiconductor device 1 is aligned with each mating connection terminal 5a of the substrate 4 so that the semiconductor device 1 and the substrate 4 are relatively depressed. Under this condition, ultraviolet rays are emitted thereto so that the insulating bonding agent 6 may be set.

公开(公告)号：JPH026153A

公开(公告)日：1990-01-10

申请号：JP15496888

申请日：1988-06-24

Applicant: CASIO COMPUTER CO LTD

Inventor： YARITA YOSHIO

IPC: B41J2/335

Abstract: PURPOSE:To simplify the structure while improving the productivity by oppositely folding back first and second electrodes in a first flexible sheet, to which the first electrode is formed, and a second flexible sheet, to which the second electrode is shaped, and interposing a heating resistance layer between the first and second electrodes in the folding-back section. CONSTITUTION:Recording signal voltage is applied to recording electrodes 8... and a return electrode 11 while a printing head is moved relatively in the direction of the arrow X to a thermal transfer sheet 3. Consequently, the heating section 6a of a heating resistance layer 6, with which the lower end of the return electrode 11 is brought into contact, generates heat by Joule heat. The heat is transmitted over the thermal transfer sheet 3 through the return electrode 11 and a second flexible sheet 10, and transmitted over a heat fusing ink layer 14. The heat fusing ink layer 14 in a section corresponding to the heating section 6a is melted, and the melting section 14a is transferred to recording paper 2 under the melting section. Accordingly, the heat fusing ink layer 14 is melted to the recording paper 2 in response to recording signal voltage in the printing head 1, thus positively transferring the melting section 14a excellently.

公开(公告)号：JPS61194732A

公开(公告)日：1986-08-29

申请号：JP3394985

申请日：1985-02-22

Applicant: CASIO COMPUTER CO LTD

Inventor： SUGIYAMA KAZUHIRO ,  DEGUCHI TOSHIYOSHI ,  MASAKI HISASHI ,  YARITA YOSHIO ,  ATSUMI YOSHINORI ,  TAMAKI TOSHIHARU

IPC: H05K3/32 ,  H01L21/52 ,  H01L21/58 ,  H01L21/60

Abstract: PURPOSE:To secure conductive connection of a semiconductor pellet and a substrate without causing a poorly conductive portion as well as to reduce the cost by bonding the semiconductor pellet and the substrate by means of an insulating adhesive which lies in the joint area including the portion where the terminal portions of the two are opposed to each other. CONSTITUTION:In the surface of a substrate 1 on which semiconductor pellet connection terminal portions 5a, 5a... are arranged and formed, an insulating adhesive 6 is applied in a substantially uniform thickness from above the respective terminal portions 5a, 5a... over the entire joint area for the semiconductor pellet including the respective terminal portions 5a, 5a.... Thereafter, the semiconductor pellet 1 is placed on the insulating adhesive 6 so that the respective terminal portion 2, 2... of the semiconductor pellet 1 are made to correspond to the respective terminal portions 5a, 5a... of the substrate 4 side. With this state, by pressing the semiconductor pellet 1 from thereabove by means of a pressing jig 7, the semiconductor pellet 1 and the substrate 4 are relatively pressed, and simultaneously therewith said insulating adhesive 6 is made to harden so that the semiconductor pellet 1 and the substrate 4 are bonded by means of the insulating adhesive 6. Then, the semiconductor pellet 1 is placed on the insulating adhesive 6, and the semiconductor pellet 1 and the substrate 4 are relatively pressed.

公开(公告)号：JPH0483393A

公开(公告)日：1992-03-17

申请号：JP19631790

申请日：1990-07-26

Applicant: CASIO COMPUTER CO LTD

Inventor： YARITA YOSHIO

IPC: H05K3/40 ,  H05K3/42

Abstract: PURPOSE:To easily form wiring patterns to be conducted between front and rear surfaces by forming a stylus hole at an insulating film provided with metal foils on both front and rear surfaces, then forming metal layers on the foils and the inner wall of the hole, and burying burr generated at the exist side of the stylus in the hole into the hole to be smoothed. CONSTITUTION:When a stylus 5 is pierced to form a stylus hole 6, burr 6a is formed to protrude downward at the periphery of the hole 6 at the exit side of the stylus 5. An insulating film 2 wound on a third reel 9 is fed between a pair of upper and lower rolling rollers 14 and 14, rolled, and wound on a fourth reel 15. In this case, burr 6a generated at the lower surface side of the hole 6 is rolled, the burr 6a and a plating layer 13 are intruded into the hole 6 to be plastically deformed. Thus, the hole 6 is buried with the burr 6a and the layer 13, and the peripheral edge of the lower surface side of the hole 6 is smoothed, and a metal foil 1 and the layer 13 on the upper and lower surfaces of the film 2 are made flat.

