公开(公告)号：JP2002158557A

公开(公告)日：2002-05-31

申请号：JP2000352143

申请日：2000-11-20

Applicant: DAISHINKU CORP

Inventor： NAKADA HOZUMI ,  NAKAJIMA MIKIO

IPC: H03H9/02 ,  H03H9/10

Abstract: PROBLEM TO BE SOLVED: To improve the holding strength of a more miniaturized piezoelectric vibrating element, without obstructing the vibration of the piezoelectric vibrating element. SOLUTION: In the holding structure for piezoelectric vibrating device, with which a piezoelectric vibrating element 3 provided with an excitation electrode and a lead electrode is electrically connected via a conductive bonding member to an insulated substrate 1, formed with a extraction electrode 21 conducted with an external circuit and sealed airtightly by a lid body 4, the area of smaller vibration displacement between the extraction electrode and the lead electrode of the piezoelectric vibrating element is electrically connected by a conductive resin adhesive 51 containing conductive fillers and mechanically bonded by a resin adhesive 52 which does not contain conductive fillers, composed of the same material as the conductive resin adhesive over an area, which includes the application area of the conductive resin adhesive, wider tan the application area.

公开(公告)号：JP2000236035A

公开(公告)日：2000-08-29

申请号：JP29423599

申请日：1999-10-15

Applicant: DAISHINKU CORP

Inventor： NAKADA HOZUMI ,  NAKAJIMA MIKIO ,  IIZUKA MINORU ,  MIURA YASUNORI

IPC: H01L23/02 ,  H03H9/02 ,  H03H9/10 ,  H03H9/19

Abstract: PROBLEM TO BE SOLVED: To offer a piezoelectric vibration device and a package for an electronic component, which can maintain the reliability of hermetic seal at a practicable level and improve the electrical performance of the electronic component even if the package is microminiaturized. SOLUTION: A ceramic package 1 comprises a ceramic base 10 and a frame- shaped metal layer formed on the bank of the concave base. The metal layer is composed of a metalized layer 11 made of tungsten, etc., and a first metal film layer 12 formed on the top of the metalized layer 11. A metal lid 2, which is to be hermetically sealed, has a frame-shaped second metal film layer 21 which is mated with the first frame-shaped metal film layer 12, at the bottom face of a metal base 20 made of covar, etc. The second metal film layer 21 is made of silver solder, etc. The metal lid 2 and the metal film layers of the ceramic package 1 are bonded by seam welding.

公开(公告)号：JP2000195978A

公开(公告)日：2000-07-14

申请号：JP37036498

申请日：1998-12-25

Applicant: DAISHINKU CORP

Inventor： NAKADA HOZUMI ,  NAKAJIMA MIKIO ,  IIZUKA MINORU

IPC: H01L23/02

Abstract: PROBLEM TO BE SOLVED: To improve reliability of a sealing, when heating locally by a high-frequency power the blazing portion of a metallic cover to a ceramic package, by passing a gas along the central portion of the metal cover, and by lowering relatively the temperature of its central portion than that of its peripheral portion which contributes to airtight joining to the ceramic package. SOLUTION: In an annular high-frequency coil 5 provided in a high-frequency heating apparatus, there is formed a receiving platform 7 made of mica, etc., which serves as one portion of an suction apparatus by using its hollow inside as an sucking tube 71. The receiving platform 7 is formed of a material unheated by high-frequency heating to make avoidable the waste of an excess energy. A metal cover 2 is mounted on the top surface of the receiving platform 7, and further a ceramic package 1 is mounted on the metallic cover 2 so that an electronic element 3 is stored in it airtightly. Then, while sucking the metallic cover 2 in the direction shown by an arrow by the sucking tube 71 of the receiving platform 7, the high-frequency coil 5 is subjected to current application for brazing the cover 2 to the package 1 by the high-frequency heating. At this time, since the metal cover 2 is sucked by the suction tube 71, its central portion is cooled to suppress the vaporization of a brazing material.

