公开(公告)号：US20050230486A1

公开(公告)日：2005-10-20

申请号：US11126314

申请日：2005-05-11

Applicant: Christophe Halope

Inventor： Christophe Halope

IPC: B42D15/10 ,  G06K19/07 ,  G06K19/077 ,  H05K1/03 ,  H05K1/16 ,  H05K1/18 ,  H05K3/20 ,  G06K19/06 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H05K3/207 ,  G06K19/07749 ,  H05K1/0313 ,  H05K1/165 ,  H05K1/185 ,  H05K1/187 ,  H05K2201/0129 ,  H05K2201/0284 ,  H05K2201/0376

Abstract: The invention thus concerns a method for manufacturing a radiofrequency identification device which includes the following steps: a manufacturing process for an antenna consisting in screen-printing turns of an electrically conductive polymer ink onto a transfer paper sheet, and then subjecting said support to heat treatment in order to bake and polymerize said conductive ink, connection of a chip 14, provided with contacts, to the antenna 12, lamination consisting in making the transfer paper sheet integral with a layer of plastic material 16 which constitutes the support for the antenna, by hot press molding, in such a way that the screen-printed antenna and the chip are both embedded within the layer of plastic material, and removal of the transfer paper sheet.

Abstract translation: 因此，本发明涉及一种制造射频识别装置的方法，其包括以下步骤：将导电聚合物油墨的丝网印刷匝组合到转印纸上的天线的制造过程，然后对所述载体进行热处理 为了烘烤和聚合所述导电油墨，将具有触点的芯片14与天线12的连接，包括将转印纸与构成天线支撑的塑料材料层16成一体的叠层，通过 热压成型，使得丝网印刷天线和芯片都嵌入在塑料材料层内，并且移除转印纸。

公开(公告)号：US06770509B2

公开(公告)日：2004-08-03

申请号：US10170445

申请日：2002-06-14

Applicant: Christophe Halope ,  Fabien Zupanek

Inventor： Christophe Halope ,  Fabien Zupanek

IPC: H01L2144

CPC classification number: H01Q23/00 ,  G06K19/07749 ,  G06K19/0775 ,  H01L21/563 ,  H01L23/49855 ,  H01L23/645 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L2223/6677 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/14 ,  H01Q1/2208 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A method for connecting a chip (10) to a contactless smart card antenna having deformable contacts (18), the antenna being printed using conductive ink on an antenna support (16) made of deformable material. This method includes the steps of positioning the chip (10) provided with contacts (12) made of a non-deformable material, on the antenna support so that the contacts (12) are facing the contacts (18) of the antenna, and exerting a force on the chip (10) so that the contacts (12) deform the antenna support (16) and the contacts (18) of the antenna as a result of the pressure, the support (16) and the contacts (18) maintaining their deformation after the pressure is released, thus enabling a significant contact surface to be obtained between the contacts (12) of the chip (10) and the contacts (18) of the antenna.

Abstract translation: 一种用于将芯片（10）连接到具有可变形触点（18）的非接触智能卡天线的方法，所述天线使用导电油墨在由可变形材料制成的天线支撑件（16）上印刷。 该方法包括以下步骤：将设置有由不可变形材料制成的触点（12）的芯片（10）定位在天线支架上，使得触点（12）面向天线的触点（18），并施加 所述芯片（10）上的力使得触点（12）由于压力而使天线支撑件（16）和天线的触点（18）变形，支撑件（16）和触头（18）保持 其压力释放后的变形，从而能够在芯片（10）的触点（12）和天线的触点（18）之间获得显着的接触表面。

公开(公告)号：US5275870A

公开(公告)日：1994-01-04

申请号：US849383

申请日：1992-05-07

Applicant: Christophe Halope ,  Alain Barthez ,  Jean-Paul Menez

Inventor： Christophe Halope ,  Alain Barthez ,  Jean-Paul Menez

IPC: B41M5/52 ,  D21H17/00 ,  D21H21/44 ,  B32B3/00

CPC classification number: D21H21/44 ,  B41M3/10 ,  B41M5/508 ,  B42D25/333 ,  B42D25/351 ,  B42D25/369 ,  B42D25/373 ,  B42D25/382 ,  B42D25/387 ,  D21H17/00 ,  Y10T428/24835 ,  Y10T428/252 ,  Y10T428/256 ,  Y10T428/31855

Abstract: The invention concerns an imprintable, flexible, synthetic support bearing at least one authentication or security mark.This support comprises:a substrate of synthetic materialat least one mark on at least one face of the support and consisting of at least one layer of a composition altering the substrate opacity,at least one layer of an imprintable pigment composition deposited on the face bearing the mark and optionally also on the substrate face without the mark, the mark being barely or not at all visible in reflected light and perfectly visible in transmitted light.Application to the security of synthetic paper.

