Abstract:
PROBLEM TO BE SOLVED: To provide an electronic component which reduces the occurrence of splash more and is more inexpensive and reliable, and to provide a manufacturing method thereof. SOLUTION: The electronic component has: a metallic cap 2 having a flange; a base 1 having a flange and a metallic lead terminal 12; and an electronic element mounted on the base, and is airtightly sealed by covering the base with the cap and resistance-welding the flange of the cap to the flange of the base while the former abuts on the latter, wherein only electrolytic nickel plating 15 is formed at a metal part that includes a flange part on which the base of the cap abuts and a flange part on which the cap of the base abuts, the flange parts being in a surface of the cap and a surface of the base, and that is exposed on an internal surface and at least electroless nickel plating 16 is formed on a terminal exposed on an external surface. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a crystal oscillation device having stable electrical characteristics without frequency variations. SOLUTION: A pair of excited electrodes and drawing electrodes connected therewith are formed on a crystal oscillation element 2. The crystal oscillation element is bonded onto a package of a crystal oscillation device by a conductive resin adhesive material into which conductive filler is dispersed. A first conductive resin adhesive material S1 is formed on an electrode pad formed on the package. The crystal oscillation element is electrically conductively bonded onto the first conductive resin adhesive material by a second conductive resin adhesive material S2. The first conductive resin adhesive material is formed to be thinner than the second conductive resin adhesive material when viewed at a cross section. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a package for electronic components and a piezoelectric vibration device each having good characteristics by enlarging a ratio of storage space of electronic elements to outer dimension of the package, and by improving bonding strength of hermetic seal of the package and a cover. SOLUTION: A surface mounted quartz resonator is composed of a ceramic package 1 having a recess with an opening at the upper portion thereof, a quartz crystal vibration cone 3 which is a piezoelectric vibration cone to be housed in the package, and the cover 2 to be bonded to the opening of the package. An inner meniscus is formed on the bottom of the cover inside the package. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a package for a piezoelectric oscillation device which is low in costs and capable of taking an EMI countermeasure and improves the reliability of the connection of the package and a metallic cover. SOLUTION: A surface mounted quartz oscillator consists of a ceramic package 1 which has a rectangular paralelepiped shape as a whole and has a recessed part opening its upper part, a rectangular quartz vibrating plate 3 being a piezoelectric vibration element to be housed in the package and an inversely recessed metallic cover 2 to be connected with the opening part of the package. The opening end part 21 of the metallic cover 2 is mounted on the metallic layer 11 of the package to seal the part 21 airtight with a resin adhesive S2 in this state.
Abstract:
PURPOSE:To provide a piezoelectric vibrator with improved reliability for which an oscillation frequency does not differ depending on the connection direction of a terminal even when the vibrator is built in an oscillation circuit in the extremely small-sized piezoelectric vibrator. CONSTITUTION:Electrodes 31 and 32 for connection are provided parallelly in a lateral direction Y leaned on one side in a longitudinal direction Y on an insulated substrate 1. The electrode 32 for connection is conducted with a back surface electrode by a via 35 and a dummy electrode 38 of an area corresponding to a draw-around electrode 33 is extended near the other end of the longitudinal direction. The electrode 31 for connection is conducted through the draw-around electrode 33 and the via 34 with the back surface electrode 37. An excitation electrode is formed and a crystal vibrating plate 4 for which a pull-out electrode is pulled out to one end is electrically and mechanically connected with the electrodes for connection.
Abstract:
PROBLEM TO BE SOLVED: To provide a surface-mounted type crystal vibration device which can restrain the manufacturing cost and which can form a stable external terminal.SOLUTION: A tuning-fork type crystal vibrator 1 is configured by a columnar main body 1a and two lead terminals extending in parallel from the bottom face of the main body, and a pedestal 2 is a block body of a convex shape as a whole. The pedestal has a projection 21 of a convex shape and a flat part 20 lower than the projection on both sides of the projection. Electrodes made of metal film are formed from the central region of the pedestal 2 to a device end face 24. The electrodes are formed by connection electrodes 2a and 2b and a terminal electrode. The lead terminal 11 and 12 are connected respectively to the connection electrodes with the projection 21 of the pedestal 2 between the lead terminals.
Abstract:
PROBLEM TO BE SOLVED: To provide a piezoelectric vibration device capable of eliminating the unbalance of electrical characteristics such as capacitance due to the connecting direction of a piezoelectric vibration element and obtaining stable characteristics. SOLUTION: The piezoelectric vibration device is provided with a rectangular package main body 1 and the piezoelectric vibration element 3, first and second electrode pads closely arranged on one end side on the inner bottom surface of the package main body and first and second pull-out electrodes for leading the respective electrode pads out to first and second external terminals are formed, the piezoelectric vibration element is cantilevered on one end side of the piezoelectric vibration element, and a metal film region for frequency adjustment is formed on the other end side of the piezoelectric vibration element. On the second electrode pad 13, a capacitance adjusting electrode 13a for adjusting the difference of the capacitance from the respective electrode pads to the respective external terminals is formed. The capacitance adjusting electrode is formed at a position not extending to the metal film region for the frequency adjustment of the piezoelectric vibration element. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To inhibit the malfunction of a temperature testing device caused by the probe pin. SOLUTION: On the inspection part 54, two heads 542 for connecting with the terminal electrodes CR1 and CR2 of the terminal of each crystal oscillator CR for measuring the oscillation frequency of the crystal oscillator CR are provided. On each head 542, a pair of probe pins 543 is provided. Between the pair of probe pins 543 of each head 542 as indicated in Fig. 8, piano wires 544 are provided for inhibiting the pair of probe pins 543 from adhering to the crystal oscillators CR. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To prevent excessive standby time or excessive measuring time, i.e. to reduce process unit time in the test process for a piezoelectric oscillation device. SOLUTION: The temperature testing device 1 is an inline temperature testing device for testing the performance of the crystal oscillator CR while transferring the crystal oscillator CR along the X direction in one temperature bath 11. In the temperature testing device 1, the standby part 4 for temporally standing by the carrier C mounted with the crystal oscillator CR, and the measurement part 5 for measuring the oscillation frequency of the crystal oscillator CR at every temperature accompanied by the temperature change of the crystal oscillator CR are arranged along the X direction. The stand by part 4 and the measurement part 5 are provided in the one temperature bath 11. In the temperature bath 11 a first temperature region to a third temperature region of three temperature regions 12 to 14 are constituted along the X direction, each first temperature region to third temperature region 12-14 is provided with each of a first measurement part 51 to a third measurement part 53 of different set temperature. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To extend a mount area of a surface of a base on which the electronic components are mounted without disturbing downsizing. SOLUTION: The package 3 comprises the base 31 and a cover 32. The cover 32 comprises a folded flat plate of an L-shape including two faces. Further, a sealing film 33 made of a metallic material is formed to the lower side of the cover 32. The base 31 comprises a rectangular solid bottom part 34 and a wall part 35 formed along the three sides of the front side 341 of the bottom part 34 and no wall part 35 is formed on one side 342 for forming an opening. A mount region 36 for mounting a crystal vibration chip 2 is formed to the front side 341 of the base 31. A joining region 37 for joining with the cover 32 is formed to a wall surface 351 of the wall part 35 of the base 31 and one side face 311 of the bottom part 34. The joining region 37 is formed with a metallic film 38 made of a metallic material. COPYRIGHT: (C)2006,JPO&NCIPI