公开(公告)号：JPH03244558A

公开(公告)日：1991-10-31

申请号：JP3983390

申请日：1990-02-22

Applicant: CASIO COMPUTER CO LTD

Inventor： YARITA YOSHIO ,  MUTO JIRO ,  KAWAMURA YOSHIHIRO

IPC: B41J2/335

Abstract: PURPOSE:To form heating parts of a heating resistor layer into a uniform size even if the heating resistor layer is varied in width by a method wherein the width of the heating resistor layer is made larger than the length at a part where the top end parts of signal electrodes and a common electrode are staggered with each other so that the respective top end parts are covered with the heating resistor layer. CONSTITUTION:A width W of a heating resistor layer 12 is made larger than a length L of a part where the top end parts 18a, 19a of signal electrodes 18 and a common electrode 19 are staggered with each other so that the respective top end parts 18a, 19a are covered with the heating resistor layer 12. Therefore, the size of heating parts 21 of the heating resistor layer 12 which generate heat at the time of printing depends on the opposed part between the top end parts 18a, 19a of the signal electrodes 18 and the common electrode 19. In addition, since the signal electrodes 18 and the common electrode 19 are formed patternwise by a photolithographic technique, the top end parts 18a, 19a are trued up at the top edges thereof, and the staggered length L is set uniformly and accurately. In this manner, even with the variation of the width W of the heating resistor layer 12, the heating parts 21 of the heating resistor layer 12 can be formed into a fixed size.

公开(公告)号：JPH02301187A

公开(公告)日：1990-12-13

申请号：JP12039689

申请日：1989-05-16

Applicant: CASIO COMPUTER CO LTD ,  TOYO METALIZING

Inventor： KAWAMURA YOSHIHIRO ,  YARITA YOSHIO ,  MINAMI TOMOYUKI

IPC: H05K3/42

Abstract: PURPOSE:To realize simple manufacturing process and improved productivity and to secure conductivity between the wiring patterns of both sides by forming a through hole in an insulating film, and then etching the wiring patterns in two-layer structure consisting of a plating layer and a metallic film to make a them conductive at the place of a through hole. CONSTITUTION:A through hole 2 running from the obverse to the reverse is formed on an insulating film 1 by machining such as drilling, press, etc. Next, metallic films 3 are formed on the obverse and reverse of the insulating film 1 and at the inner face of the through hole 2 by deposition or sputtering. Next, a plating layer 4 is formed at the entire surface of a metallic film 3 by electroless plating. On the plated layers 4 at the abverse and reverse, resists 5 are formed at the wiring pattern formation areas, corresponding to each other at the place of the through hole 2, by screen printing, photo patterning, or the like. After that, with the resist 5 as a mask, the plating layer 4 and the metallic film 3 are etched to remove unnecessary parts. Lastly, the resist 5 is removed.

公开(公告)号：JPH02228092A

公开(公告)日：1990-09-11

申请号：JP4877789

申请日：1989-03-01

Applicant: CASIO COMPUTER CO LTD

Inventor： YARITA YOSHIO ,  KAWAMURA YOSHIHIRO

IPC: H05K3/06 ,  H05K3/18 ,  H05K3/24

Abstract: PURPOSE:To simplify a plating process and achieve economical manufacture with improved productivity by forming a metal film on the front, rear, and side surfaces of an insulating substrate through deposition or sputtering. CONSTITUTION:An insulating substrate 1 is prepared, and a metal film 2 is formed all over the surfaces, i.e., on the upper, lower, and side surfaces, of this insulating substrate 1 by deposition or sputtering. Therefore, the metal film 2 pattern can be formed directly on the insulating substrate 1. In addition, this metal film 2 constitutes ground plating for a plating layer 4, so that the plating layer 4 can simply and easily be formed on the metal film 2. Thus, the plating process is simplified, and economical manufacturing is achieved with improved productivity.

公开(公告)号：JPH022025A

公开(公告)日：1990-01-08

申请号：JP14346988

申请日：1988-06-13

Applicant: CASIO COMPUTER CO LTD

Inventor： YARITA YOSHIO

IPC: B41J2/335

Abstract: PURPOSE:To obtain a printing head having a simple structure excellent in productivity and capable of being prepared inexpensively by fixing and forming a return electrode to the forming region of the heat generating resistor layers provided on recording electrodes over the total width thereof so as to cross the heat generating resistor layers. CONSTITUTION:When a printing head 1 is prepared, a metal film 8 is formed to the entire surface region of a board 2 and heat generating resistor layers 4 are fixed to the surface of said film 8 to be cured. By this method, a large number of the lead like heat generating resistor layers 4... are formed so as to be arranged in parallel at a predetermined interval. Next, when the metal film 8 is subjected to etching treatment, the unnecessary parts of the metal layer 8 are removed to form recording electrodes 3... under the heat generating resistor layers 4... and an earth electrode 7 composed of the metal film 8 is simultaneously formed to the board 2 on the left end side thereof. Next, insulating layers 5... are provided between the recording electrodes 3... so as to be made flush with the heat generating resistors 4... and a strip like return electrode 6 is provided to the center of the resulting flat surface over the whole of the forming region of the heat generating resistor layers 4... so as to cross the heat generating resistor layers 4 and one end thereof is connected to the earth electrode 7 to be brought to a continuity state.