Abstract translation: PCT No.PCT / FR90 / 00808 Sec。 371日期：1992年5月7日 102（e）日期1992年5月7日PCT提交1990年11月13日PCT公布。 公开号WO91 / 07285 日期为1991年5月30日。本发明涉及一种可压印的，柔性的，合成的支撑体，其具有至少一个认证或安全标记。 该支撑体包括：合成材料的基材，在支撑体的至少一个表面上具有至少一个标记，并且由至少一层改变基底不透明度的组合物组成，沉积在表面轴承上的至少一层可压印颜料组合物 标记和可选地也在没有标记的基板面上，标记在反射光下几乎完全不可见，并且在透射光中完全可见。 适用于合成纸的安全性。

公开(公告)号：US08172978B2

公开(公告)日：2012-05-08

申请号：US12250090

申请日：2008-10-13

Applicant: Christophe Halope ,  Olivier Mazabaud

Inventor： Christophe Halope ,  Olivier Mazabaud

IPC: B29C65/52 ,  B32B37/02 ,  B32B37/06 ,  B32B37/14 ,  G06Q30/00 ,  G06K19/063 ,  B32B37/08 ,  B32B37/18 ,  G08B13/14 ,  B44C1/24

CPC classification number: G06K19/07749 ,  G06K19/0775 ,  H01L2224/48091 ,  H01L2224/48247 ,  Y10T156/1039 ,  Y10T428/24802 ,  Y10T428/28 ,  Y10T428/2804 ,  H01L2924/00014

Abstract: The invention concerns a method for manufacturing a radio frequency identification device (RFID), the device featuring an antenna and a chip (12) connected to the antenna, the method including the following steps: printing an antenna (12) having contacts (17 and 19) on a support (20) made of paper or synthetic paper, placing adhesive dielectric material between the contacts of the antenna, positioning an integrated circuit module (10) on the support, the module featuring groups of contacts (17, 18) and the chip (12) connected to groups of contacts inside an encapsulation (14) of the module, so that the groups of contacts of the module are opposite the contacts of the antenna, placing a thermoplastic layer (22) and a paper or synthetic paper layer (24) on the support, the two layers (22 and 24) being provided with a recess (21, 23) at the location of encapsulation (14) of the module (10), laminating together the three layers, the antenna support layer (20), the thermoplastic layer (22) and the paper or synthetic paper layer (24) in order to electrically connect said module to said antenna and agglomerate the layers (20, 22 and 24) together.

Abstract translation: 本发明涉及一种用于制造射频识别装置（RFID）的方法，该装置具有连接到天线的天线和芯片（12），该方法包括以下步骤：打印具有触点（17和17）的天线 在由纸或合成纸制成的支撑件（20）上，将粘合介电材料放置在天线的触点之间，将集成电路模块（10）定位在支撑件上，模块具有一组触点（17,18）和 所述芯片（12）连接到所述模块的封装（14）内的接触组，使得所述模块的触点组与所述天线的触点相对，放置热塑性层（22）和纸或合成纸 所述两层（22和24）在所述模块（10）的封装位置（14）处设置有凹部（21,23），将所述三层层叠在一起，所述天线支撑件 层（20），热塑性层（22） 以及纸或合成纸层（24），以将所述模块电连接到所述天线并将层（20,22和24）聚集在一起。

公开(公告)号：US08038831B2

公开(公告)日：2011-10-18

申请号：US12250404

申请日：2008-10-13

Applicant: Christophe Halope ,  Olivier Mazabaud

Inventor： Christophe Halope ,  Olivier Mazabaud

IPC: B29C65/54 ,  B32B37/02 ,  B32B37/12 ,  H01L21/02 ,  B29C65/02 ,  B32B37/10

CPC classification number: G06K19/07749 ,  G06K19/0775 ,  H01L2224/48091 ,  H01L2224/48247 ,  Y10T156/1039 ,  Y10T428/24802 ,  Y10T428/28 ,  Y10T428/2804 ,  H01L2924/00014

Abstract: A method for manufacturing an identity booklet cover provided with a radio frequency identification device having an antenna and a chip (12) connected to the antenna, the method including the following steps: producing an antenna (12) having contacts (13 and 14) on a support (10), creating a recess (20) between the contacts (13 and 14), placing adhesive dielectric material (25, 26) near the contacts of the antenna, positioning an integrated circuit module (19) on the support so that the groups of contacts of the module are opposite the contacts of the antenna and the encapsulation of the module is in the recess (20), placing on the face of the support featuring the antenna at least one layer of thermo-adhesive film (40, 50, 60), placing a cover layer (70) on the layer (or) layer(s) (40 or 50 and 60) of thermo-adhesive film, laminating all the layers.