公开(公告)号：JPH0774581A

公开(公告)日：1995-03-17

申请号：JP23889493

申请日：1993-08-30

Applicant: DAISHINKU CORP

Inventor： NAKAJIMA MIKIO ,  IIZUKA MINORU

IPC: H03H9/02 ,  H03H9/13

Abstract: PURPOSE:To provide a piezoelectric vibrator with improved reliability for which an oscillation frequency does not differ depending on the connection direction of a terminal even when the vibrator is built in an oscillation circuit in the extremely small-sized piezoelectric vibrator. CONSTITUTION:Electrodes 31 and 32 for connection are provided parallelly in a lateral direction Y leaned on one side in a longitudinal direction Y on an insulated substrate 1. The electrode 32 for connection is conducted with a back surface electrode by a via 35 and a dummy electrode 38 of an area corresponding to a draw-around electrode 33 is extended near the other end of the longitudinal direction. The electrode 31 for connection is conducted through the draw-around electrode 33 and the via 34 with the back surface electrode 37. An excitation electrode is formed and a crystal vibrating plate 4 for which a pull-out electrode is pulled out to one end is electrically and mechanically connected with the electrodes for connection.

公开(公告)号：JP2000195977A

公开(公告)日：2000-07-14

申请号：JP37027498

申请日：1998-12-25

Applicant: DAISHINKU CORP

Inventor： NAKADA HOZUMI ,  NAKAJIMA MIKIO ,  IIZUKA MINORU

IPC: H01L23/02

Abstract: PROBLEM TO BE SOLVED: To provide a package for an electronic component and a manufacture thereof, wherein the reliability in airtighness is maintained satisfactorily and the functions of the electronic component will not deteriorate even is sulyicted to miniaturization. SOLUTION: There are provided a ceramic package 1, having a concave part of which upper part opens, a quartz oscillating board 3 which is an electronic element housed in the package, and a metal lid 2 bonded to the opening of the package. The ceramic package and the metal lid are bonded by first spot resistance welding or laser welding and then by soldering the entire surface.

公开(公告)号：JPH11111876A

公开(公告)日：1999-04-23

申请号：JP28787697

申请日：1997-10-03

Applicant: DAISHINKU CORP

Inventor： NAKAJIMA MIKIO ,  IIZUKA MINORU

IPC: B23K26/21 ,  H01L23/02 ,  H03H9/02 ,  H03H9/19 ,  B23K26/00

Abstract: PROBLEM TO BE SOLVED: To improve an yield at the time of air-tight sealing, and to improve reliability on an air-tight surface in a package for an electronic component for performing air-tight sealing by electron beam welding or laser beam welding. SOLUTION: A package is composed of a ceramic package 1 of a recessed shape whose upper part is opened, a crystal vibrating plate 3 which is an electronic component element housed in the ceramic package 1 and a metallic lid 2 joined to the opening part of the ceramic package 1 and the ceramic package 1 of the recessed shape is composed of a ceramic base body 10, a metallization layer 11 composed of tungsten or the like formed at the opening part around the recessed shape and a plating layer formed at the upper part of the metallization layer. The upper surface of the metallization layer 11 is flattened so as to turn a flat degree (t) to be less than 5 μm.

公开(公告)号：JPH09199972A

公开(公告)日：1997-07-31

申请号：JP3002096

申请日：1996-01-23

Applicant: DAISHINKU CORP

Inventor： NAKADA HOZUMI ,  NAKAJIMA MIKIO ,  IIZUKA MINORU

IPC: H03H9/02 ,  H03H9/10 ,  H03H9/19

Abstract: PROBLEM TO BE SOLVED: To provide a surface mount piezoelectric vibrator with higher reliability in which adhesion between an insulation board and a piezoelectric plate is improved. SOLUTION: An area (electrode forming part) coupled electromechanically and an area (non-electrode part such as notch and cut-out) coupled mechanically with piezoelectric plate connection electrodes 3A, 4A of an insulation board and insulation board connection electrodes 52A, 53A of a piezoelectric board are formed, and the electrode forming part and the non-electrode part are adhered by a conductive adhesion material.

公开(公告)号：JPH04367111A

公开(公告)日：1992-12-18

申请号：JP16927191

申请日：1991-06-13

Applicant: DAISHINKU CORP

Inventor： SATO SHUNSUKE ,  NAKAJIMA MIKIO

IPC: H03H3/08 ,  H03H3/02 ,  H03H9/09 ,  H03H9/10

Abstract: PURPOSE:To obtain a piezoelectric oscillator and its producing method with good productivity by accurately connecting a supporting body to the prescribed position of a ceramic substrate without damaging the spring action of the supporting body using a joining material. CONSTITUTION:The piezoelectric oscillator is composed of a ceramic substrate 1 with metal wirings 21 and 22, at least two metallic supporting bodies 31 and 32 having the junction part with the metallic wire and the mounting part of a piezoelectric diaphragm, a piezoelectric oscillating plate 4 in which the exciting electrodes are formed on the surface, and a cap 5 covering the piezoelectric oscillating plate etc. The junction between the metallic wiring and the supporting body is performed by laser beam welding. As the method for production, a pair of supporting bodies are integrated, continuous lead frames are prepared, and plural ceramic substrate with metallic wiring are arranged while keeping an equal space with a pair of supporting bodies. The supporting body and the metallic wiring are jointed by the laser beam, and the junction between the supporting body and the frame is disconnected.