Abstract translation: 一种用于制造具有天线的射频识别装置和连接到天线的芯片（12）的射频识别装置的身份小册子盖的方法，所述方法包括以下步骤：产生具有接触（13和14）的天线（12） 支撑件（10），在触头（13和14）之间形成凹部（20），将粘合介电材料（25,26）放置在天线的触点附近，将集成电路模块（19）定位在支撑件上，使得 模块的触点组与天线的触点相对，并且模块的封装在凹部（20）中，放置在具有天线的支撑体的表面上，至少一层热粘膜（40， 50,60），将覆盖层（70）放置在热粘合膜的层（或）层（40或50和60）上，层压所有层。

公开(公告)号：US07337975B2

公开(公告)日：2008-03-04

申请号：US10556486

申请日：2004-05-26

Applicant: Christophe Halope

Inventor： Christophe Halope

IPC: G06K19/06

CPC classification number: G06K19/07718 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07783 ,  H05K1/0393 ,  H05K3/12 ,  H05K3/1216 ,  H05K3/28 ,  H05K2203/1545

Abstract: A multi-step method for producing contactless tickets or cards, the tickets or cards including a chip (24) which is connected to an antenna (10) on a paper carrier. The method includes: printing the antennae in series on the paper carrier strip using a silkscreen ink; fixing a chip to each ticket by connecting bond pads of the chip to the antennas' bond pads (14, 16); and covering the paper strip, including the silkscreen-printed antenna and the corresponding chip, with an adhesive paper strip. After each step, the paper carrier strip is wound up before the next step is begun. Each of the silkscreen-printed antennae is coated with a protective layer (12) to prevent silkscreen ink from being transferred to the back of the paper carrier strip during the successive winding-up following each step.

Abstract translation: 用于生产非接触式票据或卡片的多步骤方法，票据或卡片包括连接到纸张载体上的天线（10）的芯片（24）。 该方法包括：使用丝网印刷将天线串联印刷在纸载带上; 通过将芯片的接合焊盘连接到天线的接合焊盘（14,16）来将芯片固定到每个票据上; 并用粘合纸条覆盖包括丝网印刷天线和相应的芯片的纸条。 在每一步之后，在下一步骤开始之前，将纸载带剥去。 丝网印刷天线中的每一个涂覆有保护层（12），以防止丝网印刷油墨在每个步骤之后的连续卷绕期间被转移到纸载带的背面。

公开(公告)号：US20060176181A1

公开(公告)日：2006-08-10

申请号：US11337534

申请日：2006-01-24

Applicant: Christophe Halope

Inventor： Christophe Halope

IPC: G08B13/14 ,  G06K19/06 ,  H01L23/02 ,  H01L23/28

CPC classification number: G06K19/02 ,  B42D25/00 ,  B42D25/22 ,  B42D25/24 ,  B42D2033/46 ,  G06K19/025 ,  G06K19/07749 ,  Y10T428/24719 ,  Y10T428/28 ,  Y10T428/2804

Abstract: The invention concerns a radio frequency identification device (RFID) featuring an antenna (12) screen-printed on a fibrous support and a chip (10) connected to the connection terminals (17 and 19) of the antenna. According to the main characteristic of the invention, a thermoplastic layer (22) and a layer of paper (24) are laminated on the antenna support (20) so that the antenna and the chip are trapped in the thermoplastic and so that the device is resistant to water and humid environments.

Abstract translation: 本发明涉及一种射频识别装置（RFID），其特征在于丝网印刷在纤维载体上的天线（12）和连接到天线的连接端子（17和19）的芯片（10）。 根据本发明的主要特征，热塑性层（22）和纸层（24）层叠在天线支架（20）上，使得天线和芯片被捕获在热塑性塑料中，使得该装置是 耐水和潮湿的环境。

公开(公告)号：US06908786B2

公开(公告)日：2005-06-21

申请号：US10333022

申请日：2002-05-14

Applicant: Christophe Halope

Inventor： Christophe Halope

IPC: B42D15/10 ,  G06K19/07 ,  G06K19/077 ,  H05K1/03 ,  H05K1/16 ,  H05K1/18 ,  H05K3/20 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H05K3/207 ,  G06K19/07749 ,  H05K1/0313 ,  H05K1/165 ,  H05K1/185 ,  H05K1/187 ,  H05K2201/0129 ,  H05K2201/0284 ,  H05K2201/0376

Abstract: The invention concerns a manufacturing process for a contactless smart card (or ticket) which includes the following steps: a manufacturing process for an antenna consisting in screen-printing turns of an electrically conductive polymer ink onto a transfer paper sheet, and then subjecting said support to heat treatment in order to bake and polymerize said conductive ink, connection of a chip 14, provided with contacts, to the antenna 12, lamination consisting in making the transfer paper sheet integral with a layer of plastic material 16 which constitutes the support for the antenna, by hot press molding, in such a way that the screen-printed antenna and the chip are both embedded within the layer of plastic material, removal of the transfer paper sheet, and lamination of the card body onto the antenna support by welding at least one layer of plastic material (18, 20) by hot press molding on each side of the support.

Abstract translation: 本发明涉及一种用于非接触式智能卡（或机票）的制造过程，其包括以下步骤：用于将导电聚合物油墨的丝网印刷匝组合到转印纸上的天线的制造过程，然后对所述支撑体 为了烘烤和聚合所述导电油墨，将设置有触点的芯片14连接到天线12上，层叠包括将转印纸与一层塑料材料16成一体，该塑料材料层构成用于 天线，通过热压成型，使得丝网印刷天线和芯片都嵌入在塑料材料层内，去除转印纸，以及通过焊接将卡体贴合到天线支架上 至少一层塑料材料（18,20）通过热压成型在支撑体的每一侧上。

公开(公告)号：US06851618B2

公开(公告)日：2005-02-08

申请号：US10244028

申请日：2002-09-16

Applicant: Christophe Halope

Inventor： Christophe Halope

IPC: B42D15/10 ,  G06K19/07 ,  G06K19/077 ,  G06K19/06 ,  G06K19/00 ,  G06K19/02

CPC classification number: G06K19/07728 ,  G06K19/07743 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/0775 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A smart card including an antenna (18) on a support made of paper type fibrous material (12), two card bodies on each side of the support each consisting of at least one layer of plastic material having a low flow temperature, and an electronic module (26) featuring a chip connected to the antenna, the assembly made up of the antenna support and the two card bodies being welded together by hot-lamination under pressure. The support made of fibrous material includes at least one opening (14, 16) such that the plastic layers (23, 25) of the card body come into near perfect contact during the lamination operation, the opening forming a weld between the card bodies thus reinforcing the connection of the module.

Abstract translation: 一种智能卡，其包括在由纸型纤维材料（12）制成的支撑件上的天线（18），每个支架的每一侧上的两个卡体由至少一层具有低流动温度的塑料材料组成，以及电子 模块（26）具有连接到天线的芯片，由天线支架和两个卡体组成的组件通过在压力下的热层压而被焊接在一起。 由纤维材料制成的支撑体包括至少一个开口（14,16），使得卡片体的塑料层（23,25）在层压操作期间接近完美接触，因此开口在卡体之间形成焊接 加强模块的连接。

公开(公告)号：US07988059B2

公开(公告)日：2011-08-02

申请号：US12138796

申请日：2008-06-13

Applicant: Yannick Grasset ,  Nicolas Pangaud ,  Christophe Halope

Inventor： Yannick Grasset ,  Nicolas Pangaud ,  Christophe Halope

IPC: G06K19/06

CPC classification number: H01L23/48 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/07756 ,  H01L21/563 ,  H01L23/3171 ,  H01L23/552 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L2223/6677 ,  H01L2224/0554 ,  H01L2224/05554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/20752 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method for connecting an electronic chip (10) to contacts (47and 48) of an electric circuit, the chip having two conductive plates (31and 32) located on the last layer of the chip and at least one electromagnetic shielding layer, at least one of the plates (31or 32) being entirely covered with an electrical insulating layer (34). The method includes placing an adhesive dielectric material (40) on the circuit between the contacts (47, 48), to fix the electronic chip (10) relative to the circuit, positioning electronic chip (10) on the circuit so that conductive plates (31et 32) are opposite the contacts (47and 48), so as to create between the chip and the electric circuit at least one capacitive link made up of the conductive plate (31or 32), the electrically insulating layer and the contact (47or 48).

Abstract translation: 一种用于将电子芯片（10）连接到电路的触点（47和48）的方法，所述芯片具有位于芯片的最后层上的两个导电板（31和32）和至少一个电磁屏蔽层，至少一个 的板（31或32）完全被电绝缘层（34）覆盖。 该方法包括将粘合介电材料（40）放置在触头（47,48）之间的电路上，以相对于电路固定电子芯片（10），将电子芯片（10）定位在电路上，使得导电板 31et 32​​）与触点（47和48）相对，从而在芯片和电路之间产生由导电板（31或32），电绝缘层和触头（47或48）组成的至少一个电容链路， 。