公开(公告)号：JP2008289055A

公开(公告)日：2008-11-27

申请号：JP2007134143

申请日：2007-05-21

Applicant: Daishinku Corp ,  株式会社大真空

Inventor： NAKAJIMA MIKIO ,  ONISHI MANABU

IPC: H03H3/02 ,  H03H9/02 ,  H03H9/10

Abstract: PROBLEM TO BE SOLVED: To provide a sheet substrate which can be cut by stable dicing, and a method of manufacturing a piezoelectric vibration device employing the relevant sheet substrate. SOLUTION: In a sheet substrate 11, a plurality of housing units 3 and bases 2 are integrally formed in a matrix shape, each base 2 comprising an annular frame body 4 which surrounds the relevant housing unit 3 and on an upper surface of which, a metal film layer 41 is formed. The relevant sheet substrate 11 includes, between adjacent bases, a wiring pattern P1 electrically connecting the bases 2 with each other and a dicing line L for dividing the bases 2 into individuals. Then, no wiring pattern P1 is formed at least on front and rear sides of the dicing line L1. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供可以通过稳定切割切割的片状基板，以及使用该片基板的压电振动装置的制造方法。 解决方案：在片状基板11中，多个壳体单元3和基座2一体地形成为矩阵形状，每个基座2包括围绕相关的壳体单元3的环形框架体4和在相应的壳体单元3的上表面 其形成金属膜层41。 相关的片基板11在相邻的基部之间包括将基部2彼此电连接的布线图案P1和用于将基部2分割为个体的切割线L. 然后，至少在切割线L1的前侧和后侧不形成布线图案P1。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2007318209A

公开(公告)日：2007-12-06

申请号：JP2006142471

申请日：2006-05-23

Applicant: Daishinku Corp ,  株式会社大真空

Inventor： NAKAJIMA MIKIO

IPC: H03H3/04 ,  H01L23/02 ,  H03H9/02 ,  H03H9/10

Abstract: PROBLEM TO BE SOLVED: To satisfy a demand for a lead-free surface mounted piezoelectric vibrating device, and to suppress an adverse effect due to gas inside a package, without resulting in fluctuation in the frequency deviation among finished products.
SOLUTION: The surface mounted piezoelectric vibrating device is provided with a piezoelectric vibrator 3, a container part for mounting the piezoelectric vibrator therein, an insulating substrate 1 where a metallized layer is formed in an upper side around the container part, and a cover 2 for attaining hermetically sealing by being brazed to the metallized layer of the insulating substrate, wherein the cover comprises a lead-free sealing brazing material, a metallic base material 21, and an optical transparent member 22, the sealing brazing material is formed on a sealing face of the metallic base material, a through-window is formed in the metallic base material at a position corresponding to a position of a frequency adjustment part of the piezoelectric vibrator, and the optical transparent member is fitted to the metallic base material through heat melt bonding in such a state that the through-window is covered by the optical transparent member.
COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：为了满足对无铅表面安装压电振动装置的需求，并且抑制由于封装内的气体引起的不利影响，而不会导致成品之间的频率偏差的波动。 解决方案：表面安装的压电振动装置设置有压电振动器3，用于将压电振动器安装在其中的容器部分，在容器部分周围的上侧形成有金属化层的绝缘基板1， 盖2，用于通过钎焊到绝缘基板的金属化层来实现气密密封，其中盖包括无铅密封钎焊材料，金属基材21和光学透明构件22，密封钎焊材料形成在 金属基材的密封面，在对应于压电振子的频率调节部的位置的位置处，在金属基材中形成贯通窗，并且光透明构件通过 在通透窗被光学透明构件覆盖的状态下进行热熔接合。 版权所有（C）2008，JPO＆INPIT